Package substrates with integral devices
Disclosed herein are package substrates with integrated components, as well as related apparatuses and methods. For example, in some embodiments, an integrated circuit (IC) package, may include: a substrate having opposing first and second faces, an insulating material disposed between the first and second faces, and a thin film transistor (TFT) disposed between the first and second faces, wherein a conductive portion of the TFT is disposed on a layer of the insulating material, and the conductive portion of the TFT is a gate, source, or drain of the TFT; and a die coupled to the first face of the substrate.
1. An integrated circuit (IC) package, comprising:
a substrate having opposing first and second faces, an insulating material between the first face and the second face, and a thin film transistor (TFT) between the first face and the second face, wherein a conductive portion of the TFT is on a layer of the insulating material, and the conductive portion of the TFT is a gate, source, or drain of the TFT; and
a die coupled to the first face of the substrate;
wherein the substrate further includes a capacitor between the first face and the second face, the capacitor includes first and second plates, and the second plate is thicker than the first plate; and
wherein the TFT includes a high-k dielectric material having a higher dielectric constant than the insulating material, the TFT includes a channel including a semiconductor material, and the high-k dielectric material is between the gate of the TFT and the channel of the TFT.
2. The IC package of claim 1 , wherein the die is electrically coupled to the TFT through the substrate.
3. The IC package of claim 1 , wherein the substrate further includes electrical pathways between the first face and the second face.
4. The IC package of claim 1 , wherein at least some of the capacitor is coplanar with at least some of the TFT.
5. The IC package of claim 1 , wherein a thickness of the first plate is equal to a thickness of the gate of the TFT.
6. The IC package of claim 1 , wherein a thickness of the first plate is equal to a thickness of a conductive line in the substrate.
7. The IC package of claim 1 , wherein a thickness of the first plate is equal to a sum of a thickness of a conductive line in the substrate and a thickness of a conductive via in the substrate.
8. The IC package of claim 1 , wherein a thickness of the gate, source, or drain of the TFT is equal to a thickness of a conductive line in the substrate.
9. The IC package of claim 1 , wherein the TFT is a first TFT, and the IC package further includes:
a second TFT, different from the first TFT, wherein the first TFT is spaced apart from the first face by a first distance, and the second TFT is spaced apart from the first face by a second distance different from the first distance.
10. A computing device, comprising:
a circuit board; and
an integrated circuit (IC) package on the circuit board, wherein the IC package includes:
a substrate having opposing first and second faces, an insulating material between the first face and the second face, and a thin film transistor (TFT) between the first face and the second face, wherein a conductive portion of the TFT is on a layer of the insulating material, and the conductive portion of the TFT is a gate, source, or drain of the TFT; and
a die coupled to the first face of the substrate;
wherein the substrate further includes a capacitor between the first face and the second face, the capacitor includes first and second plates, and the second plate is thicker than the first plate; and
wherein the TFT includes a high-k dielectric material having a higher dielectric constant than the insulating material, the TFT includes a channel including a semiconductor material, and the high-k dielectric material is between the gate of the TFT and the channel of the TFT.
11. The computing device of claim 10 , wherein the TFT is part of a power management circuit, a sensor circuit, or an input/output management circuit.
12. An integrated circuit (IC) package, comprising:
a substrate having opposing first and second faces, an insulating material between the first face and the second face, and a thin film transistor (TFT) between the first face and the second face, wherein a conductive portion of the TFT is on a layer of the insulating material, and the conductive portion of the TFT is a gate, source, or drain of the TFT; and
a die coupled to the first face of the substrate;
wherein the substrate further includes a capacitor between the first face and the second face, the substrate further includes a conductive line between the first face and the second face, the substrate further includes a conductive via between the first face and the second face, and a thickness of a plate of the capacitor is equal to a sum of a thickness of the conductive line in the substrate and a thickness of the conductive via in the substrate.
13. The IC package of claim 12 , wherein the capacitor includes a dielectric material having a higher dielectric constant than the insulating material.
14. The IC package of claim 13 , wherein a material is between the dielectric material and at least one plate of the capacitor, and the material includes silicon and oxygen, silicon and nitrogen, or carbon.
15. The IC package of claim 12 , wherein the TFT includes an organic semiconductor material.
16. The IC package of claim 12 , wherein the conductive portion of the TFT has a thickness between 1 and 10 microns.
17. An integrated circuit (IC) package, comprising:
a substrate including:
opposing first and second faces,
an insulating material between the first face and the second face,
a first thin film transistor (TFT) between the first face and the second face,
a second TFT, different from the first TFT, between the first face and the second face,
wherein a conductive portion of the first TFT is on a layer of the insulating material, and the conductive portion of the first TFT is a gate, source, or drain of the TFT, and
wherein the first TFT is spaced apart from the first face by a first distance, and the second TFT is spaced apart from the first face by a second distance different from the first distance; and
a die coupled to the first face of the substrate;
wherein the substrate further includes a capacitor between the first face and the second face, the capacitor includes first and second plates, and the second plate is thicker than the first plate.
18. The IC package of claim 17 , wherein a thickness of the first plate is equal to a sum of a thickness of a conductive line in the substrate and a thickness of a conductive via in the substrate.
19. The IC package of claim 17 , wherein the first TFT includes a high-k dielectric material having a higher dielectric constant than the insulating material, the TFT includes a channel including a semiconductor material, and the high-k dielectric material is between the gate of the TFT and the channel of the TFT.
20. The IC package of claim 17 , wherein the insulating material includes an organic material.
21. The IC package of claim 17 , wherein the insulating material includes an epoxy.
22. The IC package of claim 17 , wherein the first TFT includes a photoimageable dielectric material.
23. The IC package of claim 17 , wherein a thickness of the first plate is equal to a sum of a thickness of a conductive line in the substrate and a thickness of a conductive via in the substrate.