Interconnect structure of semiconductor device
A device includes a substrate, a first dielectric layer over the substrate, a first conductive feature in the first dielectric layer, and an etch stop layer over the first dielectric layer. The etch stop layer includes metal-doped aluminum nitride. The device further includes a second dielectric layer over the etch stop layer, and a second conductive feature in the second dielectric layer. The second conductive feature extends into the etch stop layer and contacts the first conductive feature.
1. A method comprising:
forming a conductive line in a first dielectric layer;
forming a metal-doped etch stop layer over the first dielectric layer;
forming a second dielectric layer over the metal-doped etch stop layer;
etching the second dielectric layer and the metal-doped etch stop layer to form an opening, wherein a portion of the metal-doped etch stop layer is interposed between a bottom of the opening and the conductive line;
sputtering the portion of the metal-doped etch stop layer to extend the opening toward the conductive line and form an extended opening, wherein the extended opening exposes a top surface of the conductive line; and
filling the extended opening with a conductive material to form a conductive via in the second dielectric layer.
2. The method of claim 1 , wherein the sputtering further removes a portion of the second dielectric layer.
3. The method of claim 1 , wherein the sputtering is performed using ions of an inert gas.
4. The method of claim 1 , wherein etching the second dielectric layer and the metal-doped etch stop layer comprises chemically etching the second dielectric layer and the metal-doped etch stop layer.
5. The method of claim 1 , wherein a thickness of the portion of the metal-doped etch stop layer is between about 0.1 Å and about 0.5 Å.
6. The method of claim 1 , wherein forming the metal-doped etch stop layer comprises:
depositing an aluminum nitride layer over the first dielectric layer; and
in situ doping the aluminum nitride layer with metal dopants.
7. The method of claim 6 , wherein an atomic percentage of the metal dopants in the metal-doped etch stop layer is between about 5% and about 10%.
8. A method comprising:
forming a conductive line in a first dielectric layer;
depositing a metal-doped etch stop layer over the first dielectric layer;
depositing a second dielectric layer over the metal-doped etch stop layer;
performing a first patterning process on the second dielectric layer to form an opening in the second dielectric layer;
performing a second patterning process on the second dielectric layer and the metal-doped etch stop layer to extend the opening into the metal-doped etch stop layer, wherein a bottom of the opening is disposed within the metal-doped etch stop layer after performing the second patterning process;
performing a sputtering process on the bottom of the opening to expose a portion of the conductive line; and
depositing a conductive material into the opening to form a conductive via in the second dielectric layer.
9. The method of claim 8 , wherein the sputtering process is performed using an inert gas.
10. The method of claim 8 , wherein depositing the metal-doped etch stop layer comprises depositing a metal-doped aluminum nitride layer over the first dielectric layer.
11. The method of claim 10 , wherein depositing the metal-doped aluminum nitride layer comprises:
depositing an aluminum nitride layer over the first dielectric layer; and
in situ doping the aluminum nitride layer with metal dopants.
12. The method of claim 11 , wherein an atomic percentage of the metal dopants in the metal-doped aluminum nitride layer is between about 5% and about 10%.
13. The method of claim 8 , wherein performing the first patterning process on the second dielectric layer comprises performing a first etch process on the second dielectric layer, the first etch process chemically etching the second dielectric layer.
14. The method of claim 13 , wherein performing the second patterning process on the second dielectric layer and the metal-doped etch stop layer comprises performing a second etch process on the second dielectric layer and the metal-doped etch stop layer, the second etch process chemically etching the second dielectric layer and the metal-doped etch stop layer.
15. A method comprising:
forming a metallization layer over a substrate;
depositing a metal-doped aluminum nitride layer over the metallization layer;
depositing a dielectric layer over the metal-doped aluminum nitride layer;
performing a first etch process on the dielectric layer to form an opening in the dielectric layer, wherein the opening exposes the metal-doped aluminum nitride layer;
performing a second etch process on the dielectric layer and the metal-doped aluminum nitride layer to extend the opening into the metal-doped aluminum nitride layer, wherein a portion of the metal-doped aluminum nitride layer is interposed between a bottom of the opening and a top surface of the metallization layer after performing the second etch process;
removing the portion of the metal-doped aluminum nitride layer to expose a conductive feature of the metallization layer; and
filling the opening with a conductive material.
16. The method of claim 15 , wherein the second etch process is different from the first etch process.
17. The method of claim 15 , wherein removing the portion of the metal-doped aluminum nitride layer comprises performing a sputtering process using non-reactive ions.
18. The method of claim 15 , wherein a thickness of the portion of the metal-doped aluminum nitride layer is between about 0.1 Å and about 0.5 Å.
19. The method of claim 15 , wherein depositing the metal-doped aluminum nitride layer comprises:
depositing an aluminum nitride layer over the metallization layer; and
in situ doping the aluminum nitride layer with metal dopants.
20. The method of claim 19 , wherein an atomic percentage of the metal dopants in the metal-doped aluminum nitride layer is between about 5% and about 10%.