IP Library › Granted Patent US 12,663,867
Granted Patent B2
US 12,663,867 · App. 17/899,117 · Granted Jun 23, 2026

Haptic structure for providing haptic outputs at an electronic device

Inventors: Alex J. Lehmann (Sunnyvale, CA); Joonas I. Ponkala (San Jose, CA); Keith J. Hendren (San Francisco, CA); Xian Wang (San Mateo, CA); Yu-Lin Kao (Livermore, CA); Kevin C. Armendariz (San Francisco, CA)
Assignee: Apple Inc.
G06F3/016G06F3/0202G06F3/0414G06F3/0443G06F3/0447
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,663,867
App. No.
17/899,117
Filed
Aug 30, 2022
Granted
Jun 23, 2026
Kind
B2
Art Unit
2626
USPC
345/168
Abstract

Embodiments are directed to an electronic device that includes a cover and a haptic module positioned below the cover. The haptic module includes a substrate positioned below the cover and offset from the cover, a spacer positioned between the substrate and the cover and coupling the substrate to the cover, and a piezoelectric element positioned on a surface of the substrate and offset from the cover to define a gap between the piezoelectric element and the cover. The electronic device can also include a sensor coupled to the cover and configured to detect an input, and a processing unit operably coupled to the piezoelectric element and configured to cause the piezoelectric element to deflect the cover in response to the sensor detecting the input.

Claims (91)

1 . An electronic device comprising:

a cover;

a haptic module positioned below the cover and comprising:

a substrate positioned below the cover;

a spacer positioned between the substrate and the cover and coupling the substrate to the cover, the spacer and the substrate suspended from the cover by one or more adhesive layers, wherein the haptic module is unsupported along a bottom of the substrate;

a piezoelectric element positioned on the substrate and offset from the cover to define a gap between the piezoelectric element and the cover; and

a flexible circuit comprising a first portion positioned between the piezoelectric element and the substrate, a second portion positioned between the spacer and the substrate, and a third portion positioned outside an outer edge of the spacer, the first portion of the flexible circuit electrically coupled to the piezoelectric element and the third portion of the flexible circuit comprising an electrical interface;

a sensor coupled to the cover and configured to detect an input; and

circuitry electrically coupled to the electrical interface of the flexible circuit and configured to provide an electronic input that is received by the piezoelectric element, in response to the electronic input, the piezoelectric element changes length causing the substrate to bend in a buckling mode and produce a localized deformation of the cover.

2 . The electronic device of claim 1 , wherein:

the sensor comprises a first electrode separated from a second electrode by a distance;

the input causes a change in the distance between the first electrode and the second electrode; and

the sensor is configured to estimate a force of the input in response to the change in the distance between the first electrode and the second electrode.

3 . The electronic device of claim 2 , wherein the sensor is configured to detect a location of the input in response to the estimated force of the input exceeding a threshold.

4 . The electronic device of claim 2 , further comprising an enclosure component, wherein:

the cover is coupled to the enclosure component; and

a portion of the enclosure component forms the second electrode.

5 . The electronic device of claim 2 , wherein:

the first and the second electrodes are part of a first force sensor that outputs a first force signal;

the electronic device further comprises a second force sensor that outputs a second force signal; and

the circuitry is configured to determine a location of the input based on the first and the second force signals.

6 . The electronic device of claim 5 , wherein:

the first force sensor is positioned along a first side of the haptic module; and

the second force sensor is positioned along a second side of the haptic module.

7 . The electronic device of claim 1 , further comprising an enclosure component, wherein:

the enclosure component comprises a platform extending under the cover;

the platform defines an opening; and

the haptic module is positioned at least partially within the opening.

8 . The electronic device of claim 1 , wherein:

the cover defines a virtual keyboard comprising one or more key regions; and

the electronic device comprises multiple haptic modules positioned below the virtual keyboard and configured to provide haptic outputs along the one or more key regions.

9 . An electronic device comprising:

an enclosure component;

a cover coupled to the enclosure component;

first and second haptic modules positioned below the cover and each of the first and second haptic modules comprising:

an actuation strip comprising:

a substrate; and

a piezoelectric element attached to the substrate; and

a spacer positioned between the actuation strip and the cover and defining a gap between the actuation strip and the cover, the spacer, the piezoelectric element and the substrate suspended from the cover by one or more adhesive layers, wherein the actuation strip is unsupported along a bottom of the substrate; and

a flexible circuit comprising a first portion positioned between the piezoelectric element and the substrate, a second portion positioned between the spacer and the substrate, and a third portion positioned outside an outer edge of the spacer, the first portion of the flexible circuit electrically coupled to the piezoelectric element and the third portion of the flexible circuit comprising an electrical interface;

a touch sensor positioned along the cover and configured to determine a location of a touch input received at the cover; and

circuitry electrically coupled to the electrical interface of the flexible circuit and configured to provide an electronic input that is received by the piezoelectric element, in response to the electronic input, the piezoelectric element changes length causing the substrate of at least one of the first haptic module or the second haptic module to bend in a buckling mode and produce a localized deformation of the cover.

10 . The electronic device of claim 9 , wherein:

the touch sensor comprises:

an array of first electrodes positioned below the cover; and

an array of second electrodes offset from the array of first electrodes;

at least one electrode of the array of first electrodes is configured to deflect in response to the touch input; and

the circuitry is configured to determine the location of the touch input based on the deflection of the at least one electrode.

11 . The electronic device of claim 10 , wherein the circuitry is configured to estimate a force of the touch input based on the deflection of the at least one electrode.

12 . The electronic device of claim 9 , wherein the circuitry is configured to:

actuate the first haptic module with a first signal based on the determined location of the touch input;

actuate the second haptic module with a second signal, different from the first signal, based on the determined location of the touch input; and

the actuation of the first and second haptic modules provides a haptic output at the determined location along the cover.

13 . The electronic device of claim 9 , wherein:

the first haptic module includes a strip of piezoelectric material having a length extending in a first direction;

actuating the first haptic module causes a change in the length of the piezoelectric element; and

in response to the change in the length of the piezoelectric element, the cover deflects in a second direction that is transverse to the first direction.

14 . The electronic device of claim 9 , wherein:

the cover comprises a glass sheet and a display layer positioned below the glass sheet; and

the first and second haptic modules are positioned below the display layer.

15 . The electronic device of claim 9 , further comprising a flexible seal positioned between the cover and the enclosure component, wherein:

the cover is coupled to the enclosure component by the flexible seal; and

the flexible seal comprises a force sensor that is configured to estimate a force of the touch input.

16 . An electronic device comprising:

an upper portion comprising a display;

a lower portion coupled to the upper portion and defining:

a keyboard; and

a track pad;

a haptic module positioned below the track pad and comprising:

a spacer attached to an internal surface of the track pad; and

an actuation strip coupled to the spacer thereby defining a gap between the actuation strip and the internal surface of the track pad, the spacer and the actuation strip suspended from the internal surface of the track pad by one or more adhesive layers, wherein the haptic module is unsupported along a bottom of the haptic module, the actuation strip comprising:

a substrate; and

a piezoelectric element coupled to the substrate;

a flexible circuit comprising a first portion positioned between the piezoelectric element and the substrate, a second portion positioned between the spacer and the substrate, and a third portion positioned outside an outer edge of the spacer, the first portion of the flexible circuit electrically coupled to the piezoelectric element and the third portion of the flexible circuit comprising an electrical interface; and

circuitry electrically coupled to the electrical interface of the flexible circuit and configured to provide an input that is received by the piezoelectric element, in response to the input, the piezoelectric element changes length causing the substrate to bend in a buckling mode and produce a localized deformation of the track pad.

17 . The electronic device of claim 16 , further comprising:

a first set of electrodes;

a second set of electrodes separated from the first set of electrodes by a distance; and

an array of flexible structures positioned between the first set of electrodes and the second set of electrodes.

18 . The electronic device of claim 17 , wherein:

the array of flexible structures is configured to deform in response to a touch input received at the track pad and cause a change in the distance between a first electrode of the first set of electrodes and a second electrode of the second set of electrodes; and

the circuitry is configured to determine a location of the touch input based on the change in the distance between the first electrode and the second electrode.

19 . The electronic device of claim 18 , wherein the circuitry is configured to:

estimate a force of the touch input based on the change in the distance between the first electrode and the second electrode; and

control an amount of deflection of the haptic module based on the determined location of the touch input, the estimated force of the touch input, or a combination thereof.

20 . The electronic device of claim 16 , wherein:

the haptic module is a first haptic module;

the electronic device further comprises a second haptic module; and

the circuitry is configured to:

actuate the first haptic module to cause a first amount of deflection based on a location of a touch input; and

actuate the second haptic module to cause a second amount of deflection, different from the first amount of deflection, based on the location of the touch input.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2022
From: LEHMANN, ALEX J.; PONKALA, JOONAS I.; HENDREN, KEITH J.; WANG, XIAN; KAO, YU-LIN; ARMENDARIZ, KEVIN C.
To: APPLE INC.
Reel/Frame 060957/0598 →
Continuity (2)
Provisional Application 63277484 · Nov 9, 2021
Related Publication 20230142264A1 · May 11, 2023
References Cited (400)
US 5196745A · Trumper et al. · 1993 [cited by applicant]
US 5293161A · MacDonald et al. · 1994 [cited by applicant]
US 5424756A · Ho et al. · 1995 [cited by applicant]
US 5434549A · Hirabayashi et al. · 1995 [cited by applicant]
US 5436622A · Gutman et al. · 1995 [cited by applicant]
US 5668423A · You et al. · 1997 [cited by applicant]
US 5739759A · Nakazawa et al. · 1998 [cited by applicant]
US 5842967A · Kroll · 1998 [cited by applicant]
US 6084319A · Kamata et al. · 2000 [cited by applicant]
US 6342880B2 · Rosenberg et al. · 2002 [cited by applicant]
US 6373465B2 · Jolly et al. · 2002 [cited by applicant]
US 6388789B1 · Bernstein · 2002 [cited by applicant]
US 6438393B1 · Surronen · 2002 [cited by applicant]
US 6445093B1 · Binnard · 2002 [cited by applicant]
US 6493612B1 · Bisset et al. · 2002 [cited by applicant]
US 6554191B2 · Yoneya · 2003 [cited by applicant]
US 6693622B1 · Shahoian et al. · 2004 [cited by applicant]
US 6777895B2 · Shimoda et al. · 2004 [cited by applicant]
US 6822635B2 · Shahoian · 2004 [cited by applicant]
US 6864877B2 · Braun et al. · 2005 [cited by applicant]
US 6952203B2 · Banerjee et al. · 2005 [cited by applicant]
US 6988414B2 · Ruhrig et al. · 2006 [cited by applicant]
US 7068168B2 · Girshovich et al. · 2006 [cited by applicant]
US 7080271B2 · Kardach et al. · 2006 [cited by applicant]
US 7126254B2 · Nanataki et al. · 2006 [cited by applicant]
US 7130664B1 · Williams · 2006 [cited by applicant]
US 7196688B2 · Shena et al. · 2007 [cited by applicant]
US 7202851B2 · Cunningham et al. · 2007 [cited by applicant]
US 7234379B2 · Claesson et al. · 2007 [cited by applicant]
US 7253350B2 · Noro et al. · 2007 [cited by applicant]
US 7276907B2 · Kitagawa et al. · 2007 [cited by applicant]
US 7321180B2 · Takeuchi et al. · 2008 [cited by applicant]
US 7323959B2 · Naka et al. · 2008 [cited by applicant]
US 7336006B2 · Watanabe et al. · 2008 [cited by applicant]
US 7339572B2 · Schena · 2008 [cited by applicant]
US 7355305B2 · Nakamura et al. · 2008 [cited by applicant]
US 7360446B2 · Dai et al. · 2008 [cited by applicant]
US 7370289B1 · Ebert et al. · 2008 [cited by applicant]
US 7385874B2 · Vuilleumier · 2008 [cited by applicant]
US 7392066B2 · Hapamas · 2008 [cited by applicant]
US 7423631B2 · Shahoian et al. · 2008 [cited by applicant]
US 7508382B2 · Denoue et al. · 2009 [cited by applicant]
US 7570254B2 · Suzuki et al. · 2009 [cited by applicant]
US 7576477B2 · Koizumi · 2009 [cited by applicant]
US 7656388B2 · Schena et al. · 2010 [cited by applicant]
US 7667371B2 · Sadler et al. · 2010 [cited by applicant]
US 7667691B2 · Boss et al. · 2010 [cited by applicant]
US 7675414B2 · Ray · 2010 [cited by applicant]
US 7710397B2 · Krah et al. · 2010 [cited by applicant]
US 7710399B2 · Bruneau et al. · 2010 [cited by applicant]
US 7741938B2 · Kramlich · 2010 [cited by applicant]
US 7755605B2 · Daniel et al. · 2010 [cited by applicant]
US 7798982B2 · Zets et al. · 2010 [cited by applicant]
US 7825903B2 · Anastas et al. · 2010 [cited by applicant]
US 7855657B2 · Doemens et al. · 2010 [cited by applicant]
US 7890863B2 · Grant et al. · 2011 [cited by applicant]
US 7893922B2 · Klinghult et al. · 2011 [cited by applicant]
US 7904210B2 · Pfau et al. · 2011 [cited by applicant]
US 7911328B2 · Luden et al. · 2011 [cited by applicant]
US 7919945B2 · Houston et al. · 2011 [cited by applicant]
US 7952261B2 · Lipton et al. · 2011 [cited by applicant]
US 7952566B2 · Poupyrev et al. · 2011 [cited by applicant]
US 7956770B2 · Klinghult et al. · 2011 [cited by applicant]
US 7976230B2 · Ryynanen et al. · 2011 [cited by applicant]
US 8002089B2 · Jasso et al. · 2011 [cited by applicant]
US 8020266B2 · Ulm et al. · 2011 [cited by applicant]
US 8040224B2 · Hwang · 2011 [cited by applicant]
US 8053688B2 · Conzola et al. · 2011 [cited by applicant]
US 8063892B2 · Shahoian · 2011 [cited by applicant]
US 8072418B2 · Crawford et al. · 2011 [cited by applicant]
US 8081156B2 · Ruettiger · 2011 [cited by applicant]
US 8125453B2 · Shahoian et al. · 2012 [cited by applicant]
US 8154537B2 · Olien et al. · 2012 [cited by applicant]
US 8169402B2 · Shahoian et al. · 2012 [cited by applicant]
US 8174495B2 · Takashima et al. · 2012 [cited by applicant]
US 8174512B2 · Ramstein et al. · 2012 [cited by applicant]
US 8188989B2 · Levin · 2012 [cited by applicant]
US 8217892B2 · Meadors · 2012 [cited by applicant]
US 8217910B2 · Stallings et al. · 2012 [cited by applicant]
US 8232494B2 · Purcocks · 2012 [cited by applicant]
US 8248386B2 · Harrison · 2012 [cited by applicant]
US 8253686B2 · Kyung · 2012 [cited by applicant]
US 8262480B2 · Cohen et al. · 2012 [cited by applicant]
US 8264465B2 · Grant et al. · 2012 [cited by applicant]
US 8265292B2 · Leichter · 2012 [cited by applicant]
US 8265308B2 · Gitzinger et al. · 2012 [cited by applicant]
US 8344834B2 · Niiyama · 2013 [cited by applicant]
US 8345025B2 · Seibert et al. · 2013 [cited by applicant]
US 8351104B2 · Zaifrani et al. · 2013 [cited by applicant]
US 8378797B2 · Pance et al. · 2013 [cited by applicant]
US 8378965B2 · Gregorio et al. · 2013 [cited by applicant]
US 8384316B2 · Houston et al. · 2013 [cited by applicant]
US 8390218B2 · Houston et al. · 2013 [cited by applicant]
US 8390572B2 · Marsden et al. · 2013 [cited by applicant]
US 8390594B2 · Modarres et al. · 2013 [cited by applicant]
US 8400027B2 · Dong et al. · 2013 [cited by applicant]
US 8405618B2 · Colgate et al. · 2013 [cited by applicant]
US 8421609B2 · Kim et al. · 2013 [cited by applicant]
US 8432365B2 · Kim et al. · 2013 [cited by applicant]
US 8469806B2 · Grant et al. · 2013 [cited by applicant]
US 8471690B2 · Hennig et al. · 2013 [cited by applicant]
US 8493177B2 · Flaherty et al. · 2013 [cited by applicant]
US 8493189B2 · Suzuki · 2013 [cited by applicant]
US 8562489B2 · Burton · 2013 [cited by applicant]
US 8576171B2 · Grant · 2013 [cited by applicant]
US 8598750B2 · Park · 2013 [cited by applicant]
US 8598972B2 · Cho et al. · 2013 [cited by applicant]
US 8604670B2 · Mahameed et al. · 2013 [cited by applicant]
US 8605141B2 · Dialameh et al. · 2013 [cited by applicant]
US 8614431B2 · Huppi et al. · 2013 [cited by applicant]
US 8619031B2 · Hayward · 2013 [cited by applicant]
US 8624448B2 · Kaiser et al. · 2014 [cited by applicant]
US 8628173B2 · Stephens et al. · 2014 [cited by applicant]
US 8633916B2 · Bernstein et al. · 2014 [cited by applicant]
US 8639485B2 · Connacher et al. · 2014 [cited by applicant]
US 8643480B2 · Maier et al. · 2014 [cited by applicant]
US 8648829B2 · Shahoian et al. · 2014 [cited by applicant]
US 8653785B2 · Collopy · 2014 [cited by applicant]
US 8654524B2 · Pance et al. · 2014 [cited by applicant]
US 8681130B2 · Adhikari · 2014 [cited by applicant]
US 8686952B2 · Burrough et al. · 2014 [cited by applicant]
US 8717151B2 · Forutanpour et al. · 2014 [cited by applicant]
US 8730182B2 · Modarres et al. · 2014 [cited by applicant]
US 8749495B2 · Grant et al. · 2014 [cited by applicant]
US 8754759B2 · Fadell et al. · 2014 [cited by applicant]
US 8760037B2 · Eshed et al. · 2014 [cited by applicant]
US 8773247B2 · Ullrich · 2014 [cited by applicant]
US 8780074B2 · Castillo et al. · 2014 [cited by applicant]
US 8797153B2 · Vanhelle et al. · 2014 [cited by applicant]
US 8797295B2 · Bernstein et al. · 2014 [cited by applicant]
US 8803670B2 · Steckel et al. · 2014 [cited by applicant]
US 8834390B2 · Couvillon · 2014 [cited by applicant]
US 8836502B2 · Culbert et al. · 2014 [cited by applicant]
US 8836643B2 · Jolliff et al. · 2014 [cited by applicant]
US 8867757B1 · Ooi · 2014 [cited by applicant]
US 8872448B2 · Boldyrev et al. · 2014 [cited by applicant]
US 8878401B2 · Lee · 2014 [cited by applicant]
US 8890824B2 · Guard · 2014 [cited by applicant]
US 8907661B2 · Maier et al. · 2014 [cited by applicant]
US 8976139B2 · Koga et al. · 2015 [cited by applicant]
US 8976141B2 · Myers et al. · 2015 [cited by applicant]
US 8977376B1 · Lin et al. · 2015 [cited by applicant]
US 8981682B2 · Delson et al. · 2015 [cited by applicant]
US 8987951B2 · Park · 2015 [cited by applicant]
US 9008730B2 · Kim et al. · 2015 [cited by applicant]
US 9024738B2 · Van Schyndel et al. · 2015 [cited by applicant]
US 9046947B2 · Takeda · 2015 [cited by applicant]
US 9049339B2 · Muench · 2015 [cited by applicant]
US 9052785B2 · Horie · 2015 [cited by applicant]
US 9054605B2 · Jung et al. · 2015 [cited by applicant]
US 9058077B2 · Lazaridis et al. · 2015 [cited by applicant]
US 9086727B2 · Tidemand et al. · 2015 [cited by applicant]
US 9092056B2 · Myers et al. · 2015 [cited by applicant]
US 9094762B2 · Wong et al. · 2015 [cited by applicant]
US 9104285B2 · Colgate et al. · 2015 [cited by applicant]
US 9116570B2 · Lee et al. · 2015 [cited by applicant]
US 9122330B2 · Bau et al. · 2015 [cited by applicant]
US 9134796B2 · Lemmons et al. · 2015 [cited by applicant]
US 9172669B2 · Swink et al. · 2015 [cited by applicant]
US 9182837B2 · Day · 2015 [cited by applicant]
US 9218727B2 · Rothkopf et al. · 2015 [cited by applicant]
US 9228908B2 · Aliane et al. · 2016 [cited by applicant]
US 9245704B2 · Maharjan et al. · 2016 [cited by applicant]
US 9256287B2 · Shinozaki et al. · 2016 [cited by applicant]
US 9274601B2 · Faubert et al. · 2016 [cited by applicant]
US 9280205B2 · Rosenberg et al. · 2016 [cited by applicant]
US 9285905B1 · Buuck et al. · 2016 [cited by applicant]
US 9286907B2 · Yang et al. · 2016 [cited by applicant]
US 9304587B2 · Wright et al. · 2016 [cited by applicant]
US 9319150B2 · Peeler et al. · 2016 [cited by applicant]
US 9348414B2 · Kagayama · 2016 [cited by applicant]
US 9348473B2 · Ando · 2016 [cited by applicant]
US 9361018B2 · Pasquero et al. · 2016 [cited by applicant]
US 9396629B1 · Weber et al. · 2016 [cited by applicant]
US 9430042B2 · Levin · 2016 [cited by applicant]
US 9436280B2 · Tartz et al. · 2016 [cited by applicant]
US 9442570B2 · Slonneger · 2016 [cited by applicant]
US 9448631B2 · Winter et al. · 2016 [cited by applicant]
US 9448713B2 · Cruz-Hernandez et al. · 2016 [cited by applicant]
US 9449476B2 · Lynn et al. · 2016 [cited by applicant]
US 9459734B2 · Day · 2016 [cited by applicant]
US 9466783B2 · Olien et al. · 2016 [cited by applicant]
US 9489049B2 · Li · 2016 [cited by applicant]
US 9496777B2 · Jung · 2016 [cited by applicant]
US 9501149B2 · Burnbaum et al. · 2016 [cited by applicant]
US 9513704B2 · Heubel et al. · 2016 [cited by applicant]
US 9519346B2 · Lacroix et al. · 2016 [cited by applicant]
US 9535500B2 · Pasquero et al. · 2017 [cited by applicant]
US 9539164B2 · Sanders et al. · 2017 [cited by applicant]
US 9542028B2 · Filiz et al. · 2017 [cited by applicant]
US 9557830B2 · Grant · 2017 [cited by applicant]
US 9557857B2 · Schediwy · 2017 [cited by applicant]
US 9563274B2 · Senanayake · 2017 [cited by applicant]
US 9564029B2 · Morrell et al. · 2017 [cited by applicant]
US 9594429B2 · Bard et al. · 2017 [cited by applicant]
US 9600037B2 · Pance et al. · 2017 [cited by applicant]
US 9600071B2 · Rothkopf · 2017 [cited by applicant]
US 9607491B1 · Mortimer et al. · 2017 [cited by applicant]
US 9627163B2 · Ely et al. · 2017 [cited by applicant]
US 9632583B2 · Virtanen et al. · 2017 [cited by applicant]
US 9639158B2 · Levesque et al. · 2017 [cited by applicant]
US 9666040B2 · Flaherty et al. · 2017 [cited by applicant]
US 9690379B2 · Tremblay · 2017 [cited by applicant]
US 9707593B2 · Berte · 2017 [cited by applicant]
US 9710061B2 · Pance et al. · 2017 [cited by applicant]
US 9727238B2 · Peh et al. · 2017 [cited by applicant]
US 9733704B2 · Cruz-Hernandez et al. · 2017 [cited by applicant]
US 9762236B2 · Chen et al. · 2017 [cited by applicant]
US 9823828B2 · Zambetti et al. · 2017 [cited by applicant]
US 9829981B1 · Ji · 2017 [cited by applicant]
US 9830782B2 · Morrell et al. · 2017 [cited by applicant]
US 9857872B2 · Terlizzi et al. · 2018 [cited by applicant]
US 9870053B2 · Modarres et al. · 2018 [cited by applicant]
US 9874980B2 · Brunet et al. · 2018 [cited by applicant]
US 9875625B2 · Khoshkava et al. · 2018 [cited by applicant]
US 9878239B2 · Heubel et al. · 2018 [cited by applicant]
US 9886057B2 · Bushnell et al. · 2018 [cited by applicant]
US 9886090B2 · Silvanto et al. · 2018 [cited by applicant]
US 9902186B2 · Whiteman et al. · 2018 [cited by applicant]
US 9904393B2 · Frey et al. · 2018 [cited by applicant]
US 9921649B2 · Grant et al. · 2018 [cited by applicant]
US 9927887B2 · Bulea · 2018 [cited by applicant]
US 9927902B2 · Burr et al. · 2018 [cited by applicant]
US 9928950B2 · Lubinski et al. · 2018 [cited by applicant]
US 9940013B2 · Choi et al. · 2018 [cited by applicant]
US 9971407B2 · Holenarsipur et al. · 2018 [cited by applicant]
US 9977499B2 · Westerman et al. · 2018 [cited by applicant]
US 9990040B2 · Levesque · 2018 [cited by applicant]
US 9996199B2 · Park et al. · 2018 [cited by applicant]
US 10025399B2 · Kim et al. · 2018 [cited by applicant]
US 10032550B1 · Zhang et al. · 2018 [cited by applicant]
US 10037660B2 · Khoshkava et al. · 2018 [cited by applicant]
US 10061385B2 · Churikov et al. · 2018 [cited by applicant]
US 10069392B2 · Degner et al. · 2018 [cited by applicant]
US 10078483B2 · Finnan et al. · 2018 [cited by applicant]
US 10082873B2 · Zhang · 2018 [cited by applicant]
US 10108265B2 · Harley et al. · 2018 [cited by applicant]
US 10110986B1 · Min · 2018 [cited by applicant]
US 10120446B2 · Pance et al. · 2018 [cited by applicant]
US 10120478B2 · Filiz et al. · 2018 [cited by applicant]
US 10120484B2 · Endo et al. · 2018 [cited by applicant]
US 10122184B2 · Smadi et al. · 2018 [cited by applicant]
US 10133351B2 · Weber et al. · 2018 [cited by applicant]
US 10139976B2 · Iuchi et al. · 2018 [cited by applicant]
US 10146336B2 · Lee et al. · 2018 [cited by applicant]
US 10152131B2 · Grant et al. · 2018 [cited by applicant]
US 10152182B2 · Haran et al. · 2018 [cited by applicant]
US 10203762B2 · Bradski et al. · 2019 [cited by applicant]
US 10209821B2 · Roberts-Hoffman et al. · 2019 [cited by applicant]
US 10232714B2 · Wachinger · 2019 [cited by applicant]
US 10235034B2 · Jitkoff et al. · 2019 [cited by applicant]
US 10235849B1 · Levesque · 2019 [cited by applicant]
US 10248221B2 · Pance et al. · 2019 [cited by applicant]
US 10254840B2 · Weinraub · 2019 [cited by applicant]
US 10261585B2 · Bard et al. · 2019 [cited by applicant]
US 10275075B2 · Hwang et al. · 2019 [cited by applicant]
US 10282014B2 · Butler et al. · 2019 [cited by applicant]
US 10284935B2 · Miyoshi · 2019 [cited by applicant]
US 10289199B2 · Hoellwarth · 2019 [cited by applicant]
US 10343061B2 · Billington et al. · 2019 [cited by applicant]
US 10346117B2 · Sylvan et al. · 2019 [cited by applicant]
US 10372214B1 · Gleeson et al. · 2019 [cited by applicant]
US 10373381B2 · Nuernberger et al. · 2019 [cited by applicant]
US 10382866B2 · Min · 2019 [cited by applicant]
US 10390139B2 · Biggs · 2019 [cited by applicant]
US 10394326B2 · Ono et al. · 2019 [cited by applicant]
US 10397686B2 · Forstner et al. · 2019 [cited by applicant]
US 10430077B2 · Lee · 2019 [cited by applicant]
US 10437359B1 · Wang et al. · 2019 [cited by applicant]
US 10459226B2 · Leppanen et al. · 2019 [cited by applicant]
US 10531191B2 · Macours · 2020 [cited by applicant]
US 10556252B2 · Tsang et al. · 2020 [cited by applicant]
US 10564721B2 · Cruz-Hernandez et al. · 2020 [cited by applicant]
US 10585480B1 · Bushnell et al. · 2020 [cited by applicant]
US 10591993B2 · Lehmann et al. · 2020 [cited by applicant]
US 10599223B1 · Amin-Shahidi et al. · 2020 [cited by applicant]
US 10622538B2 · Zhang et al. · 2020 [cited by applicant]
US 10649529B1 · Nekimken et al. · 2020 [cited by applicant]
US 10685626B2 · Kim et al. · 2020 [cited by applicant]
US 10691211B2 · Amin-Shahidi et al. · 2020 [cited by applicant]
US 10698489B1 · Beyhs et al. · 2020 [cited by applicant]
US 10768738B1 · Wang et al. · 2020 [cited by applicant]
US 10768747B2 · Wang et al. · 2020 [cited by applicant]
US 10775889B1 · Lehmann et al. · 2020 [cited by applicant]
US 10809830B2 · Kim et al. · 2020 [cited by applicant]
US 10845220B2 · Song et al. · 2020 [cited by applicant]
US 10845878B1 · Zhao et al. · 2020 [cited by applicant]
US 10890978B2 · Bushnell et al. · 2021 [cited by applicant]
US 10936071B2 · Pandya et al. · 2021 [cited by applicant]
US 10942571B2 · Hendren et al. · 2021 [cited by applicant]
US 10963117B2 · Morrell et al. · 2021 [cited by applicant]
US 10996007B2 · Tashiro · 2021 [cited by applicant]
US 11024135B1 · Ostdiek et al. · 2021 [cited by applicant]
US 11054932B2 · Xu et al. · 2021 [cited by applicant]
US 11073712B2 · Yeke Yazdandoost et al. · 2021 [cited by applicant]
US 11086509B2 · Lapp · 2021 [cited by applicant]
US 11188151B2 · Bushnell et al. · 2021 [cited by applicant]
US 11460946B2 · Xu et al. · 2022 [cited by applicant]
US 12296108B2 · English · 2025 [cited by applicant]
US 20030117132A1 · Klinghult · 2003 [cited by applicant]
US 20050036603A1 · Hughes · 2005 [cited by applicant]
US 20050191604A1 · Allen · 2005 [cited by applicant]
US 20050230594A1 · Sato et al. · 2005 [cited by applicant]
US 20060017691A1 · Cruz-Hernandez et al. · 2006 [cited by applicant]
US 20060209037A1 · Wang et al. · 2006 [cited by applicant]
US 20060223547A1 · Chin et al. · 2006 [cited by applicant]
US 20060252463A1 · Liao · 2006 [cited by applicant]
US 20070106457A1 · Rosenberg · 2007 [cited by applicant]
US 20070152974A1 · Kim et al. · 2007 [cited by applicant]
US 20080062145A1 · Shahoian · 2008 [cited by applicant]
US 20080062624A1 · Regen · 2008 [cited by applicant]
US 20080084384A1 · Gregorio et al. · 2008 [cited by applicant]
US 20080111791A1 · Nikittin · 2008 [cited by applicant]
US 20090085879A1 · Dai et al. · 2009 [cited by applicant]
US 20090115734A1 · Fredriksson et al. · 2009 [cited by applicant]
US 20090166098A1 · Sunder · 2009 [cited by applicant]
US 20090167702A1 · Nurmi · 2009 [cited by applicant]
US 20090174672A1 · Schmidt · 2009 [cited by applicant]
US 20090207129A1 · Ullrich et al. · 2009 [cited by applicant]
US 20090225046A1 · Kim et al. · 2009 [cited by applicant]
US 20090243404A1 · Kim et al. · 2009 [cited by applicant]
US 20090267892A1 · Faubert · 2009 [cited by examiner]
US 20100116629A1 · Borissov et al. · 2010 [cited by applicant]
US 20100225600A1 · Dai et al. · 2010 [cited by applicant]
US 20100313425A1 · Hawes · 2010 [cited by applicant]
US 20100328229A1 · Weber et al. · 2010 [cited by applicant]
US 20110115754A1 · Cruz-Hernandez · 2011 [cited by applicant]
US 20110128239A1 · Polyakov et al. · 2011 [cited by applicant]
US 20110132114A1 · Siotis · 2011 [cited by applicant]
US 20110169347A1 · Miyamoto et al. · 2011 [cited by applicant]
US 20110205038A1 · Drouin et al. · 2011 [cited by applicant]
US 20110261021A1 · Modarres et al. · 2011 [cited by applicant]
US 20110267181A1 · Kildal · 2011 [cited by applicant]
US 20110267294A1 · Kildal · 2011 [cited by applicant]
US 20120038469A1 · Dehmoubed et al. · 2012 [cited by applicant]
US 20120038471A1 · Kim et al. · 2012 [cited by applicant]
US 20120056825A1 · Ramsay et al. · 2012 [cited by applicant]
US 20120062491A1 · Coni et al. · 2012 [cited by applicant]
US 20120113008A1 · Makinen et al. · 2012 [cited by applicant]
US 20120235942A1 · Shahoian et al. · 2012 [cited by applicant]
US 20120249474A1 · Pratt et al. · 2012 [cited by applicant]
US 20120327006A1 · Israr et al. · 2012 [cited by applicant]
US 20130016042A1 · Makinen et al. · 2013 [cited by applicant]
US 20130021296A1 · Min et al. · 2013 [cited by applicant]
US 20130043670A1 · Holmes · 2013 [cited by applicant]
US 20130044049A1 · Biggs et al. · 2013 [cited by applicant]
US 20130076635A1 · Lin · 2013 [cited by applicant]
US 20130154996A1 · Trend et al. · 2013 [cited by applicant]
US 20130207793A1 · Weaber et al. · 2013 [cited by applicant]
US 20140118419A1 · Wu et al. · 2014 [cited by applicant]
US 20140125470A1 · Rosenberg · 2014 [cited by applicant]
US 20140168175A1 · Mercea et al. · 2014 [cited by applicant]
US 20150084909A1 · Worfolk et al. · 2015 [cited by applicant]
US 20150122621A1 · Fukumoto · 2015 [cited by examiner]
US 20150126070A1 · Candelore · 2015 [cited by applicant]
US 20150182113A1 · Utter, II · 2015 [cited by applicant]
US 20150185842A1 · Picciotto et al. · 2015 [cited by applicant]
US 20150186609A1 · Utter, II · 2015 [cited by applicant]
US 20150234493A1 · Parivar et al. · 2015 [cited by applicant]
US 20150293592A1 · Cheong et al. · 2015 [cited by applicant]
US 20160171767A1 · Anderson · 2016 [cited by applicant]
US 20160253019A1 · Geaghan · 2016 [cited by applicant]
US 20160293829A1 · Maharjan et al. · 2016 [cited by applicant]
US 20160327911A1 · Eim et al. · 2016 [cited by applicant]
US 20160328930A1 · Weber · 2016 [cited by applicant]
US 20160334901A1 · Rihn · 2016 [cited by applicant]
US 20160364001A1 · Hirose · 2016 [cited by examiner]
US 20160379776A1 · Oakley · 2016 [cited by applicant]
US 20170024010A1 · Weinraub · 2017 [cited by applicant]
US 20170083096A1 · Rihn et al. · 2017 [cited by applicant]
US 20170085402A1 · Hajati · 2017 [cited by applicant]
US 20170090655A1 · Zhang et al. · 2017 [cited by applicant]
US 20170249024A1 · Jackson et al. · 2017 [cited by applicant]
US 20170336273A1 · Elangovan et al. · 2017 [cited by applicant]
US 20170357325A1 · Yang et al. · 2017 [cited by applicant]
US 20170364158A1 · Wen et al. · 2017 [cited by applicant]
US 20180005496A1 · Dogiamis et al. · 2018 [cited by applicant]
US 20180015362A1 · Terahata · 2018 [cited by applicant]
US 20180029078A1 · Park et al. · 2018 [cited by applicant]
US 20180081438A1 · Lehmann · 2018 [cited by examiner]
US 20180284894A1 · Raut et al. · 2018 [cited by applicant]
US 20180335883A1 · Choi et al. · 2018 [cited by applicant]
US 20180373325A1 · Rosso et al. · 2018 [cited by applicant]
US 20190033923A1 · Wang · 2019 [cited by examiner]
US 20190073079A1 · Xu et al. · 2019 [cited by applicant]
US 20190278232A1 · Ely et al. · 2019 [cited by applicant]
US 20200057421A1 · Trikha · 2020 [cited by examiner]
US 20200073477A1 · Pandya · 2020 [cited by applicant]
US 20200251648A1 · Fukumoto · 2020 [cited by applicant]
US 20200278747A1 · Ligtenberg · 2020 [cited by examiner]
US 20200328614A1 · Jackson et al. · 2020 [cited by applicant]
US 20210157411A1 · Bushnell et al. · 2021 [cited by applicant]
US 20210176548A1 · Fenner et al. · 2021 [cited by applicant]
US 20210319894A1 · Sobol et al. · 2021 [cited by applicant]
US 20210398403A1 · Ostdiek et al. · 2021 [cited by applicant]
US 20220214790A1 · Zhang · 2022 [cited by examiner]
US 20230377430A1 · Ostdiek et al. · 2023 [cited by applicant]
US 20230384863A1 · Bushnell et al. · 2023 [cited by applicant]
US 20240064447A1 · Fenner et al. · 2024 [cited by applicant]
US 20240404377A1 · Ostdiek et al. · 2024 [cited by applicant]