Printed circuit board design for high speed application
A printed circuit board includes a substrate having a top surface and a bottom surface. First non-ground nets and a ground net are disposed within a specific region on the top surface. A second non-ground net and a split ground net are disposed on the bottom surface. The second non-ground net is electrically connected to one of the first non-ground nets through a first via hole in the substrate. The second non-ground net is isolated from the split ground net by a gap. An outermost insulating layer on the bottom surface of the substrate covers the second non-ground net and the split ground net. A conductive layer is disposed on the outermost insulating layer corresponding to the specific region of the substrate in which the first non-ground nets and the ground net are arranged, such that the conductive layer overlaps with the first non-ground nets.
1. A printed circuit board, comprising:
a substrate having a top surface and a bottom surface;
a plurality of first non-ground nets and a ground net disposed within a specific region on the top surface of the substrate;
a second non-ground net and a split ground net disposed on the bottom surface of the substrate, wherein the second non-ground net is electrically connected to one of the plurality of first non-ground nets through a first via hole in the substrate, and wherein the second non-ground net is isolated from the split ground net by a gap;
an outermost insulating layer on the bottom surface of the substrate and covering the second non-ground net and the split ground net; and
a conductive layer disposed on the outermost insulating layer corresponding to the specific region of the substrate in which the plurality of first non-ground nets and the ground net are arranged, such that the conductive layer overlaps with the plurality of first non-ground nets.
2. The printed circuit board according to claim 1 , wherein each of the plurality of first non-ground nets comprises a signal net or a power net.
3. The printed circuit board according to claim 1 , wherein the ground net disposed on the top surface of the substrate is electrically connected to the split ground net through a second via hole in the substrate.
4. The printed circuit board according to claim 1 , wherein the conductive layer is electrically connected to the split ground net through an opening in the outermost insulating layer.
5. The printed circuit board according to claim 1 , wherein the opening is filled with a conductive epoxy material, graphite, or conductive adhesive material so as to form a unity structure with the conductive layer.
6. The printed circuit board according to claim 1 , wherein a spacing between the conductive layer and the split ground net is less than 1 mm.
7. The printed circuit board according to claim 1 , wherein the conductive layer comprises solid metal sheet, metal foil, metal tape, conductive epoxy, conductive epoxy adhesive, conductive silver, copper, aluminum epoxy, polymer conductive composite, conductive polymer, conductive composite polymer, or carbon printing.
8. The printed circuit board according to claim 1 , wherein the outermost insulating layer comprises a solder mask, an isolation film, an isolation tape, or pre-preg.
9. The printed circuit board according to claim 1 further comprising:
an insulating cap layer covering the conductive layer.