Semiconductor device structure and method for forming the same
A method for forming a semiconductor device structure is provided. The method includes forming a dielectric layer over a substrate. The dielectric layer has a trench passing through the dielectric layer. The method includes forming a gate stack in the trench. The method includes performing a hydrogen-containing plasma process over the gate stack. The method includes removing a top portion of the gate stack to form a first recess surrounded by the gate stack and the dielectric layer. The method includes forming a cap layer in the first recess to fill the first recess.
1. A device comprising:
a substrate;
a dielectric layer over the substrate;
a first gate stack in the dielectric layer;
a first cap layer over the first gate stack, wherein the first gate stack has a first hydrogen-containing portion at an interface between the first gate stack and the first cap layer, and wherein a bottommost surface of the first cap layer is below a topmost surface of the first gate stack; and
a gate spacer between the first gate stack and the dielectric layer, wherein the gate spacer has a second hydrogen-containing portion, and wherein a topmost surface of the second hydrogen-containing portion is spaced apart from a major surface of the substrate by a greater distance than a topmost surface of the first hydrogen-containing portion.
2. The device of claim 1 , wherein the dielectric layer has a third hydrogen-containing portion adjacent the first cap layer.
3. The device of claim 2 , wherein a topmost surface of the third hydrogen-containing portion is level with the topmost surface of the second hydrogen-containing portion.
4. The device of claim 1 , wherein the first gate stack includes from about 0.01 mol % of carbon to about 9 mol % of carbon.
5. The device of claim 1 , wherein the first gate stack includes from about 0.01 mol % of chlorine to about 1.5 mol % of chlorine.
6. The device of claim 1 , wherein the first hydrogen-containing portion further comprises nitrogen.
7. The device of claim 1 , wherein a bottommost surface of the first hydrogen-containing portion is below the bottommost surface of the first cap layer.
8. A device comprising:
a semiconductor substrate;
a gate stack over the semiconductor substrate, wherein the gate stack comprises:
a gate electrode; and
a first hydrogen-containing portion in the gate electrode; and
one or more gate spacers adjacent the gate stack and comprising a second hydrogen-containing portion, wherein a topmost surface of the second hydrogen-containing portion is spaced apart from a topmost surface of the semiconductor substrate by a greater distance than a topmost surface of the first hydrogen-containing portion, and wherein a bottommost surface of the second hydrogen-containing portion is spaced apart from the topmost surface of the semiconductor substrate by a greater distance than a bottommost surface of the first hydrogen-containing portion.
9. The device of claim 8 , further comprising an insulating cap layer over the gate electrode, wherein the first hydrogen-containing portion surrounds a first portion of the insulating cap layer, and wherein the second hydrogen-containing portion surrounds a second portion of the insulating cap layer, the second portion of the insulating cap layer being above the first portion of the insulating cap layer.
10. The device of claim 9 , wherein a portion of the insulating cap layer extend below a topmost surface of the gate electrode.
11. The device of claim 9 , wherein a bottommost surface of the insulating cap layer is interposed between the bottommost surface of the first hydrogen-containing portion and the bottommost surface of the second hydrogen-containing portion.
12. The device of claim 8 , further comprising a dielectric layer over the semiconductor substrate, the gate stack extending through the dielectric layer, wherein the dielectric layer comprises a third hydrogen-containing portion adjacent the second hydrogen-containing portion.
13. The device of claim 12 , wherein a topmost surface of the third hydrogen-containing portion is level with the topmost surface of the second hydrogen-containing portion.
14. The device of claim 8 , wherein the first hydrogen-containing portion further comprises nitrogen, tungsten, aluminum, gold, platinum, cobalt, carbon, or a combination thereof.
15. A device comprising:
a semiconductor substrate;
a first gate electrode over the semiconductor substrate, wherein the first gate electrode comprises a first hydrogen-containing portion;
a first insulating cap layer on the first gate electrode, wherein a bottommost surface of the first insulating cap layer is below a topmost surface of the first gate electrode;
a dielectric layer surrounding the first insulating cap layer, wherein the dielectric layer has a second hydrogen-containing portion, the second hydrogen-containing portion being above the first hydrogen-containing portion; and
a spacer between the first insulating cap layer and the dielectric layer, wherein the spacer has a third hydrogen-containing portion, the third hydrogen-containing portion being level with the second hydrogen-containing portion.
16. The device of claim 15 , wherein the bottommost surface of the first insulating cap layer is above a bottommost surface of the first hydrogen-containing portion.
17. The device of claim 15 , wherein a topmost surface of the first insulating cap layer is level with a topmost surface of the dielectric layer.
18. The device of claim 15 , wherein the first hydrogen-containing portion has a first concentration of hydrogen, and wherein a portion of the first gate electrode below the first hydrogen-containing portion has a second concentration of hydrogen different from the first concentration of hydrogen.
19. The device of claim 18 , wherein the first concentration of hydrogen is greater than the second concentration of hydrogen.
20. The device of claim 18 , wherein a ratio of the first concentration of hydrogen to the second concentration of hydrogen is in the range of 2 to 100.