Light emitting device reflective bank structure
Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
1. A light emitting structure comprising:
a substrate;
an insulating layer on the substrate;
an array of bank openings in the insulating layer, each bank opening including a bottom surface and sidewalls;
a patterned reflective layer covering the bottom surface of each of the bank openings;
a corresponding bonding layer on the patterned reflective layer on the bottom surface of each bank opening; and
a corresponding array of vertical light emitting diode devices mounted within the array of bank openings.
2. The light emitting structure of claim 1 , wherein each vertical light emitting diode device in the array of vertical light emitting diode devices has a maximum width of 1 μm-100 μm.
3. The light emitting structure of claim 2 , wherein each vertical light emitting diode device in the array of vertical light emitting diode devices includes a micro p-n diode that includes a top p-doped or n-doped layer, a lower p-doped or n-doped layer, and one or more quantum well layers between the top and lower p-doped or n-doped layers, and wherein the micro p-n diode includes one or more layers based on II-VI materials or III-V materials.
4. The light emitting structure of claim 3 , wherein no vertical light emitting diode device spans along a sidewall of a corresponding bank opening.
5. The light emitting structure of claim 1 , wherein the patterned reflective layer spans the sidewalls of each of the bank openings.
6. The light emitting structure of claim 5 , wherein the patterned reflective layer completely covers the sidewalls of each of the bank openings.
7. The light emitting structure of claim 6 , wherein the patterned reflective layer completely covers the bottom surface of each of the bank openings.
8. The light emitting structure of claim 1 , wherein each vertical light emitting diode is bonded to the patterned reflective layer with a corresponding bonding layer.
9. The light emitting structure of claim 8 , wherein each bonding layer comprises a material selected from the group consisting of indium, gold, silver, molybdenum, tin, aluminum, and silicon.
10. The light emitting structure of claim 8 , further comprising a sidewall passivation layer formed around the array of vertical light emitting diodes within the array of bank openings.
11. The light emitting structure of claim 10 , further comprising a via layer extending through the insulating layer and in electrical connection with an electrical line in the substrate.
12. The light emitting structure of claim 11 , further comprising a top conductive contact layer in electrical contact with the array of vertical light emitting diodes and the via layer.
13. The light emitting structure of claim 10 , wherein the electrical line is a cathode line.
14. The light emitting structure of claim 10 , wherein the array of bank openings is arranged display with a pixel density greater than 40 pixels per inch.