MEMS piezoelectric transducer formed at a PCB support structure
A microelectro-mechanical system (MEMS) device includes a support structure formed of printed circuit board (PCB) materials; and a piezoelectric transducer formed at the support structure. Further, a MEMS assembly is described which shows such a MEMS device mounted at a component carrier. Furthermore, a method for manufacturing such a MEMS device is described.
1. A microelectromechanical system, MEMS, device, comprising:
a support structure formed of printed circuit board, PCB, materials; and
a piezoelectric transducer formed at the support structure, wherein the piezoelectric transducer is formed between two layers made from a FR4 material or between two epoxy-based build-up films and the piezoelectric transducer is electrically contacted via conductor traces formed on one of the two layers.
2. The MEMS device as set forth in claim 1 , wherein at least one of the PCB materials comprises a linear coefficient of thermal expansion (CTE) at 20° C. being in the range between 2.0×10-6/K and 3.1×10-6/K.
3. The MEMS device as set forth in claim 1 , wherein the piezoelectric transducer is made at least partially from aluminum nitride (AlN).
4. The MEMS device as set forth in claim 3 , wherein the MEMS device further comprises a layer of copper (Cu), wherein AlN is formed at the layer of Cu.
5. The MEMS device as set forth in claim 1 , wherein the piezoelectric transducer is a layer structure which is embedded within the support structure.
6. The MEMS device as set forth in claim 1 , further comprising:
an opening which is formed within the support structure and which is designed in such a manner that an interaction portion of the piezoelectric transducer is exposed to an external environment of the MEMS device.
7. The MEMS device as set forth in claim 6 , wherein the MEMS device further comprises:
a further opening which is formed within the support structure and which is designed in such a manner that a further interaction portion of the piezoelectric transducer is exposed to the external environment or to a further external environment of the MEMS device, wherein with respect to a main plane of the layer structure of the piezoelectric transducer the interaction portion and the further interaction portion are located at opposite sides.
8. The MEMS device as set forth in claim 6 , further comprising:
a flexible membrane spanning the opening, wherein at least a portion of the membrane is mechanically coupled with or is coupleable to the piezoelectric transducer.
9. The MEMS device as set forth in claim 8 , wherein the flexible membrane comprises at least one of silicone and Polycrystalline Si.
10. The MEMS device as set forth in claim 1 , further comprising:
an inertial element which is attached to the interaction portion of the piezoelectric transducer.
11. The MEMS device as set forth in claim 1 , wherein at least one of the PCB materials comprises a modulus of elasticity which is smaller than the modulus of elasticity of silicon.
12. The MEMS device as set forth in claim 1 , wherein the conductor traces are made from a structured copper layer.
13. A microelectromechanical system (MEMS) assembly, comprising:
a component carrier; and
a MEMS device having a support structure formed of printed circuit board (PCB) materials with a piezoelectric transducer formed between two layers of a FR4 material or between two epoxy-based build-up films and with the piezoelectric transducer electrically contacted via conductor traces formed on one of the two layers, wherein the MEMS device is mounted at the component carrier.
14. The MEMS assembly as set forth in claim 13 , further comprising:
an electronic circuit, which is mounted at the component carrier and which is electrically connected with the MEMS device.
15. A method for manufacturing a microelectromechanical system (MEMS) device, the method comprising:
forming a support structure from printed circuit board (PCB) materials by using PCB manufacturing procedures;
forming a piezoelectric transducer between two layers of a FR4 material or between two epoxy-based build-up films at the support structure; and
electrically contacting the piezoelectric transducer with conductor traces formed on one of the two layers.
16. The method as set forth in claim 15 , further comprising:
forming a component carrier;
wherein the component carrier and the support structure are formed with the same PCB manufacturing process such that the support structure is mounted to the component carrier.
17. The method as set forth in claim 15 , wherein forming the support structure and forming the piezoelectric transducer further comprises:
sandwiching the piezoelectric transducer between a lower part of the support structure and an upper part of the support structure.
18. The method as set forth in claim 15 , the method further comprising:
forming an opening within the lower part in order to expose an interaction portion of the piezoelectric transducer; and/or
forming a further opening within the upper part in order to expose a further interaction portion of the piezoelectric transducer.
19. The method as set forth in claim 15 , wherein the method is characterized by at least one of the following features:
between the piezoelectric transducer and the lower part of the support structure there is provided a lower release layer; and
between the piezoelectric transducer and the upper part of the support structure there is provided an upper release layer.
20. The method as set forth in claim 15 , wherein the piezoelectric transducer is a stack of at least one layer of aluminum nitride (AlN) and at least one layer of copper (Cu).