OLED display panel, method for manufacturing the same and display device
The present disclosure relates to an OLED display panel, a method for manufacturing the same and a display device. The OLED display panel includes: a substrate; a thin film transistor and a photosensitive device for fingerprint recognition on the substrate; a transparent dielectric layer on the substrate and the thin film transistor; a light-shielding-planarization single layer on the transparent dielectric layer, wherein the light-shielding-planarization single layer has a first hole exposing the transparent dielectric layer, and a projection of the first hole on the substrate overlays with a projection of the photosensitive device on the substrate; and an organic light emitting device on the light-shielding-planarization single layer, wherein the organic light emitting device is connected to a source/drain electrode of the thin film transistor through a second hole penetrating the light-shielding-planarization single layer.
1. An OLED display panel, comprising:
a substrate;
a thin film transistor and a photosensitive device for fingerprint recognition on the substrate; a transparent dielectric layer on the substrate and the thin film transistor;
a light-shielding-planarization single layer on the transparent dielectric layer, wherein the light-shielding-planarization single layer has a first hole exposing the transparent dielectric layer, and a projection of the first hole on the substrate overlays with a projection of the photosensitive device on the substrate; and
an organic light emitting device on the light-shielding-planarization single layer, wherein the organic light emitting device is connected to a source/drain electrode of the thin film transistor through a second hole penetrating the light-shielding-planarization single layer.
2. The OLED display panel according to claim 1 , wherein a material of the light-shielding-planarization single layer comprises a black organic material.
3. The OLED display panel according to claim 2 , wherein the black organic material comprises polyimide.
4. The OLED display panel according to claim 1 , further comprising a barrier layer between the light-shielding-planarization single layer and the light emitting device, wherein the barrier layer has a third hole exposing the transparent dielectric layer, a sidewall of the third hole is continuous with a sidewall of the first hole.
5. The OLED display panel according to claim 4 , wherein the thin film transistor and the photosensitive device are on the same side of the substrate.
6. The OLED display panel according to claim 4 , wherein the thin film transistor and the photosensitive device are on different sides of the substrate.
7. The OLED display panel according to claim 1 , wherein a diameter range of the first hole is 2-3 μm.
8. The OLED display panel according to claim 7 , wherein the substrate is transparent.
9. A display device comprising the OLED display panel according to claim 1 .
10. A method for manufacturing an OLED display panel, comprising:
providing a substrate;
forming a thin film transistor and a photosensitive device for fingerprint recognition on the substrate;
forming a transparent dielectric layer covering the substrate and the thin film transistor;
forming a light-shielding-planarization single layer on the transparent dielectric layer; patterning the light-shielding-planarization single layer to form a first hole exposing the transparent dielectric layer and a second hole exposing a source/drain electrode of the thin film transistor in the light-shielding-planarization single layer, wherein a projection of the first hole on the substrate overlays with a projection of the photosensitive device on the substrate; and
forming an organic light emitting device on the light-shielding-planarization single layer, wherein the organic light emitting device is connected to the source/drain electrode of the thin film transistor through the second hole.
11. The method according to claim 10 , wherein a material of the light-shielding-planarization single layer comprises a black organic material.
12. The method according to claim 11 , wherein the black organic material comprises polyimide.
13. The method according to claim 10 , further comprising: after forming the light-shielding-planarization single layer and before patterning the light-shielding-planarization single layer, forming a barrier layer on the light-shielding-planarization single layer; and patterning the barrier layer to form a third hole and a fourth hole exposing the light-shielding-planarization single layer, wherein a projection of the third hole on the substrate overlays with the projection of the photosensitive device on the substrate, and a projection of the fourth hole on the substrate overlays with a projection of the source/drain electrode on the substrate,
wherein patterning the light-shielding-planarization single layer comprises etching the light-shielding-planarization single layer using the barrier layer as a mask to form the first hole and the second hole.
14. The method according to claim 10 , wherein forming a thin film transistor and a photosensitive device for fingerprint recognition on the substrate comprises forming the thin film transistor and the photosensitive device on the same side of the substrate.
15. The method according to claim 10 , wherein forming a thin film transistor and a photosensitive device for fingerprint recognition on the substrate comprises forming the thin film transistor and the photosensitive device on opposite sides of the substrate, respectively.
16. A display device comprising the OLED display panel according to claim 4 .
17. A display device comprising the OLED display panel according to claim 5 .
18. A display device comprising the OLED display panel according to claim 6 .
19. The method according to claim 13 , wherein forming a thin film transistor and a photosensitive device for fingerprint recognition on the substrate comprises forming the thin film transistor and the photosensitive device on the same side of the substrate.
20. The method according to claim 13 , wherein forming a thin film transistor and a photosensitive device for fingerprint recognition on the substrate comprises forming the thin film transistor and the photosensitive device on opposite sides of the substrate, respectively.