Semiconductor device and method for manufacturing the same
To reduce defects in an oxide semiconductor film in a semiconductor device. To improve the electrical characteristics and the reliability of a semiconductor device including an oxide semiconductor film. In a semiconductor device including a transistor including a gate electrode formed over a substrate, a gate insulating film covering the gate electrode, a multilayer film overlapping with the gate electrode with the gate insulating film provided therebetween, and a pair of electrodes in contact with the multilayer film, a first oxide insulating film covering the transistor, and a second oxide insulating film formed over the first oxide insulating film, the multilayer film includes an oxide semiconductor film and an oxide film containing In or Ga, the first oxide insulating film is an oxide insulating film through which oxygen is permeated, and the second oxide insulating film is an oxide insulating film containing more oxygen than that in the stoichiometric composition.
1. A semiconductor device comprising a transistor, the transistor comprising:
a gate electrode over a substrate;
a gate insulating film over the gate electrode;
an oxide semiconductor film over the gate insulating film;
an oxide film over and in contact with the oxide semiconductor film;
a pair of electrodes over and in contact with the oxide film;
a first oxide insulating film over the pair of electrodes; and
a second oxide insulating film over the first oxide insulating film,
wherein each of the oxide semiconductor film and the oxide film comprise In, Ga and Zn,
wherein the oxide semiconductor film has an atomic ratio of In:Ga:Zn=x 2 :y 2 :z 2 ,
wherein the oxide film has an atomic ratio of In:Ga:Zn=x 1 :y 1 :z 1 ,
wherein y 1 /x 1 is higher than y 2 /x 2 , and
wherein a threshold voltage of the transistor changes in a negative direction or a positive direction, and an amount of change is less than or equal to 1.0 V.
2. The semiconductor device according to claim 1 , wherein the first oxide insulating film is an oxide insulating film through which oxygen is permeated.
3. The semiconductor device according to claim 1 , wherein the second oxide insulating film is an oxide insulating film containing more oxygen than that in a stoichiometric composition.
4. The semiconductor device according to claim 1 , wherein y 1 /x 1 is three or more times as high as y 2 /x 2 .
5. The semiconductor device according to claim 1 , wherein a conduction band bottom of the oxide film is closer to a vacuum level than a conduction band bottom of the oxide semiconductor film is.
6. The semiconductor device according to claim 5 , wherein an energy difference between the conduction band bottom of the oxide film and the conduction band bottom of the oxide semiconductor film is greater than or equal to 0.05 eV and less than or equal to 2 eV.
7. The semiconductor device according to claim 1 , wherein a concentration of silicon between the oxide semiconductor film and the oxide film is lower than 2×10 18 atoms/cm 3 .
8. A semiconductor device comprising a transistor, the transistor comprising:
a gate electrode over a substrate;
a gate insulating film over the gate electrode;
an oxide semiconductor film over the gate insulating film;
an oxide film over and in contact with the oxide semiconductor film;
a pair of electrodes over and in contact with the oxide film;
a first oxide insulating film over the pair of electrodes; and
a second oxide insulating film over the first oxide insulating film,
wherein each of the oxide semiconductor film and the oxide film comprise In, Ga and Zn,
wherein the oxide semiconductor film has an atomic ratio of In:Ga:Zn=x 2 :y 2 :z 2 ,
wherein the oxide film has an atomic ratio of In:Ga:Zn=x 1 :y 1 :z 1 , and
wherein y 1 /x 1 is higher than y 2 /x 2 .
9. The semiconductor device according to claim 8 , wherein the first oxide insulating film is an oxide insulating film through which oxygen is permeated.
10. The semiconductor device according to claim 8 , wherein the second oxide insulating film is an oxide insulating film containing more oxygen than that in a stoichiometric composition.
11. The semiconductor device according to claim 8 , wherein y 1 /x 1 is three or more times as high as y 2 /x 2 .
12. The semiconductor device according to claim 8 , wherein a conduction band bottom of the oxide film is closer to a vacuum level than a conduction band bottom of the oxide semiconductor film is.
13. The semiconductor device according to claim 12 , wherein an energy difference between the conduction band bottom of the oxide film and the conduction band bottom of the oxide semiconductor film is greater than or equal to 0.05 eV and less than or equal to 2 eV.
14. The semiconductor device according to claim 8 , wherein a concentration of silicon between the oxide semiconductor film and the oxide film is lower than 2×10 18 atoms/cm 3 .