High-density chip-to-chip interconnection with silicon bridge
A package and system for high-density chip-to-chip interconnection is provided. Embodiments of the present invention utilizes a plurality of circuit dies including a laminate substrate adjacent to the plurality of circuit dies. It also includes a conductive spacer disposed between the laminate substrate and one of the plurality of circuit dies, a silicon bridge and a conductive interposer disposed between the laminate substrate and the plurality of dies and adjacent to the conductive spacer. Furthermore the embodiment of this present invention can include a top layer of a printed circuit board (PCB) coupled with a bottom layer of the laminate substrate. The conductive spacer comprises, at least of, a laminate, organic or copper material.
1. A package structure for high-density chip-to-chip interconnection, the package structure comprising:
a plurality of circuit dies;
an upper construct comprising a high bandwidth memory stack and the plurality of circuit dies adjacent to the high bandwidth memory stack in a horizontal alignment;
a lower construct comprising a non-conductive laminate package substrate layer;
one or more non-conductive spacers located between the upper construct and the lower construct, wherein the one or more non-conductive spacers contain an upper spacer construct and a lower spacer construct;
one or more conductive interposers comprising a silicon bridge, wherein the silicon bridge is position between the upper and the lower constructs in parallel with the laminate package substrate layer;
wherein an upper surface of the silicon bridge is electrically and directly coupled, but not embedded, to a first die surface of a predetermined region of the plurality of dies, wherein the first die surface is a bottom side of the plurality of dies and to a second surface of a predetermined region of the high bandwidth memory stack, wherein the second surface is a bottom surface of the high bandwidth memory stack and a lower surface of the silicon bridge adjacent and segregated from the laminate substrate layer and
wherein the upper surface of the silicon bridge is parallel and adjacent to the upper spacer construct and the lower surface of the silicon bridge is parallel to the lower spacer construct; and
wherein the upper spacer construct is directly coupled to the second surface of a predetermined region of the high bandwidth memory stack, the lower spacer construct is directly coupled to the laminate substrate layer.
2. The package structure of claim 1 , wherein the one or more non-conductive spacers comprises a laminate material including a HDV (high-density-via) core with a vertical electrical connection.
3. The package structure of claim 2 , wherein the plurality of circuit dies comprises an element selected from a group consisting of logic or memory dies.
4. The package structure of claim 1 , wherein the one or more non-conductive spacers comprises of a copper material.
5. The package structure of claim 1 , wherein the plurality of circuit dies comprises a logic and a memory.
6. The package structure of claim 1 , wherein the laminate material comprises an ultra thin core (UTC).
7. A system for high-density chip-to-chip interconnection, the system comprising:
a plurality of circuit dies;
an upper construct comprising a high bandwidth memory stack and the plurality of circuit dies adjacent to the high bandwidth memory stack in a horizontal alignment; a lower construct comprising a non-conductive laminate package substrate layer;
one or more non-conductive spacers located between the upper and the lower constructs, wherein the one or more non-conductive spacers contain an upper spacer construct and a lower spacer construct;
one or more conductive interposer comprising a silicon bridge position between the upper and the lower constructs in parallel with the laminate package substrate layer,
wherein an upper surface of the silicon bridge is electrically and directly coupled, but not embedded, to a first die surface of a predetermined region of the plurality of dies, wherein the first die surface is a bottom side of the plurality of dies and to a second predetermined region of the high bandwidth memory stack, wherein the second surface is a bottom surface of the high bandwidth memory stack and a lower surface of the silicon bridge adjacent and segregated from the laminate substrate layer;
wherein the upper spacer construct is directly coupled to the second surface of a predetermined region of the high bandwidth memory stack, the lower spacer construct is directly coupled to the laminate substrate layer
and wherein the one or more conductive interposers comprises a conductive organic material and TSV (through-silicon-via); and
a top layer of a printed circuit board (PCB) coupled but not embedded with a bottom layer of the laminate package substrate layer.
8. The system of claim 7 , wherein the one or more spacers comprises a conductive laminate material including a HDV core with a vertical electrical connection.
9. The system of claim 7 , wherein the one or more spacers comprises a conductive laminate material.
10. The system of claim 9 , wherein the plurality of circuit dies comprises an element selected from a group consisting of a central processing unit (CPU), a graphics processing unit (GPU) and application specific integrated circuit (ASIC).
11. The system of claim 9 , wherein the one or more spacers comprises a conductive organic material.
12. The system of claim 11 , wherein the conductive organic material comprises a vertical electrical connection.
13. The system of claim 9 , wherein the one or more spacers comprises a copper material.
14. The system of claim 9 , wherein the laminate material comprises an ultra thin core (UTC).
15. The system of claim 7 , wherein the plurality of circuit dies comprises a high memory bandwidth memory (HBM).