Shielded module
A module 1 a includes a multilayer wiring board 2 , a component 3 that is mounted on a main surface 2 a of the multilayer wiring board 2 , a sealing-resin layer 4 that is laminated on the main surface 2 a of the multilayer wiring board 2 , and a resin coating layer 7 that coats a surface of the sealing-resin layer 4 . The resin coating layer 7 includes a shield film 5 and outer electrodes 6 , and opposite surfaces 6 a of the outer electrodes 6 and an opposite surface 5 a of the shield film 5 are formed on the same plane. The module 1 a can be connected to, for example, an external antenna without using a wiring electrode of a mother substrate, and thus, signal loss can be suppressed.
1. A module comprising:
a wiring board;
a component mounted on a main surface of the wiring board;
a sealing-resin layer laminated on the main surface of the wiring board and sealing the component; and
a resin coating layer laminated on the sealing-resin layer so as to coat a surface of the sealing-resin layer,
wherein the resin coating layer includes a shield film and an outer electrode electrically connected to the wiring board, and
wherein the outer electrode has a first surface and a second surface opposite to the first surface and facing to the sealing-resin layer, and the shield film has a first surface and a second surface opposite to the first surface and facing to the sealing-resin layer, and wherein the first surface of the outer electrode is substantially flush with the first surface of the shield film.
2. The module according to claim 1 ,
wherein the shield film further includes an overlap portion disposed between the outer electrode and the sealing-resin layer and overlapping with the outer electrode when viewed in a direction perpendicular to the first surface of the outer electrode.
3. The module according to claim 1 ,
wherein an insulating material is disposed in a gap between the outer electrode and the shield film.
4. The module according to claim 1 ,
wherein an insulating material is disposed so as to cover a peripheral edge portion of the first surface of the outer electrode.
5. The module according to claim 1 ,
wherein the outer electrode is connected to an antenna.
6. The module according to claim 2 ,
wherein an insulating material is disposed in a gap between the outer electrode and the shield film.
7. The module according to claim 2 ,
wherein the outer electrode is connected to an antenna.
8. The module according to claim 3 ,
wherein the outer electrode is connected to an antenna.
9. The module according to claim 4 ,
wherein the outer electrode is connected to an antenna.
10. A module comprising:
a wiring board;
a component mounted on a main surface of the wiring board;
a sealing-resin layer laminated on the main surface of the wiring board and sealing the component; and
a resin coating layer laminated on the sealing-resin layer so as to coat a surface of the sealing-resin layer,
wherein the resin coating layer includes a shield film and an outer electrode electrically connected to the wiring board, and
wherein the outer electrode has a first surface and a second surface opposite to the first surface and facing to the sealing-resin layer, and the shield film has a first surface and a second surface opposite to the first surface and facing to the sealing-resin layer, and wherein the first surface of the outer electrode is located closer to the sealing-resin layer than the first surface of the shield film.