Resin composition containing surface-modified inorganic substance, thermally conductive material, and device

1. A resin composition comprising;

a surface-modified inorganic substance which is obtained by performing surface modification on an inorganic nitride by using a boronic acid compound; and

an epoxy compound.

2. The resin composition according to claim 1 ,

wherein the surface modification is modification based on the formation of a covalent bond that the boronic acid compound forms with a surface of the inorganic substance.

3. A resin composition comprising:

one or more inorganic substances selected from the group consisting of an inorganic nitride and an inorganic oxide;

a boronic acid compound; and

an epoxy compound,

wherein the inorganic oxide is titanium oxide, aluminum oxide, or zinc oxide, and

the boronic acid compound is represented by General Formula I or General Formula II,

in the formula, Z represents an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, a carboxylic acid anhydride group, a polymerizable group, a hydrogen atom, a halogen atom, a quaternary ammonium group or a salt thereof, or a quaternary pyridinium group, which may have a substituent, or a salt thereof, X represents a linking group A, a linking group constituted with a combination of two or more linking groups A, or a linking group constituted with a combination of one or more linking groups A and one or more linking groups B, linking group A is selected from the group consisting of a divalent aliphatic hydrocarbon group which may have a substituent, an arylene group which may have a substituent, and a heteroarylene group which may have a substituent, linking groups B is selected from the group consisting of —O—, —CO—, —NH—, —CO—NH—, —COO—, and —O—COO—, R 1 and R 2 each independently represent a hydrogen atom, an aliphatic hydrocarbon group which may have a substituent, an aryl group which may have a substituent, or a heteroaryl group which may have a substituent, and R 1 and R 2 may be linked to each other through an alkylene linking group, an arylene linking group, or a linking group formed of a combination of these;

in the formula, Z represents an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, a carboxylic acid anhydride group, a polymerizable group, a hydrogen atom, a halogen atom, a quaternary ammonium group or a salt thereof, or a quaternary pyridinium group which may have a substituent or a salt thereof, X 2 represents an (n+1)-valent linking group obtained by further removing certain (n−1) hydrogen atoms from a divalent linking group represented by the X of the General Formula I, R 1 and R 2 each independently represent a hydrogen atom, an aliphatic hydrocarbon group which may have a substituent, an aryl group which may have a substituent, or a heteroaryl group which may have a substituent, R 1 and R 2 may be linked to each other through an alkylene linking group, an arylene linking group, or a linking group formed of a combination of these, and n represents an integer of equal to or greater than 2.

4. The resin composition according to claim 1 , wherein the inorganic nitride includes boron, aluminum, or silicon.

5. The resin composition according to claim 1 , wherein the inorganic nitride is boron nitride.

6. The resin composition according to claim 1 , wherein the inorganic nitride is aluminum nitride.

7. A resin composition comprising;

a surface-modified inorganic substance which is obtained by performing surface modification on an inorganic oxide by using a boronic acid compound; and

an epoxy compound,

wherein the boronic acid compound has an oxiranyl group.

8. The resin composition according to claim 7 ,

wherein the inorganic oxide is titanium oxide, aluminum oxide, or zinc oxide.

9. The resin composition according to claim 1 ,

wherein the boronic acid compound is represented by General Formula I,

in the formula, Z represents an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, a carboxylic acid anhydride group, a polymerizable group, a hydrogen atom, a halogen atom, a quaternary ammonium group or a salt thereof, or a quaternary pyridinium group, which may have a substituent, or a salt thereof, X represents a divalent linking group including at least one linking group A selected from the group consisting of a divalent aliphatic hydrocarbon group which may have a substituent, an arylene group which may have a substituent, and a heteroarylene group which may have a substituent, R 1 and R 2 each independently represent a hydrogen atom, an aliphatic hydrocarbon group which may have a substituent, an aryl group which may have a substituent, or a heteroaryl group which may have a substituent, and R 1 and R 2 may be linked to each other through an alkylene linking group, an arylene linking group, or a linking group formed of a combination of these.

10. The resin composition according to claim 1 ,

wherein the boronic acid compound is represented by General Formula II;

in the formula, Z represents an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, a carboxylic acid anhydride group, a polymerizable group, a hydrogen atom, a halogen atom, a quaternary ammonium group or a salt thereof, or a quaternary pyridinium group which may have a substituent or a salt thereof, X 2 represents an (n+1)-valent linking group including at least one linking group A selected from the group consisting of a divalent aliphatic hydrocarbon group which may have a substituent, an arylene group which may have a substituent, and a heteroarylene group which may have a substituent, R 1 and R 2 each independently represent a hydrogen atom, an aliphatic hydrocarbon group which may have a substituent, an aryl group which may have a substituent, or a heteroaryl group which may have a substituent, R 1 and R 2 may be linked to each other through an alkylene linking group, an arylene linking group, or a linking group formed of a combination of these, and n represents an integer of equal to or greater than 2.

11. The resin composition according to claim 1 ,

wherein the boronic acid compound has an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, or a carboxylic acid anhydride group.

12. The resin composition according to claim 1 , further comprising:

a curing agent having a group selected from the group consisting of an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, and a carboxylic acid anhydride group.

13. A thermally conductive material comprising:

a cured substance of the resin composition according to claim 1 .

14. The thermally conductive material according to claim 13 that is in the form of a sheet.

15. The thermally conductive material according to claim 14 that is a heat dissipation sheet.

16. A device comprising:

the thermally conductive material according to claim 13 .

17. A thermally conductive material comprising:

a cured substance of the resin composition according to claim 3 .

18. A device comprising:

the thermally conductive material according to claim 17 .

19. A thermally conductive material comprising:

a cured substance of the resin composition according to claim 7 .

20. The thermally conductive material according to claim 19 that is in the form of a sheet.

21. The thermally conductive material according to claim 20 that is a heat dissipation sheet.

22. A device comprising:

the thermally conductive material according to claim 19 .