Electronic component

1. An electronic component comprising:

a capacitor body;

an external electrode disposed on an end of the capacitor body in a first direction and containing copper (Cu) as a main component;

a metal frame connected to the external electrode; and

a bonding member disposed between the external electrode and the metal frame,

wherein the bonding member includes a tin (Sn)-based solder layer;

a tin-copper based alloy solder layer disposed between the tin-based solder layer and the external electrode; and

a tin-based alloy solder layer disposed between the tin-based solder layer and the metal frame.

2. The electronic component of claim 1 , wherein the tin-based solder layer contains copper (Cu).

3. The electronic component of claim 2 , wherein the tin-based solder layer further contains silver (Ag).

4. The electronic component of claim 1 , wherein the metal frame includes at least one selected from the group of nickel (Ni), iron (Fe), copper (Cu), aluminum (Al), chrome (Cr), silver (Ag) and an alloy containing two or more thereof.

5. The electronic component of claim 1 , further comprising a plating layer containing at least one selected from the group of nickel (Ni), tin (Sn), palladium (Pd), silver (Ag) and gold (Au) disposed on a surface of the external electrode.

6. The electronic component of claim 1 , wherein the capacitor body includes:

dielectric layers; and

first and second internal electrodes alternately arranged with each of the dielectric layers interposed therebetween;

the external electrode includes first and second external electrodes disposed on opposite ends of the capacitor body, and

one end portions of the first and second internal electrodes are exposed respectively in the first direction through opposite surfaces of the capacitor body to be electrically connected to the first and second external electrodes, respectively.

7. The electronic component of claim 1 , wherein the external electrode includes:

a head portion disposed on the end surface of the capacitor body in the first direction; and

band portions extending respectively from the head portions to portions of first and second surfaces of the capacitor body opposing each other and to portions of third and fourth surfaces of the capacitor body opposing each other.

8. The electronic component of claim 7 , wherein the metal frame includes:

a support portion bonded to the head portion of the external electrode; and

amount portion extending respectively from an end portion of the support portion in the first direction and disposed to be spaced apart from the capacitor body and the external electrode.

9. The electronic component of claim 7 , wherein areas of the tin-based solder layer and the tin-copper based alloy solder layer are each smaller than the area of the head portion.

10. The electronic component of claim 1 , wherein the external electrode includes first and second external electrodes disposed on opposite ends of the capacitor body in the first direction, the metal frame includes first and second metal frames electrically connected to the first and second external electrodes, respectively, and the bonding member includes a first bonding member disposed between the first external electrode and the first metal frame, and a second bonding member disposed between the second external electrode and the second metal frame.

11. The electronic component of claim 5 , wherein a portion of each plating layer is opened, and the tin-copper based alloy solder layer is disposed in the opened portion of each plating layer.

12. An electronic component comprising:

a capacitor body;

an external electrode disposed on an end of the capacitor body in a first direction and containing copper (Cu) as a main component;

a metal frame electrically connected to the external electrode; and

a bonding member disposed between the external electrode and the metal frame,

wherein the bonding member includes a tin (Sn)-based solder layer and a tin-copper based alloy solder layer; and

the tin-based solder layer is disposed on both sides of the tin-copper based alloy solder layer in a second direction perpendicular to the first direction.

13. The electronic component of claim 12 , wherein the tin-based solder layer further contains antimony (Sb).

14. The electronic component of claim 12 , wherein the tin-based solder layer contains copper (Cu).

15. The electronic component of claim 14 , wherein the tin-based solder layer further contains silver (Ag).

16. The electronic component of claim 14 , wherein the metal frame includes at least one selected from the group of nickel (Ni), iron (Fe), copper (Cu), aluminum (Al), chrome (Cr), silver (Ag) and an alloy containing two or more thereof.

17. The electronic component of claim 14 , further comprising a plating layer containing at least one selected from the group of nickel (Ni), tin (Sn), palladium (Pd), silver (Ag) and gold (Au) disposed on a surface of the external electrode.

18. The electronic component of claim 14 , wherein the capacitor body includes:

dielectric layers; and

first and second internal electrodes alternately arranged with each of the dielectric layers interposed therebetween;

the external electrode includes first and second external electrodes disposed on opposite ends of the capacitor body, and

one end portions of the first and second internal electrodes are exposed respectively in the first direction through opposite surfaces of the capacitor body to be electrically connected to the first and second external electrodes, respectively.