IP Library Granted Patent US 10,784,358
Granted Patent B2
US 10,784,358 · App. 15/747,119 · Granted Sep 22, 2020

Backside contact structures and fabrication for metal on both sides of devices

Inventors: Patrick Morrow (Portland, OR); Rishabh Mehandru (Portland, OR); Aaron D. Lilak (Beaverton, OR); Kimin Jun (Hillsboro, OR)
Assignee: Intel Corporation
H01L29/41791H01L21/823431H01L27/1266H01L29/0847H01L29/401H01L29/4236H01L29/6653H01L29/66553H01L29/66795H01L29/66803H01L29/78H01L29/785H01L21/2254H01L21/26513H01L29/66545
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Quick Facts
Patent No.
US 10,784,358
App. No.
15/747,119
Granted
Sep 22, 2020
Kind
B2
Abstract

An apparatus including a circuit structure including a device stratum including a plurality of devices including a first side and an opposite second side; and a metal interconnect coupled to at least one of the plurality of devices from the second side of the device stratum. A method including forming a transistor device including a channel between a source region and a drain region and a gate electrode on the channel defining a first side of the device; and forming an interconnect to one of the source region and the drain region from a second side of the device.

Claims (7)

1. An apparatus comprising:

a circuit structure comprising a device stratum comprising a plurality of devices, the device stratum comprising a first side and an opposite second side, wherein at least one of the plurality of devices comprises a transistor device, the transistor device having a gate, a source region, a drain region, and a channel region between the source region and the drain region, and wherein the source region and the drain region are both in the first side of the device stratum;

a first metal interconnect coupled to one of the source region or the drain region of the transistor device by a first contact from the second side of the device stratum; and

a second metal interconnect coupled to the one of the source region or the drain region of the transistor device by a second contact from the first side of the device stratum, wherein the second contact vertically overlaps the first contact.

2. The apparatus of claim 1 , further comprising a third metal interconnect coupled to the other of the source or the drain of the transistor device from the second side of the device stratum.

3. The apparatus of claim 1 , further comprising a third metal interconnect coupled to the gate of the transistor device from the first side of the device stratum.

4. The apparatus of claim 1 , wherein the one of the source and the drain at a point of coupling to the metal interconnect comprises one of a material epitaxially grown on the one of the source and the drain and a material of the one of the source and the drain modified by one of an implanting of a material and a doping with a material.

Continuity (1)
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