Coil component
A coil component includes: a body including a support member, a coil, and a magnetic material; and external electrodes disposed on an external surface of the body. The coil may include first and second coils supported by one surface and the other surface of the support member, respectively, and the first and second coils may include first and second seed patterns, respectively. A thickness of the first seed pattern may be thinner than that of the second seed pattern. Warpage properties of the first support member adjacent to the first seed pattern may be greater than those of the second support member adjacent to the second seed pattern.
1. A coil component comprising:
a body including a support member including a through-hole filled with a magnetic material and a via hole filled with a conductive material, and containing an insulating material; a coil including a first coil disposed on one surface of the support member and a second coil disposed on the other surface of the support member opposing the one surface thereof; and the magnetic material encapsulating the support member and the coil; and
external electrodes disposed on an external surface of the body and connected to the coil,
wherein the first and second coil, respectively, comprise first and second seed patterns, and a thickness of the first seed pattern is thinner than that of the second seed pattern, and
the support member includes a first support member including the one surface of the support member and a second support member including the other surface of the support member.
2. The coil component of claim 1 , wherein warpage properties of the first support member are greater than those of the second support member.
3. The coil component of claim 1 , wherein a coefficient of thermal expansion (CTE) of the first support member is greater than that of the second support member.
4. The coil component of claim 1 , wherein the first support member includes glass, and the second support member does not contain glass.
5. The coil component of claim 4 , wherein the glass is closer to the one surface of the support member than the other surface of the support member.
6. The coil component of claim 4 , wherein the plate of glass extends parallel to the one surface or the other surface of the support member.
7. The coil component of claim 4 , wherein a thickness of the first support member is the same as that of the second support member.
8. The coil component of claim 4 , wherein the glass includes E-glass.
9. The coil component of claim 4 , wherein the glass includes one or more of NE-glass, D-glass, T-glass, and S-glass.
10. The coil component of claim 1 , wherein the thickness of the first seed pattern is 2 μm or more to 5 μm or less.
11. The coil component of claim 1 , wherein the thickness of the second seed pattern is 12 μm or more to 18 μm or less.
12. The coil component of claim 1 , wherein a total thickness of the support member is 35 μm or more to 65 μm or less.
13. The coil component of claim 1 , further comprising a first base layer and a first plating layer disposed on the first seed pattern, and a second base layer and a second plating layer disposed on the second seed pattern.
14. The coil component of claim 13 , wherein the first base layer encloses side surfaces and a lower surface of the via hole of the support member.
15. The coil component of claim 13 , wherein the first plating layer is filled in the via hole.
16. The coil component of claim 13 , wherein the first and second plating layers contain one or more of Mo, Al, Ti, Ni, and W.
17. The coil component of claim 13 , wherein the first base layer is in contact with the first seed layer.
18. The coil component of claim 1 , wherein the first and second support members contain an epoxy.