IP Library › Granted Patent US 10,761,426
Granted Patent B2
US 10,761,426 · App. 15/904,439 · Granted Sep 1, 2020

Pattern forming method, method for manufacturing electronic device, and laminate

Inventors: Hideaki Tsubaki (Shizuoka, JP); Wataru Nihashi (Shizuoka, JP); Toru Tsuchihashi (Shizuoka, JP); Kei Yamamoto (Shizuoka, JP)
Assignee: FUJIFILM Corporation
G03F7/038G03F7/039G03F7/0392G03F7/0397G03F7/0758G03F7/091G03F7/11G03F7/32G03F7/325H01L21/027G03F7/095
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Quick Facts
Patent No.
US 10,761,426
App. No.
15/904,439
Granted
Sep 1, 2020
Kind
B2
Abstract

The pattern forming method includes forming an actinic ray-sensitive or radiation-sensitive film using an actinic ray-sensitive or radiation-sensitive composition, forming an upper layer film using a composition for forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film, exposing the actinic ray-sensitive or radiation-sensitive film having the upper layer film formed thereon, and developing the exposed actinic ray-sensitive or radiation-sensitive film using a developer containing an organic solvent, in which the composition for forming an upper layer film includes a resin and at least one of a compound capable of generating an acid with actinic rays or radiation, a compound capable of generating an acid with heat, and an acid, in which the resin includes a repeating unit represented by General Formula (II). The method for manufacturing an electronic device includes the pattern forming method. A laminate includes the film and the upper layer film.

Claims (37)

1. A pattern forming method comprising:

(a) forming an actinic ray-sensitive or radiation-sensitive film using an actinic ray-sensitive or radiation-sensitive composition;

(b) forming an upper layer film using a composition for forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film;

(c) exposing the actinic ray-sensitive or radiation-sensitive film having the upper layer film formed thereon; and

(d) developing the exposed actinic ray-sensitive or radiation-sensitive film using a developer containing an organic solvent,

wherein the composition for forming an upper layer film includes a resin and a compound capable of generating an acid with heat; and

wherein the resin includes a repeating unit represented by General Formula (II),

in the formula (II), X b1 represents a hydrogen atom, an alkyl group, a cyano group, or a halogen atom, and

R 2 represents an organic group which has one or more CH 3 partial structures and is stable against an acid.

2. The pattern forming method according to claim 1 ,

wherein the composition for forming an upper layer film includes an anion represented by General Formula (AN1),

in the formula (AN1), Xf's each independently represent a fluorine atom or an alkyl group substituted with at least one fluorine atom,

R 1 and R 2 each independently represent a hydrogen atom, a fluorine atom, or an alkyl group, and R 1 's or R 2 's in a case where they are present in plural numbers may be the same as or different from each other,

L represents a divalent linking group, and L's in a case where they are present in plural numbers may be the same as or different from each other,

A represents a cyclic organic group, and

x represents an integer of 1 to 20, y represents an integer of 0 to 10, and z represents an integer of 0 to 10.

3. The pattern forming method according to claim 1 ,

wherein the composition for forming an upper layer film contains solvents, and the content of a solvent having a hydroxyl group is 50% by mass or less with respect to all the solvents included in the composition for forming an upper layer film.

4. The pattern forming method according to claim 1 ,

wherein the resin included in the composition for forming an upper layer film further contains a repeating unit having an aromatic ring.

5. The pattern forming method according to claim 1 ,

wherein the actinic ray-sensitive or radiation-sensitive composition includes a resin containing a repeating unit having an aromatic ring.

6. The pattern forming method according to claim 1 ,

wherein the developer containing an organic solvent includes at least one solvent selected from the group consisting of an ester solvent, a ketone solvent, an ether solvent, and a hydrocarbon solvent.

7. The pattern forming method according to claim 1 ,

wherein the developer containing an organic solvent includes an ester solvent.

8. The pattern forming method according to claim 1 ,

further comprising (e) rinsing the developed actinic ray-sensitive or radiation-sensitive film using a rinsing liquid after step (d).

9. The pattern forming method according to claim 8 ,

wherein the rinsing liquid is a rinsing liquid including a hydrocarbon solvent.

10. A method for manufacturing an electronic device, comprising the pattern forming method according to claim 1 .

11. A laminate comprising:

an actinic ray-sensitive or radiation-sensitive film; and

an upper layer film including a resin and a compound capable of generating an acid with heat,

wherein the resin includes a repeating unit represented by General Formula (II),

in the formula (II), X b1 represents a hydrogen atom, an alkyl group, a cyano group, or a halogen atom, and

R 2 represents an organic group which has one or more CH 3 partial structures and is stable against an acid.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2018
From: TSUBAKI, HIDEAKI; NIHASHI, WATARU; TSUCHIHASHI, TORU; YAMAMOTO, KEI
To: FUJIFILM CORPORATION
Reel/Frame 045126/0834 →
Priority Claims (1)
JP 2015-195490 · Sep 30, 2015 · national
Continuity (2)
Continuation PCTJP2016074957 · Aug 26, 2016
Related Publication 20180180996A1 · Jun 28, 2018
Cited By (1)
US 12,235,584