IP Library › Granted Patent US 10,776,402
Granted Patent B2
US 10,776,402 · App. 15/820,662 · Granted Sep 15, 2020

Manufacture parameters grouping and analyzing method, and manufacture parameters grouping and analyzing system

Inventors: Li-Chin Wang (Tainan, TW); Ya-Ching Cheng (Hsinchu, TW); Chien-Hung Chen (Xinpu Township, Hsinchu County, TW); Chun-Liang Hou (Zhubei, TW); Da-Ching Liao (Taichung, TW)
Assignee: UNITED MICROELECTRONICS CORP.
G06F16/285G05B19/4183G05B2219/31318
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Quick Facts
Patent No.
US 10,776,402
App. No.
15/820,662
Granted
Sep 15, 2020
Kind
B2
Abstract

A manufacture parameters grouping and analyzing method, and a manufacture parameters grouping and analyzing system are provided. The manufacture parameters grouping and analyzing method includes the following steps: A plurality of process factors are classified into a plurality of groups. In each of the groups, an intervening relationship between any two of the process factors is larger than a predetermined correlation value. In each of the groups, at least one representative factor is selected from each of the groups according to a plurality of outputting relationships of the process factors related to an output factor or a plurality of sample amounts of the process factors. Finally, the representative factor is used for various applications.

Claims (30)

1. A manufacture parameters grouping and analyzing method, comprising:

classifying a plurality of process factors into a plurality of groups, wherein in each of the groups according to a Highly Correlated Covariates Grouping (HCCG) algorithm, an intervening relationship between any two of the process factors is larger than a predetermined correlation value; and

selecting at least one representative factor from each of the groups according to a plurality of outputting relationships of the process factors related to an output factor or a plurality of sample amounts of the process factors;

wherein in each of the groups, one of the at least one representative factor corresponds to the highest of the outputting relationships of the process factors related to the output factor and the largest of the sample amounts of the process factors; and

wherein each of the outputting relationships of the process factors is a R-square, a Pearson's correlation coefficient, a Spearman's correlation coefficient, or a P value of Chi-square test, and the output factor is a yield of a semiconductor wafer.

2. The manufacture parameters grouping and analyzing method according to claim 1 , further comprising:

filtering some of the process factors according to the sample amounts of the process factors.

3. The manufacture parameters grouping and analyzing method according to claim 1 , further comprising:

calculating the outputting relationship of each of the process factors; and

classifying the process factors into a plurality of clusters according to the outputting relationships.

4. The manufacture parameters grouping and analyzing method according to claim 3 , wherein the step of classifying the process factors into the groups is performed once for each of the clusters.

5. The manufacture parameters grouping and analyzing method according to claim 1 , wherein in the step of classifying the process factors into the groups, some of the process factors are selected to be classified into one of the groups according to the intervening relationships of the process factors.

6. The manufacture parameters grouping and analyzing method according to claim 5 , wherein each of the intervening relationships of the process factors which are selected is higher than the predetermined correlation value.

7. The manufacture parameters grouping and analyzing method according to claim 1 , further comprising:

dividing the process factors into a plurality of parts;

wherein the step of classifying the process factors into the groups and the step of selecting the representative factor are performed in each of the parts, the steps of classifying the process factors into the groups are performed in parallel, the steps of selecting the representative factor are performed in parallel.

8. A manufacture parameters grouping and analyzing system, comprising:

a grouping unit for classifying a plurality of process factors into a plurality of groups, wherein in each of the groups according to a Highly Correlated Covariates Grouping (HCCG) algorithm, an intervening relationship between any two of the process factors is larger than a predetermined correlation value; and

a representative unit for selecting at least one representative factor from each of the groups according to a plurality of outputting relationships of the process factors related to an output factor or a plurality of sample amounts of the process factors;

wherein in each of the groups, one of the at least one representative factor corresponds to the highest of the outputting relationships of the process factors related to the output factor and the largest of the sample amounts of the process factors; and

wherein each of the outputting relationships of the process factors is a R-square, a Pearson's correlation coefficient, a Spearman's correlation coefficient, or a P value of Chi-square test, and the output factor is a yield of a semiconductor wafer.

9. The manufacture parameters grouping and analyzing system according to claim 8 , further comprising:

a filtering unit for filtering some of the process factors according to the sample amounts of the process factors.

10. The manufacture parameters grouping and analyzing system according to claim 8 , further comprising:

an outputting relationship calculating unit for calculating the outputting relationship of each of the process factors related to the output factor; and

a cluster grouping unit for classifying the process factors into a plurality of clusters according to the outputting relationships.

11. The manufacture parameters grouping and analyzing system according to claim 10 , wherein the grouping unit classifies the process factors into the groups once for each of the clusters.

12. The manufacture parameters grouping and analyzing system according to claim 8 , wherein the grouping unit selects some of the process factors to be classified into one of the groups according to the intervening relationships of the process factors.

13. The manufacture parameters grouping and analyzing system according to claim 12 , wherein each of the intervening relationships of the process factors which are selected is higher than the predetermined correlation value.

14. The manufacture parameters grouping and analyzing system according to claim 8 , wherein a controlling unit is used for dividing the process factors into a plurality of parts, the process factors in the parts are classified into the groups in parallel and the representative factors of the groups in the parts are selected in parallel.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2017
From: WANG, LI-CHIN; CHENG, YA-CHING; CHEN, CHIEN-HUNG; HOU, CHUN-LIANG; LIAO, DA-CHING
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 044198/0067 →
Priority Claims (1)
TW 106132141 A · Sep 19, 2017 · national
Continuity (1)
Related Publication 20190087481A1 · Mar 21, 2019
Cited By (1)
US 12,462,172