Memory device with a plurality of stacked memory core chips

1. A memory device comprising:

a first memory chip including a first circuit, a first terminal, and a second terminal;

a second memory chip including a second circuit and a third terminal; and

an interface chip including an input/output circuit for data, a first voltage generation circuit and a second voltage generation circuit, wherein:

the second memory chip is provided above the first memory chip;

the interface chip is provided below the first memory chip;

the input/output circuit is provided in a first region of the interface chip;

the first and second voltage generation circuits are provided in a second region of the interface chip;

a third region is provided between the first region and the second region;

the third region electrically isolates the first region from the second region;

a first end of the first terminal is electrically connected to the first circuit and a second end of the first terminal is electrically connected to the first voltage generation circuit;

a third end of the second terminal is electrically connected to the third terminal and a fourth end of the second terminal is electrically connected to the second voltage generation circuit;

a fifth end of the third terminal is electrically connected to the second circuit and a sixth end of the third terminal is electrically connected to the second voltage generation circuit via the second terminal; and

in a direction perpendicular to a surface of the first memory chip, the third end overlaps with the sixth end, without overlapping with the fourth end.

2. The memory device according to claim 1 , wherein

the input/output circuit is electrically connected to a first power supply via a first interconnect;

the first and second voltage generation circuits are electrically connected to a second power supply via a second interconnect; and

the first interconnect is electrically isolated from the second interconnect.

3. The memory device according to claim 1 , wherein:

the second memory chip further includes a fourth terminal;

the first terminal is adjacent to the first circuit;

the second terminal is electrically isolated from the first terminal;

the third terminal is adjacent to the second circuit;

the fourth terminal is electrically isolated from the third terminal; and

a structure of the second memory chip is the same as a structure of the first memory chip.

4. The memory device according to claim 1 ,

further comprising a third memory chip provided above the second memory chip, wherein:

the first memory chip further includes a fifth terminal electrically isolated from the first and second terminals;

the second memory chip further includes a sixth terminal electrically isolated from the third terminal;

the interface chip further includes a third voltage generation circuit;

the third memory chip includes a third circuit, and a seventh terminal electrically connected to the third circuit; and

the seventh terminal is electrically connected to the third voltage generation circuit via the fifth and sixth terminals.

5. A memory device comprising:

a memory core circuit including a first driver circuit for transmitting first data and a first circuit for outputting a first signal indicating a state of the first driver circuit;

an interface circuit including a first receiver circuit for receiving the first data, a second driver circuit for transmitting second data to the memory core circuit, and a second circuit for outputting a second signal indicating a state of the first receiver circuit and a state of the second driver circuit; wherein

when the first data is transmitted from the memory core circuit to the interface circuit,

the memory core circuit sets a signal level of the first signal to a first level to indicate that the first driver circuit is in an active state, and

the interface circuit sets the first receiver circuit in the active state based on the first signal of the first level before the first signal is set to the first level,

the interface circuit sets the signal level of the second signal to a second level different from the first level to indicate that the second driver circuit is in a non-active state, and

the memory core circuit sets the first driver circuit to the active state based on the second signal of the second level.

6. The memory device according to claim 5 , wherein a signal level of the second signal is set to the first level to indicate that the first receiver circuit is in the active state.

7. The memory device according to claim 6 , wherein:

when the second data is transmitted from the interface circuit to the memory core circuit,

the interface circuit sets the second driver circuit to the active state based on the first signal set to the second level, and

the interface circuit sets the signal level of the second signal to the first level to indicate that the second driver circuit is in the active state.

8. The memory device according to claim 7 , wherein the memory core circuit sets the signal level of the first signal to the second level after the first driver circuit is set to the non-active state.

9. The memory device according to claim 5 , wherein:

the first driver circuit is controlled based on a first control signal from the first circuit;

the first receiver circuit is controlled based on a second control signal from the second circuit;

the first circuit sets a signal level of the first control signal to the first level based on the second signal of a second level different from the first level;

the first driver circuit is set to the active state based on the first control signal of the first level;

the second circuit sets a signal level of the second control signal to the first level based on the first signal of the first level; and

the first receiver circuit is set to the active state based on the second control signal of the first level.