Semiconductor device for logic and memory co-optimization

1. A semiconductor device, comprising:

a logic portion and a memory portion;

a logic device disposed within the logic portion, wherein the logic device includes a single fin N-type FinFET and a single fin P-type FinFET; and

a static random-access memory (SRAM) device disposed within the memory portion, wherein the SRAM device includes an N-well region disposed between two P-well regions, wherein the two P-well regions include an N-type FinFET pass gate (PG) transistor and an N-type FinFET pull-down (PD) transistor, and wherein the N-well region includes a P-type FinFET pull-up (PU) transistor;

wherein a first gate formed over the single fin N-type FinFET has a first end-cap length ‘E 1 ’, and wherein a second gate formed over the N-type FinFET PD transistor has a second end-cap length ‘E 2 ’.

2. The semiconductor device of claim 1 , wherein the logic device includes an inverter, an AND gate, a NAND gate, an OR gate, a NOR gate, a flip-flop, scan logic, or combinational logic.

3. The semiconductor device of claim 1 , wherein the logic device has a first active region space ‘S 1 ’ between a channel region of the single fin N-type FinFET and a channel region of the single fin P-type FinFET, and wherein the SRAM device has a second active region space ‘S 2 ’ between a PD-channel region and a PU-channel region.

4. The semiconductor device of claim 3 , wherein the first active region space ‘S 1 ’ is larger than the second active region space ‘S 2 ’ by at least 20%.

5. The semiconductor device of claim 1 , wherein the second end-cap length ‘E 2 ’ is longer than the first end-cap length ‘E 1 ’ by at least 10%.

6. The semiconductor device of claim 1 , wherein an end-cap length ratio E 2 /E 1 is greater than 1.1.

7. The semiconductor device of claim 1 , wherein the logic device includes a first unit cell having a first X-pitch ‘X 1 ’ and a first Y-pitch ‘Y 1 ’, wherein the SRAM device includes a second unit cell having a second X-pitch ‘X 2 ’ and a second Y-pitch ‘Y 2 ’, and wherein the first X-pitch ‘X 1 ’ is the same as the second X-pitch ‘X 2 ’.

8. The semiconductor device of claim 1 , wherein the N-type FinFET PG transistor and the N-type FinFET PD transistor include a single fin N-type FinFET, and wherein the P-type FinFET PU transistor includes a single fin P-type FinFET.

9. The semiconductor device of claim 1 , wherein the single fin N-type FinFET has first fin width (W 1 ) in a first channel region, wherein the single fin P-type FinFET has second fin width (W 2 ) in a second channel region, wherein the N-type FinFET PD transistor has a third fin width (W 3 ) in a third channel region, and wherein the P-type FinFET PU transistor has a fourth fin width (W 4 ) in a fourth channel region.

10. The semiconductor device of claim 9 , wherein the first fin width (W 1 ) is narrower than the third fin width (W 3 ) by at least 5%, and wherein the second fin width (W 2 ) is narrower than the fourth fin width (W 4 ) by at least by 5%.

11. The semiconductor device of claim 9 , wherein a first fin width ratio W 3 /W 1 is greater than 1.05, and wherein a second fin width ratio W 4 /W 2 is greater than 1.05.

12. A circuit, comprising:

a first circuit region and a second circuit region;

a logic circuit disposed within the first circuit region, wherein the logic circuit includes a double fin N-type FinFET and a double fin P-type FinFET; and

a memory circuit disposed within the second circuit region, wherein the memory circuit includes a first plurality of single fin N-type FinFETs and a second plurality of single fin P-type FinFETs;

wherein the logic circuit includes a first unit cell having a first X-pitch ‘X 1 ’, wherein the memory circuit includes a second unit cell having a second X-pitch ‘X 2 ’, and wherein the first X-pitch ‘X 1 ’ is the same as the second X-pitch ‘X 2 ’.

13. The circuit of claim 12 , wherein the memory circuit includes a plurality of static random-access memory (SRAM) unit cells arranged in a plurality of columns and rows.

14. The circuit of claim 13 , wherein each SRAM unit cell of the plurality of SRAM unit cells includes an N-well region disposed between two P-well regions, wherein the two P-well regions include an N-type FinFET pass gate (PG) transistor and an N-type FinFET pull-down (PD) transistor, and wherein the N-well region includes a P-type FinFET pull-up (PU) transistor.

15. The circuit of claim 12 , wherein the logic circuit has a first active region space ‘S 1 ’ between a channel region of the double fin N-type FinFET and a channel region of the double fin P-type FinFET, wherein an SRAM device of the memory circuit has a second active region space ‘S 2 ’ between a PD-channel region and a PU-channel region, and wherein the first active region space ‘S 1 ’ is larger than the second active region space ‘S 2 ’ by at least 20%.

16. The circuit of claim 12 , wherein a first gate formed over the double fin N-type FinFET has a first end-cap length ‘E 1 ’, wherein a second gate formed over an N-type FinFET PD transistor of the memory circuit has a second end-cap length ‘E 2 ’, and wherein the second end-cap length ‘E 2 ’ is longer than the first end-cap length ‘E 1 ’ by at least 10%.

17. The circuit of claim 14 , wherein the double fin N-type FinFET has a first fin width (W 1 ) in a first channel region, wherein the N-type FinFET PD transistor has a third fin width (W 3 ) in a third channel region, and wherein the first fin width (W 1 ) is narrower than the third fin width (W 3 ) by at least 10%.

18. A semiconductor device, comprising:

a plurality of logic portions and a plurality of memory portions disposed on a substrate;

a plurality of CMOS devices disposed within the plurality of logic portions, wherein each CMOS device includes a single fin N-type FinFET having a first fin width (W 1 ) and a single fin P-type FinFET having a second fin width (W 2 ); and

a plurality of static random-access memory (SRAM) devices disposed within the plurality of memory portions, wherein the plurality of SRAM devices are arranged in a plurality of rows and columns, wherein each SRAM device includes an N-type FinFET pass gate (PG) transistor and an N-type FinFET pull-down (PD) transistor disposed within a P-well region and a P-type FinFET pull-up (PU) transistor disposed within an N-well region, wherein the N-type FinFET PD transistor has a third fin width (W 3 ), wherein the P-type FinFET PU transistor has a fourth fin width (W 4 ) and wherein the first fin width (W 1 ) is narrower than the third fin width (W 3 );

wherein a first gate formed over the single fin N-type FinFET has a first end-cap length ‘E 1 ’, wherein the first gate includes a metal gate layer, and wherein the first end-cap length ‘E 1 ’ is at least two times greater than a thickness of the metal gate layer.

19. The semiconductor device of claim 18 ,

wherein each CMOS device has a first active region space ‘S 1 ’ between a channel region of the single fin N-type FinFET and a channel region of the single fin P-type FinFET, wherein each SRAM device has a second active region space ‘S 2 ’ between a PD-channel region and a PU-channel region, wherein the first active region space ‘S 1 ’ is larger than the second active region space ‘S 2 ’ by at least 20%; and

wherein a second gate formed over the N-type FinFET PD transistor has a second end-cap length ‘E 2 ’, and wherein the second end-cap length ‘E 2 ’ is longer than the first end-cap length ‘E 1 ’ by at least 10%.

20. The semiconductor device of claim 1 , wherein the logic device includes a first epitaxial source/drain region having a first source/drain epitaxial width, and wherein the SRAM device includes a second epitaxial source/drain region having a second source/drain epitaxial width greater than the first source/drain epitaxial width.