Single plate heat radiation device and method
Disclosed are a single plate heat radiation device and a method, and the device includes: a single plate heat radiator, a single plate, a first shielding plate having a panel portion, and a second shielding plate configured for heat radiating. A boss is provided on the second shielding plate. The boss is connected to the single plate radiator through an opening in the single plate and is configured for conducting the heat collected from the single plate by the single plate radiator to the second shielding plate. By means of the present invention, the problem of poor heat radiating effect in the related technology, caused by limited heat radiating area for convective heat radiating and limited heat radiating path for conductive heat radiating, is solved, and thereby the effects of increased heat radiating area and increased heat radiating path are achieved.
1. A heat radiating device for a single board, comprising:
a single board radiator,
a single board, and
a first metal shielding plate and a second metal shielding plate radiator both serving as mechanical support and electromagnetic shielding for the single board, wherein:
the first metal shielding plate has a panel portion,
the first metal shielding plate and the second metal shielding plate radiator are fixedly connected to the single board, respectively,
the second metal shielding plate radiator is also configured for heat radiation,
the second metal shielding plate radiator is structurally or electrically isolated from the first metal shielding plate,
a boss is provided on the second metal shielding plate radiator,
the boss is connected to the single board radiator through an opening in the single board, and
the boss is configured to conduct heat collected from the single board by the single board radiator to the second metal shielding plate radiator.
2. The device according to claim 1 , wherein:
the boss is connected to the single board radiator through a heat-conducting component, and
the heat-conducting component comprises a heat-conducting rubber gasket or silicone grease.
3. The device according to claim 1 , wherein:
a heat averaging medium is set on the second metal shielding plate radiator,
the heat averaging medium is configured to diffuse the heat, which is conducted to the second metal shielding plate radiator through the boss, to the whole second metal shielding plate radiator, and
the heat averaging medium comprises a heat tube embedded in the second metal shielding plate radiator, or
the heat averaging medium comprises a graphite film attached to the second metal shielding plate radiator.
4. The device according to claim 1 , wherein the first metal shielding plate and the second metal shielding plate radiator are fixedly connected to the single board through a screw hole for fixing, respectively.
5. The device according to claim 1 , wherein a solder mask copper area with a heat radiating hole on a back of the single board and the second metal shielding plate radiator are interconnected through a heat-conducting rubber gasket or silicone grease.
6. A heat radiating method for a single board, comprising:
providing a first metal shielding plate and a second metal shielding plate radiator both serving as mechanical support and electromagnetic shielding for a single board, wherein:
the first metal shielding plate has a panel portion,
the second metal shielding plate radiator is also configured for heat radiation, and
a boss is provided on the second metal shielding plate radiator;
collecting, by a single board radiator, heat radiated from the single board; and
conducting, by the boss, the heat collected by the single board radiator to the second metal shielding plate radiator, wherein:
the second metal shielding plate radiator is structurally or electrically isolated from the first metal shielding plate,
the boss is connected to the single board radiator through an opening in the single board, and
the first metal shielding plate and the second metal shielding plate radiator are fixedly connected to the single board, respectively.
7. The method according to claim 6 , wherein:
conducting, by the boss, the heat collected by the single board radiator to the second metal shielding plate radiator comprises conducting the heat through a heat-conducting component, and
the heat-conducting component comprises a heat-conducting rubber gasket or silicone grease.
8. The method according to claim 6 , further comprising:
diffusing, by a heat averaging medium set on the second metal shielding plate radiator, the heat conducted to the second metal shielding plate radiator through the boss to the whole second metal shielding plate radiator, wherein:
the heat averaging medium comprises a heat tube embedded in the second metal shielding plate radiator, or
the heat averaging medium comprises a graphite film attached to the second metal shielding plate radiator.
9. The method according to claim 6 , wherein conducting the heat, which is radiated from a heat radiating hole on a back of the single board, to the second metal shielding plate radiator in a manner of interconnecting a solder mask copper area with the heat radiating hole on the back of the single board and the second metal shielding plate radiator through a heat-conducting rubber gasket or silicone grease.