IP Library › Granted Patent US 10,783,347
Granted Patent B2
US 10,783,347 · App. 16/575,180 · Granted Sep 22, 2020

Capacitive sensor packaging

Inventors: Benjamin J. Pope (Mountain View, CA); Shawn Arnold (Santa Cruz, CA); Barry J. Corlett (Brisbane, CA); Terry L. Gilton (Boise, ID); Syed Husaini (Sunnyvale, CA); Steven Webster (Singapore, HK); Scott A. Myers (Saratoga, CA); Matthew D. Hill (Santa Clara, CA); Benjamin B. Lyon (Saratoga, CA)
Assignee: Apple Inc.
G06K9/00087G06F3/044G06K9/0002G06K9/0004G06K9/00053G06K9/00073
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Quick Facts
Patent No.
US 10,783,347
App. No.
16/575,180
Granted
Sep 22, 2020
Kind
B2
Abstract

An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

Claims (41)

1. An input assembly for an electronic device, comprising:

a fingerprint sensor;

a molded button above the fingerprint sensor; and

a switch stacked vertically below the fingerprint sensor, wherein:

a force applied to the molded button moves the fingerprint sensor and actuates the switch.

2. The input assembly as in claim 1 , further comprising:

a flexible element coupled to the fingerprint sensor and disposed to receive and transmit the force applied to the molded button to the switch, the flexible element configured to receive and transmit electrical signals from the fingerprint sensor.

3. The input assembly as in claim 2 , further comprising a stiffener element positioned below the flexible element, between the flexible element and the switch.

4. The input assembly as in claim 1 , wherein the switch comprises a tactile dome switch.

5. The input assembly as in claim 1 , further comprising a capacitive plate positioned near the molded button.

6. The assembly as in claim 1 , further comprising at least one of a capacitive plate or a grounding element positioned in a sub-housing including the molded button.

7. The input assembly as in claim 1 , further comprising a grounding element positioned near the molded button.

8. The input assembly as in claim 7 , wherein the grounding element is positioned directly to a side of the fingerprint sensor.

9. The input assembly as in claim 1 , further comprising an electromagnetic shield adjacent the fingerprint sensor.

10. The input assembly as in claim 1 , wherein the fingerprint sensor comprises a grid of capacitive elements.

11. An electronic device, comprising:

a device housing; and

an input assembly coupled to the device housing and comprising:

a fingerprint sensor;

a molded button molded above the fingerprint sensor; and

a switch stacked vertically below the fingerprint sensor, wherein:

a force applied to the molded button moves the fingerprint sensor and actuates the switch.

12. The electronic device as in claim 11 , further comprising:

a flexible element coupled to the fingerprint sensor and disposed to receive and transmit the force applied to the molded button to the switch, the flexible element configured to receive and transmit electrical signals from the fingerprint sensor.

13. The electronic device as in claim 12 , wherein:

the electronic device further comprises a processor; and

the flexible element is operably coupled to the processor and configured to transmit electrical signals from the fingerprint sensor to the processor.

14. The electronic device as in claim 11 , wherein:

the device housing defines an opening; and

the input assembly is at least partially disposed within the opening.

15. The electronic device as in claim 14 , wherein:

the device housing comprises an upper portion and a base portion;

the opening is defined in the upper portion; and

the molded button support plate is coupled to the base portion.

16. The electronic device as in claim 11 , wherein the input assembly further comprises a sub-housing that houses one or more components of the input assembly.

17. The electronic device as in claim 11 , wherein the molded button is formed of plastic.

18. The electronic device as in claim 11 , wherein:

the device housing defines an opening; and

a top surface of the molded button is recessed in the opening.

19. The electronic device as in claim 11 , wherein the fingerprint sensor comprises an optical sensor.

20. The electronic device as in claim 11 , wherein the fingerprint sensor comprises a grid of capacitive elements.

Continuity (10)
Continuation 15985562 · May 21, 2018
Continuation 15684203 · Aug 23, 2017
Continuation 15393610 · Dec 29, 2016
Continuation 15018617 · Feb 8, 2016
Continuation 14855123 · Sep 15, 2015
Continuation 14709388 · May 11, 2015
Continuation 13842920 · Mar 15, 2013
Provisional Application 61649217 · May 18, 2012
Provisional Application 61666607 · Jun 29, 2012
Related Publication 20200110920A1 · Apr 9, 2020