Rectangular via for ensuring via yield in the absence of via redundancy
A rectangular via extending between interconnects in different metallization levels can have a planform with a width equal to the width of the interconnects and a length equal to twice the width and can be aligned along a long dimension with a length of the upper interconnect. In an integrated circuit layout, the planform can be centered over the width of the lower interconnect, allowing for misalignment during fabrication while maintaining a robust electrical connection. The bottom of the via may be aligned with an upper surface of the lower interconnect or may include portions below the lower interconnect's upper surface. Fewer adjacent routing tracks are blocked by use of the rectangular via than would be blocked using redundant square vias, while ensuring reliability of the electrical connection despite potential misalignment during fabrication.
1. An integrated circuit structure, comprising:
a lower interconnect within a first metallization level;
an upper interconnect within a second metallization level above the first metallization level; and
a via electrically connecting the upper and lower interconnects, the via having a rectangular planform with a long dimension aligned with a length of the upper interconnect, wherein:
a width of the rectangular planform equals a width of the upper interconnect; and
the long dimension of the rectangular planform is twice a width of the lower interconnect such that the rectangular planform extends past edges of the lower interconnect.
2. The integrated circuit structure of claim 1 , wherein the via has sloped sidewalls.
3. The integrated circuit structure of claim 1 , wherein a bottom of the via is aligned with an upper surface of the lower interconnect.
4. The integrated circuit structure of claim 1 , wherein a bottom of the via includes portions below an upper surface of the lower interconnect.
5. The integrated circuit structure of claim 1 , wherein the upper interconnect extends past a width of the lower interconnect by at least an amount by which the long dimension of the rectangular planform extends past the width of the lower interconnect.
6. The integrated circuit structure of claim 1 , wherein the via extends below a surface of the lower interconnect where the rectangular planform extends past edges of the lower interconnect.
7. The integrated circuit structure of claim 1 , wherein the lower interconnect and the upper interconnect are perpendicular to each other.
8. The integrated circuit structure of claim 7 , wherein the upper interconnect extends past opposite edges of the via.
9. An integrated circuit structure, comprising:
a lower interconnect within a first metallization level, the lower interconnect having a length extending in a first direction;
an upper interconnect within a second metallization level above the first metallization level, the upper interconnect having a length extending in a second direction perpendicular to the first direction; and
a via electrically and physically connecting the upper and lower interconnects, the via having a rectangular planform with a long dimension aligned with a length of the upper interconnect in the second direction, wherein:
a width of the rectangular planform equals a width of the upper interconnect; and
the long dimension of the rectangular planform is twice a width of the lower interconnect such that the rectangular planform extends past edges of the lower interconnect in the second direction.
10. The integrated circuit structure of claim 9 , wherein the via extends below a surface of the lower interconnect where the rectangular planform extends past edges of the lower interconnect.
11. The integrated circuit structure of claim 9 , wherein the upper interconnect extends past opposite edges of the via in the second direction.
12. The integrated circuit structure of claim 9 , wherein the via has sloped sidewalls.
13. An integrated circuit structure, comprising:
a lower interconnect within a first metallization level, the lower interconnect having a length extending in a first direction and a shorter width extending in a second direction perpendicular to the first direction;
an upper interconnect within a second metallization level above the first metallization level, the upper interconnect having a length extending in the second direction and a shorter width extending in the first direction; and
a via electrically and physically connecting the upper and lower interconnects, the via having a height extending from the lower interconnect to the upper interconnect, a length, and a width, wherein the length of the via is aligned with the length of the upper interconnect in the second direction, wherein:
the width of the via equals the width of the upper interconnect; and
the length of the via extends past opposite edges of the lower interconnect in the second direction.
14. The integrated circuit structure of claim 13 , wherein the via extends below a surface of the lower interconnect where the via extends past opposite edges of the lower interconnect.
15. The integrated circuit structure of claim 13 , wherein the upper interconnect extends past opposite edges of the via in the second direction.
16. The integrated circuit structure of claim 13 , wherein the via has sloped sidewalls.