Tight temperature control at a thermal load with a two phase pumped loop, optionally augmented with a vapor compression cycle
View Patent ↗A two-phase pump loop (TPPL) for dissipating a thermal load during operation of an apparatus includes a coolant, a vapor/liquid receiver, a pump, an evaporator, a condenser, a valve (V 1 ) configured to regulate a pressure at an outlet of the condenser; a valve (V 2 ) having a control set point set equivalent to a low pressure (P L ) measured in the vapor/liquid receiver; and a controller configured to control the set points of V 1 and V 2 . The TPPL is configured to cool the thermal load with tight control of the temperature of the coolant that is cooling the apparatus. The TPPL may be combined with a vapor cycle system (VCS) to provide a thermal management system with the VCS being configured to use the same or different coolant than the TPPL.
1. A two-phase pump loop (TPPL) for dissipating a thermal load during operation of an apparatus; the TPPL comprising:
a vapor/liquid receiver configured to store a coolant;
a pump configured to force the coolant to flow through the TPPL;
an evaporator configured to absorb heat (Q ABSORBED ) from the apparatus, the evaporator having an inlet and an outlet;
a condenser configured to release heat (Q REJECTED ) in order to remove the heat (Q REJECTED ) from the TPPL;
a valve (V 1 ) configured to regulate a pressure or temperature of the coolant exiting the evaporator; the V 1 having a control set point set at a first pressure (P 1set ) to achieve an evaporator exit pressure that is a saturation pressure (P H ) for the coolant at a predetermined exit temperature from the evaporator;
a valve (V 2 ) having a control set point set at a second pressure (P 2set ) to prevent the vapor/liquid receiver pressure from going to a pressure/temperature that is lower than a predetermined value (P L );
a controller configured to control the set points of V 1 and V 2 ; wherein the controller is configured to set P 1set so as to provide a predetermined temperature at the outlet of the evaporator and the controller is configured to vary P 2set so as to maintain the pressure in the vapor/liquid receiver at or above P L ;
a liquid return valve; and
a liquid separator in fluid communication with the outlet of the evaporator, the liquid separator configured to return a substantial portion of the liquid portion of the coolant through the liquid return valve to the vapor/liquid receiver,
wherein the TPPL is configured to dissipate the thermal load with tight control of the temperature of the coolant that is cooling the apparatus.
2. The two-phase pump loop (TPPL) according to claim 1 , wherein the control set point of V 2 is varied to balance the heat (Q REJECTED ) removed from the condenser with the heat (Q ABSORBED ) absorbed at the evaporator along with any other heat additions or losses encountered.
3. The two-phase pump loop (TPPL) according to claim 1 , wherein the TPPL further comprises a sensor configured to measure the level of liquid in the liquid separator in order to control the flow through the liquid return valve.
4. The two-phase pump loop (TPPL) according to a claim 1 , wherein the TPPL is integrated with a vapor cycle system (VCS); the VCS is configured to remove heat from the TPPL when the temperature of the coolant flowing through the inlet of the evaporator is about ambient temperature or less than ambient temperature.
5. The two-phase pump loop (TPPL) according to claim 4 , wherein the V 1 and V 2 are independently selected to be an expansion valve, a pressure reducing valve, or a back pressure regulator.