Protective layer for contact pads in fan-out interconnect structure and method of forming same
A method includes providing a die having a contact pad on a top surface and forming a conductive protective layer over the die and covering the contact pad. A molding compound is formed over the die and the conductive protective layer. The conductive protective layer is exposed using a laser drilling process. A redistribution layer (RDL) is formed over the die. The RDL is electrically connected to the contact pad through the conductive protective layer.
1. A method comprising:
forming a contact pad over a substrate;
forming a passivation layer over the substrate and the contact pad;
patterning the passivation layer to form an opening in the passivation layer, the opening exposing a top surface of the contact pad;
forming a conductive protective layer in the opening, wherein forming the conductive protective layer comprises:
depositing a first conductive material in the opening, a sidewall of the first conductive material being in physical contact with a sidewall of the passivation layer; and
depositing a second conductive material different from the first conductive material over the first conductive material and the passivation layer, the second conductive material being in physical contact with a top surface of the passivation layer, a portion of the second conductive material laterally extending beyond an outermost sidewall of the first conductive material in a cross-sectional view at the end of depositing the second conductive material:
encapsulating the substrate and the conductive protective layer in a molding compound, the molding compound extending along sidewalls of the substrate; and
forming a redistribution layer (RDL) over the substrate, a portion of the RDL extending below a topmost surface of the molding compound and electrically contacting the conductive protective layer.
2. The method of claim 1 , further comprising, before encapsulating the substrate and the conductive protective layer in the molding compound, forming a polymer layer over the passivation layer and the conductive protective layer.
3. The method of claim 2 , wherein the molding compound extends along a sidewall of the polymer layer after encapsulating the substrate and the conductive protective layer in the molding compound.
4. The method of claim 2 , wherein forming the RDL comprises laser drilling the polymer layer to expose a top surface of the conductive protective layer.
5. The method of claim 2 , further comprising planarizing the molding compound to expose the polymer layer.
6. The method of claim 1 , further comprising planarizing the molding compound to form a planarized molding compound, a top surface of the planarized molding compound being above a top surface of the conductive protective layer.
7. The method of claim 6 , wherein forming the RDL comprises laser drilling the planarized molding compound to expose a top surface of the conductive protective layer.
8. A method comprising:
forming a contact pad over a top surface of a substrate;
forming a conductive protective layer over the contact pad, wherein forming the conductive protective layer over the contact pad comprises:
electroless plating the contact pad with a first conductive material; and
electroless plating the first conductive material with a second conductive material different from the first conductive material, a maximum width of the second conductive material being greater than a maximum width of the first conductive material at the end of electroless plating the first conductive material with the second conductive material;
after forming the conductive protective layer over the contact pad, attaching a bottom surface of the substrate to a carrier;
forming a molding compound over the carrier, the substrate and the conductive protective layer, the molding compound extending along sidewalls of the substrate;
reducing a thickness of the molding compound;
after reducing the thickness of the molding compound and while the bottom surface of the substrate is attached to the carrier, exposing the conductive protective layer by laser drilling; and
forming a redistribution layer (RDL) over the substrate, the RDL being electrically connected to the contact pad through the conductive protective layer.
9. The method of claim 8 , further comprising, before attaching the bottom surface of the substrate to the carrier, forming a polymer layer over the conductive protective layer.
10. The method of claim 9 , wherein reducing the thickness of the molding compound comprises exposing the polymer layer.
11. The method of claim 10 , wherein exposing the conductive protective layer by laser drilling comprises laser drilling an opening into the polymer layer.
12. The method of claim 8 , further comprising, before forming the conductive protective layer, forming a passivation layer over the contact pad.
13. The method of claim 12 , wherein a sidewall of the first conductive material is in physical contact with a sidewall of the passivation layer, and wherein a bottom surface of the second conductive material is in physical contact with a top surface of the passivation layer.
14. The method of claim 8 , wherein exposing the conductive protective layer by laser drilling comprises laser drilling an opening into the molding compound.
15. A device comprising:
a contact pad over a substrate;
a passivation layer over and covering edges of the contact pad;
a conductive protective layer over the contact pad, the conductive protective layer comprising:
a first portion comprising a first conductive material, the first conductive material extending through the passivation layer and being in physical contact with the contact pad; and
a second portion over the first portion, the second portion comprising a second conductive material different from the first conductive material, the second conductive material extending along and being in physical contact with a top surface of the passivation layer, a maximum width of the second conductive material being greater than a maximum width of the first conductive material;
a molding compound extending along sidewalls of the substrate and the passivation layer; and
a redistribution layer (RDL) over the substrate and the molding compound, a first portion of the RDL extending below a topmost surface of the molding compound and physically contacting the conductive protective layer.
16. The device of claim 15 , wherein the molding compound is in physical contact with a sidewall of the second portion of the conductive protective layer.
17. The device of claim 15 , further comprising a polymer layer over the passivation layer and the conductive protective layer, a topmost surface of the polymer layer being substantially level with the topmost surface of the molding compound.
18. The device of claim 17 , wherein the polymer layer is in physical contact with a sidewall of the second portion of the conductive protective layer.
19. The device of claim 17 , wherein the molding compound extends along a sidewall of the polymer layer.
20. The device of claim 15 , further comprising a polymer layer over a topmost surface of the molding compound, the first portion of the RDL extending through the polymer layer.