IP Library Granted Patent US 10,775,889
Granted Patent B1
US 10,775,889 · App. 15/657,040 · Granted Sep 15, 2020

Enclosure with locally-flexible regions

Inventors: Alex J. Lehmann (Sunnyvale, CA); Robert Y. Cao (San Francisco, CA); Dinesh C. Mathew (San Francisco, CA); Mikael M. Silvanto (San Francisco, CA); Qiliang Xu (Livermore, CA); Paul X. Wang (Cupertino, CA); Robert J. Lockwood (San Carlos, CA)
Assignee: APPLE INC.
G06F3/016G01L1/16G06F3/03547G06F3/0202G06F3/044G06F2203/04105
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Quick Facts
Patent No.
US 10,775,889
App. No.
15/657,040
Filed
Jul 21, 2017
Granted
Sep 15, 2020
Kind
B1
Art Unit
2694
USPC
345/168
Abstract

A force input/haptic output interface for an electronic device can include a force input sensor and a haptic actuator. In one example, the force input sensor and the haptic actuator are accommodated on a frame positioned below an input surface. In many examples, the frame includes relieved portions that redirect and/or concentrate compression or tension in the haptic actuator into the frame.

Claims (50)

1. An electronic device comprising:

an enclosure formed at least partially from glass, the enclosure having a first thickness, the enclosure comprising:

an external surface;

an interior surface opposite the external surface; and

a locally-flexible region defined in the interior surface, the locally-flexible region including a reduced thickness section having a second thickness that is less than the first thickness, the locally-flexible region including a support structure adjacent to the reduced-thickness section, the support structure having a third thickness that is less than the first thickness and greater than the second thickness; and

a haptic actuator coupled to the locally-flexible region, wherein:

actuation of the haptic actuator induces a deformation into the locally-flexible region thereby generating a haptic output at an external surface of the enclosure;

wherein the first, second, and third thicknesses are measured relative to the external surface.

2. The electronic device of claim 1 , wherein the haptic actuator is coupled to the support structure.

3. The electronic device of claim 1 , further comprising:

the locally-flexible region is one of a set of locally-flexible regions distributed across the interior surface; and

the haptic actuator is one of a set of haptic actuators, each of the set of haptic actuators coupled to a respective one locally-flexible region of the set of locally-flexible regions.

4. The electronic device of claim 3 , further comprising:

a keyboard disposed at least partially within the enclosure; wherein:

the set of locally-flexible regions extends parallel to a length of the keyboard.

5. The electronic device of claim 1 , further comprising:

drive circuitry in communication with the haptic actuator; wherein:

the drive circuitry is configured to actuate the haptic actuator.

6. The electronic device of claim 1 , wherein:

the locally-flexible region defines a first opening through the enclosure;

the locally-flexible region further defines a second opening though the enclosure that is aligned with, and offset from, the first opening;

the first and second openings at least partially define a support structure; and

the haptic actuator is coupled to the support structure.

7. The electronic device of claim 1 , wherein the enclosure further comprises a frame coupled to the interior surface.

8. The electronic device of claim 7 , wherein a flexibility of the locally-flexible region is defined, at least in part, by the frame.

9. The electronic device of claim 8 , further comprising a separator separating at least a portion of the frame from the interior surface.

10. The electronic device of claim 9 , further comprising a force input sensor coupled to the interior surface.

11. The electronic device of claim 10 , wherein the force input sensor is a capacitive force sensor configured to measure a change in capacitance resulting from compression of the separator.

12. The electronic device of claim 1 further comprising:

a keyboard within the enclosure;

wherein the haptic actuator is one haptic actuator of a set of haptic actuators, the set of haptic actuators each being directly coupled to the interior surface of the enclosure and extending along a length of the keyboard;

a set of force input sensors coupled to the interior surface; and

a controller in communication with the set of haptic actuators and the set of force input sensors, the controller configured to:

actuate the one haptic actuator of the set of haptic actuators; and

receive a signal from a force input sensor of the set of force input sensors, the signal corresponding to a magnitude of an input force applied to the external surface.

13. The electronic device of claim 12 , further comprising a touch input sensor.

14. The electronic device of claim 12 , wherein

the force input sensor of the set of force input sensors is coupled to the interior surface adjacent to the locally-flexible region.

15. An electronic device comprising: an enclosure comprising:

an exterior external surface; an interior surface comprising:

a locally-flexible region defined in the interior surface and comprising:

a reduced-thickness section having a first thickness; and a beam having a perimeter defined by the reduced-thickness section, the beam having a second thickness greater than the first thickness; a piezoelectric element coupled to the beam; and

a controller in communication with the piezoelectric element and configured to drive the piezoelectric element to induce a bending moment into the beam;

wherein the first and second thicknesses are measured relative to the external surface of the enclosure, the external surface being opposite the interior surface.

16. The electronic device of claim 15 , wherein

the piezoelectric element is a first piezoelectric element; and

the controller is configured to drive the first piezoelectric element and a second piezoelectric element simultaneously to generate a haptic output.

17. The electronic device of claim 15 , wherein:

the enclosure is formed from a glass substrate having a third thickness; and

the third thickness is greater than the second thickness.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2017
From: LEHMANN, ALEX J.; LOCKWOOD, ROBERT J.; CAO, ROBERT Y.; MATHEW, DINESH C.; SILVANTO, MIKAEL M.; XU, QILIANG; WANG, PAUL X.
To: APPLE INC.
Reel/Frame 043387/0591 →
Cited By (7)
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