Fan-out package and methods of forming thereof

1. A method comprising:

depositing a molding compound laterally encapsulating a chip;

depositing a first dielectric layer overlying the molding compound and the chip;

patterning a first opening in the first dielectric layer, the first opening exposing a contact of the chip;

after patterning the first opening, depositing a first metallization layer over the first dielectric layer and in the first opening, a first portion of the first metallization layer overlying the first dielectric layer, a second portion of the first metallization layer extending through the first dielectric layer and electrically coupled to the contact, wherein the second portion of the first metallization layer has a flat top;

depositing a second dielectric layer overlying the first metallization layer and the first dielectric layer;

patterning a second opening in the second dielectric layer, the second opening exposing the first metallization layer; and

depositing a second metallization layer in the second opening, the second metallization layer having a third portion within sidewalls of the second opening, the third portion having a top surface with an angled portion adjacent each sidewall of the second opening of the second dielectric layer.

2. The method of claim 1 , wherein depositing the first metallization layer comprises: plating a material of the first metallization layer in the first opening at a plating rate greater than 1 μm per minute.

3. The method of claim 1 , wherein the second opening is patterned directly over the second portion of the first metallization layer.

4. The method of claim 1 , further comprising:

prior to depositing the molding compound, depositing a passivation layer over the contact of the chip; and

exposing the contact of the chip through the passivation layer, wherein the molding compound extends vertically higher than an upper surface of the passivation layer.

5. The method of claim 1 , further comprising:

depositing a first seed layer in the first opening prior to depositing the first metallization layer, the first seed layer extending along an upper surface of the first dielectric layer.

6. The method of claim 1 , wherein the first opening has a width 2 to 20 times greater than its height.

7. The method of claim 1 , wherein depositing the first metallization layer further comprises, extending the flat top of the second portion to protrude above an upper surface of the first dielectric layer.

8. A method comprising:

forming a molding compound laterally encapsulating a chip, a contact pad of the chip being exposed through the molding compound;

depositing a first dielectric layer over the molding compound and the chip;

patterning a first opening in the first dielectric layer, the first opening exposing the contact pad, the first opening having a width 2 to 20 times greater than its height;

forming a first seed layer in the first opening;

controlling a plating solution and plating additives to plate a first conductive layer on the first seed layer with a plating rate greater than 1 μm per minute;

forming a second dielectric layer over the first conductive layer and the first dielectric layer;

forming a second opening in the second dielectric layer exposing the first conductive layer over the first opening; and

forming a second conductive layer overlying the second dielectric layer and physically contacting the first conductive layer through the second opening.

9. The method of claim 8 , wherein forming the second conductive layer uses a deposition technique different than that used in plating the first conductive layer, the deposition technique comprising atomic layer deposition, sputtering, or physical vapor deposition.

10. The method of claim 8 , wherein plating the first conductive layer comprises:

plating a first portion of the first conductive layer in the first opening; and

plating a second portion of the first conductive layer adjacent the first opening over an upper surface of the first dielectric layer.

11. The method of claim 10 , wherein plating the first conductive layer further comprises:

extending an upper surface of the first portion of the first conductive layer to be vertically higher than an upper surface of the first dielectric layer.

12. The method of claim 11 , wherein plating the first conductive layer further comprises:

laterally extending a flat upper surface of the first portion beyond a width of the first opening.

13. The method of claim 8 , further comprising:

forming a solder bump on the second conductive layer; and

depositing a protection layer over the second conductive layer and around a portion of the solder bump.

14. The method of claim 8 , wherein forming the second opening in the second dielectric layer further comprises:

forming the second opening directly over the contact pad.

15. A method comprising:

forming a molding compound laterally encapsulating a chip, a contact pad of the chip being exposed through the molding compound;

depositing a first dielectric layer over the molding compound and the chip;

patterning a first opening in the first dielectric layer, the first opening exposing the contact pad;

forming a first conductive layer overlying the first dielectric layer and filling the first opening, wherein the first conductive layer in the first opening has a flat surface, wherein the flat surface is vertically further from the chip than a top surface of the first dielectric layer;

forming a second dielectric layer over the first conductive layer and the first dielectric layer;

forming a second opening in the second dielectric layer exposing the first conductive layer over the first opening; and

forming a second conductive layer overlying the second dielectric layer and physically contacting the first conductive layer through the second opening.

16. The method of claim 15 , wherein forming the first conductive layer comprises: plating a material of the first conductive layer in the first opening at a plating rate greater than 1 μm per minute.

17. The method of claim 15 , wherein the first opening has a width to height ratio of 2 to 20.

18. The method of claim 15 , wherein the flat surface of the first conductive layer extends beyond a width of the first opening, wherein the flat surface of the first conductive layer interfaces with an angled portion of the first conductive layer outside the first opening.

19. The method of claim 15 , further comprising:

forming a solder bump over the second conductive layer; and

depositing a protection layer over the second conductive layer and around a lower portion of the solder bump.

20. The method of claim 15 , wherein second opening is patterned directly over the contact pad.