IP Library › Granted Patent US 10,748,696
Granted Patent B2
US 10,748,696 · App. 15/713,380 · Granted Aug 18, 2020

Electronic passive component, method for manufacturing electronic passive component, and apparatus for manufacturing electronic passive component

Inventors: Yuji Shibuya (Takasaki, JP); Kazuhiko Otsuka (Tabasaki, JP); Tetsuya Oga (Takasaki, JP)
Assignee: TAIYO YUDEN CO., LTD.
H01F27/255H01F17/045H01F27/00H01F27/2823H01F27/29H01F41/02
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Quick Facts
Patent No.
US 10,748,696
App. No.
15/713,380
Granted
Aug 18, 2020
Kind
B2
Abstract

An electronic component includes a member with marking having at least one marking area to be processed digitally, as well as a member other than the member with marking. The marking allows for tracing the production history of individual electronic components.

Claims (15)

1. A method for manufacturing an electronic component including a member with marking, as a part of the electronic component, the marking being digitally processable and containing process/product information and being configured directly on a surface of the member in at least one making area, and a member other than the member with marking, the method comprising:

a marking step to provide a marking to be digitally processed on at least one member constituting the electronic component, to form a member with marking;

a member-data recording step to gather and record member data relating to a function of the member with marking; an assembly processing step to assemble other members constituting the electronic component onto the member with marking; and

an assembly-data recording step to gather and record assembly data relating to a function after the assembly processing.

2. A method for manufacturing an electronic component including a member with marking, as a part of the electronic component, the marking being digitally processable and containing process/product information and being configured directly on a surface of the member in at least one making area, and a member other than the member with marking, the method comprising:

a marking step to provide a marking to be digitally processed on at least two or more members constituting the electronic component, to form members with marking;

a member-data recording step to gather and record member data relating to functions of the members with marking; and

a processing recording step to adjust processing conditions based on the member data, to process the members with marking according to the adjusted processing conditions, and to record the processing conditions in association with the members.

3. A method for manufacturing an electronic component according to claim 1 , wherein:

the electronic component is a coil component;

the members with marking are a drum core and a sleeve core; and

the method for manufacturing an electronic component further comprises:

a referencing step to reference member data of the drum core and member data of the sleeve core;

a screening step to screen a combination of the drum core and the sleeve core based on the member data, in order to produce a coil component that would have desired electrical characteristics; and

a processing step to assemble the drum core and the sleeve core.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2017
From: SHIBUYA, YUJI; OTSUKA, KAZUHIKO; OGA, TETSUYA
To: TAIYO YUDEN CO., LTD.
Reel/Frame 044237/0535 →
Priority Claims (1)
JP 2016-193536 · Sep 30, 2016 · national
Continuity (1)
Related Publication 20180096775A1 · Apr 5, 2018
Cited By (1)
US 12,488,934