IP Library › Granted Patent US 10,764,991
Granted Patent B2
US 10,764,991 · App. 16/536,565 · Granted Sep 1, 2020

Printed circuit board including overvoltage controlling element and electronic device including the same

Inventors: Hyunjun Park (Suwon-si, KR); Hongkook Lee (Suwon-si, KR); Dongkyoon Han (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H05K1/0213G09G3/3208H05K1/0277H05K1/115H05K1/181G09G2300/0408G09G2330/04H05K2201/10015H05K2201/10128H05K2201/10174
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,764,991
App. No.
16/536,565
Granted
Sep 1, 2020
Kind
B2
Abstract

Disclosed is a printed circuit board including an overvoltage controlling element and an electronic device including the same. The printed circuit board includes a first outer layer, a second outer layer, at least one inner layer stacked between the first and second outer layers, an overvoltage controlling element comprising overvoltage controlling circuitry mounted on the first outer layer and including a plurality of terminals of which a first terminal is connected to a ground, and a conductive area configured to transfer at least a part of a first voltage applied from an external power source to an external IC and to transfer a remaining part of the first voltage to the overvoltage controlling element.

Claims (38)

1. A printed circuit board comprising:

a first outer layer;

a second outer layer;

at least one inner layer stacked between the first and second outer layers;

an overvoltage controlling element comprising overvoltage controlling circuitry mounted on the first outer layer and including a plurality of terminals of which a first terminal is connected to a ground; and

a conductive area configured to transfer at least a part of a first voltage applied from an external power source to an external IC and to transfer a remaining part of the first voltage to the overvoltage controlling element,

wherein the conductive area includes a first portion arranged on the at least one inner layer and electrically connected to the external power source, a second portion having at least a portion arranged on the first outer layer, the second portion being configured to electrically connect a second terminal of the overvoltage controlling element to the external IC, and a conductive via formed between the external power source and the overvoltage controlling element to electrically connect the first portion and the second portion.

2. The printed circuit board of claim 1 , wherein the conductive via includes at least one conductive via.

3. The printed circuit board of claim 1 , wherein the conductive via corresponds to a first conductive via, and

wherein the second portion includes a third portion arranged on the first outer layer, a fourth portion arranged on the at least one inner layer, and a second conductive via configured to electrically connect the third portion and the fourth portion.

4. The printed circuit board of claim 3 , wherein the second conductive via is formed between the overvoltage controlling element and the external IC.

5. The printed circuit board of claim 3 , wherein the at least one inner layer on which the fourth portion is arranged protrudes toward the external IC.

6. The printed circuit board of claim 1 , wherein the overvoltage controlling element includes at least one of a transient voltage suppression (TVS) diode or a decoupling capacitor.

7. The printed circuit board of claim 1 , wherein the part of the first power source does not exceed a power intensity in a maximum allowable range of the external IC.

8. The printed circuit board of claim 1 , wherein the printed circuit board includes a flexible printed circuit board.

9. The printed circuit board of claim 1 , wherein the at least one inner layer has a thickness in a specified range, which is less than a thickness of the first outer layer or a thickness of the second outer layer.

10. The printed circuit board of claim 1 , wherein the at least one inner layer has a width in a specified range which is greater than a width of the first outer layer or a width of the second outer layer.

11. An electronic device comprising:

a housing;

a display panel arranged inside the housing;

a display driver integrated circuit electrically connected to the display panel and configured to control an operation of the display panel;

a power regulator; and

a printed circuit board coupled to a part of the display panel and configured to electrically connect the power regulator and the display driver integrated circuit,

wherein the printed circuit board includes

a first outer layer on which an overvoltage controlling element comprising overvoltage controlling circuitry is mounted, a second outer layer, at least one inner layer stacked between the first and second outer layers, and a conductive area,

wherein the overvoltage controlling element includes a plurality of terminals of which a first terminal is electrically connected to a ground,

wherein the conductive area includes a first portion arranged on the at least one inner layer and electrically connected to the power regulator, a second portion having at least a portion arranged on the first outer layer, the second portion being electrically connected to a second terminal of the overvoltage controlling element and the display driver integrated circuit, and a conductive via formed between the power regulator and the overvoltage controlling element to electrically connect the first portion and the second portion, and

wherein the power regulator is configured to apply a first voltage to one end of the conductive area, to transfer at least a part of the first voltage to the display driver integrated circuit, and to transfer a remaining part of the first voltage to the overvoltage controlling element.

12. The electronic device of claim 11 , wherein the conductive via includes at least one conductive via.

13. The electronic device of claim 11 , wherein the conductive via corresponds to a first conductive via, and

wherein the second portion includes a third portion arranged on the first outer layer, a fourth portion arranged on the at least one inner layer, and a second conductive via configured to electrically connect the third portion and the fourth portion.

14. The electronic device of claim 13 , wherein the second conductive via is formed between the overvoltage controlling element and the display driver integrated circuit.

15. The electronic device of claim 13 , wherein the at least one inner layer on which the fourth portion is arranged protrudes toward the display driver integrated circuit.

16. The electronic device of claim 11 , wherein the overvoltage controlling element includes at least one of a transient voltage suppression (TVS) diode or a decoupling capacitor.

17. The electronic device of claim 11 , wherein the part of the first power source does not exceed a power intensity in a maximum allowable range of the external IC.

18. The electronic device of claim 11 , wherein the printed circuit board includes a flexible printed circuit board.

19. The electronic device of claim 11 , wherein the at least one inner layer has a thickness in a specified range, which is less than a thickness of the first outer layer or a thickness of the second outer layer.

20. The electronic device of claim 11 , wherein the at least one inner layer has a width in a specified range which is greater than a width of the first outer layer or a width of the second outer layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2019
From: PARK, HYUNJUN; LEE, HONGKOOK; HAN, DONGKYOON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 050010/0180 →
Priority Claims (1)
KR 10-2018-0093378 · Aug 9, 2018 · national
Continuity (1)
Related Publication 20200053868A1 · Feb 13, 2020
Cited By (1)
US 12,426,152