Nail polish formulation

1. A nail polish composition, comprising:

a first mixture component which is substantially 45% by weight of the total composition, consisting of one or more oligomers, from a group of oligomers consisting of: Di-HEMA Trimethylhexyl Dicarbamate, and, Methacrylic Acid2-[[[[(5-Isocyanato-1,3,3-Trimethylcyclohexyl) Methyl]Amino]Carbonyl]Oxy]Ethyl Ester;

a second mixture component, which is substantially 25.7% by weight of the total composition, consisting of one or more monomers, from a group of monomers consisting of: 2 Hydroxypropyl Methacrylate, 2 Hydroxy Ethyl Methacrylate, and Pyromellitic glycerol dimethacrylate;

a third mixture component, which is substantially 19% by weight of the total composition, consisting of one or more cure accelerators, from a group of cure accelerators, consisting of: 2,4,6-Trimethyl-Benzoyl-Diphenyl phosphine oxide, 1-Hydroxy Cyclohexexyl Phenyl Keytone, and 2 Hydroxy-2-methylpropiophenone;

a fourth mixture component, which is substantially 5.5% by weight of the total composition, consisting of one or more adhesion enhancers, from a group of adhesion enhancers, consisting of: Silicone acrylate polyether, and Triethylene Glycol Dimethacrylate;

a fifth mixture component, which is substantially 1.8% by weight of the total composition, consisting of one or more fluid spread enhancers, from a group of spread enhancers, consisting of: Alkyl Quaternary Ammonium Clay, and Treated Silica;

an antioxidant comprising Butylated Hydroxy Toluene at a concentration of substantially 1% by weight of the total composition; and

a resin comprising Cellulose Acetate Butyrate, at a concentration of substantially 2% by weight.

2. The nail composition of claim 1 wherein

Said first mixture component includes as a weight of the total composition:

said Di_HEMA Trimethylhexyl Dicarbamate Between 5% and 40%;

said METHACRYLIC ACID2-[[[[(5-ISOCYANATO-1,3,3-TRIMETHYLCYCLOHEXYL) METHYL]AMINO]CARBONYL]OXY]ETHYL ESTER, Between 5% and 25%;

said second mixture component includes as a weight of the total composition:

said Hydroxypropyl Methacrylate between 5% and 25.7%

said 2 Hydroxy Ethyl Methacrylate between 3% and 25.7%

said Pyromellitic glycerol dimethacrylate between 0.1% and 25.7%;

said third mixture component includes as a weight of the total composition:

said TrimethylBenzoil Diphenyl Phosphine Oxide between 1% and 19%;

said Hydroxy Cyclohexexyl Phenyl Keytone between 1% and 19%;

said 2 Hydroxy-2-methylpropiophenone between 1% and 19%;

said fourth mixture component includes as a weight of the total composition:

said Silicone polyether acrylate 0.5%;

said Triethylene Glycol Dimethacrylate 5%; and

said fifth mixture component includes as a weight of the total composition:

said Alkyl Quaternary Ammonium Clay 0.8%

said Treated Silica 1%.

3. A nail polish composition, comprising:

oligomers by weight, of the composition, comprising:

Di_HEMA Trimethylhexyl Dicarbamate 30%;

METHACRYLIC ACID2-[[[[(5-ISOCYANATO-1,3,3-TRIMETHYLCYCLOHEXYL) METHYL]AMINO]CARBONYL]OXY]ETHYL ESTER 15%;

monomers by weight of the total composition, comprising:

Hydroxypropyl Methacrylate 15%;

2 Hydroxy Ethyl Methacrylate 10.2%;

Pyromellitic glycerol dimethacrylate 0.5%;

cure Accelerators by weight, of the composition, comprising:

TrimethylBenzoil Diphenyl Phosphine Oxide 5%;

Hydroxy Cyclohexexyl Phenyl Keytone 4%;

2 Hydroxy-2-methylpropiophenone 10%;

adhesion enhancers by weight of the total composition, comprising:

Silicone polyether acrylate 0.5%

Triethylene Glycol Dimethacrylate 5%

fluid spread enhancers by weight of the total compositon comprising:

Alkyl Quaternary Ammonium Clay 0.8%;

Treated Silica 1%;

Butylated Hydroxy Toluene 1% by weight of the total compositon; and

cellulose acetate butyrate 2% by weight of the total compositon.