Air-gap type film bulk acoustic resonator and method of manufacturing the same
Disclosed is an air gap type film bulk acoustic resonator (FBAR). The air gap type FBAR includes a substrate which includes an air gap portion in a top surface thereof, a lower electrode formed on the substrate, a piezoelectric layer formed on the lower electrode, and an upper electrode formed on the piezoelectric layer. Here, the lower electrode includes a first lower electrode formed spaced apart from the air gap portion in the substrate and a second lower electrode formed on the substrate to be separated from the first lower electrode by being stacked to surround only a part of a top of the air gap portion in order to form a non-deposition area of the air gap portion.
1. An air gap type film bulk acoustic resonator (FBAR) comprising:
a substrate which comprises an air gap portion in a top surface thereof;
a lower electrode formed on the substrate;
a piezoelectric layer formed on the lower electrode; and
an upper electrode formed on the piezoelectric layer,
wherein the lower electrode comprises:
a first lower electrode formed spaced apart from the air gap portion in the substrate; and
a second lower electrode formed on the substrate to be separated from the first lower electrode and to include a non-deposition area of the air gap portion by being deposited to surround only a part of a top of the air gap portion;
wherein the piezoelectric layer comprises a channel portion having an air space formed between the lower electrode and the upper electrode near the non-deposition area, and the channel portion is formed to allow a vertical surface or a virtual vertical surface which extends from a channel boundary barrier on one side, which forms the air space, to meet the substrate or the non-deposition area of the air gap portion.
2. The air gap type FBAR of claim 1 , wherein the non-deposition area is an area corresponding to a separation distance between a gap edge of the air gap portion and an electrode edge of the second lower electrode.
3. The air gap type FBAR of claim 1 , wherein the channel portion comprises a complete air space formed by exposing both an upper section of the lower electrode and a lower section of the upper electrode.
4. The air gap type FBAR of claim 1 , wherein the channel portion comprises a partial air space in which a lower section of the upper electrode is exposed and an upper side of the lower electrode is not exposed.
5. The air gap type FBAR of claim 1 , wherein the channel portion comprises a first virtual line segment formed by the vertical surface or the virtual vertical surface and the substrate which meet each other and located between an electrode edge of the first lower electrode and a gap edge of the air gap portion.
6. The air gap type FBAR of claim 1 , wherein the channel portion comprises a second virtual line segment formed by the vertical surface or the virtual vertical surface and the non-deposition area which meet each other and located between a gap edge of the air gap portion and an electrode edge of the second lower electrode.