Semiconductor device

1. A semiconductor device, comprising:

a semiconductor substrate;

a first standard cell including a first active region and a second active region; and

a power switching circuit including a first switching transistor electrically connected between a first interconnect and a second interconnect over the semiconductor substrate, and including a first buffer connected to a gate of the first switching transistor, the first buffer including a third active region and a fourth active region, and

wherein the first buffer adjoins, in a plan view, the first standard cell in a first direction,

wherein an arrangement of the first active region matches an arrangement of the third active region in a second direction different from the first direction, and

wherein an arrangement of the second active region matches an arrangement of the fourth active region in the second direction.

2. The semiconductor device according to claim 1 , wherein the power switching circuit includes a first well tap for supplying a substrate potential to the first buffer, and

wherein the first buffer is disposed, in a plan view, between the first well tap and the first standard cell.

3. The semiconductor device according to claim 1 , wherein the first active region and the second active region are arranged side by side in the second direction in a plan view, and

wherein the third active region and the fourth active region are arranged side by side in the second direction in a plan view.

4. The semiconductor device according to claim 1 , further comprising a second standard cell including a fifth active region and sixth active region, and

wherein the power switching circuit is positioned, in a plan view, between the first standard cell and the second standard cell,

wherein the power switching circuit includes a second switching transistor electrically connected between the first interconnect and the second interconnect, and includes a second buffer connected to a gate of the second switching transistor, the second buffer including a seventh active region and an eighth active region,

wherein the second buffer adjoins, in a plan view, the second standard cell in the first direction,

wherein an arrangement of the fifth active region matches an arrangement of the seventh active region in the second direction, and

wherein an arrangement of the sixth active region matches an arrangement of the eighth active region in the second direction.

5. The semiconductor device according to claim 4 , wherein the power switching circuit includes a second well tap for supplying a substrate potential to the second buffer, and

wherein the second buffer is disposed, in a plan view, between the second well tap and the second standard cell.

6. The semiconductor device according to claim 4 , wherein the fifth active region and the sixth active region are arranged side by side in the second direction in a plan view, and

wherein the seventh active region and the eighth active region are arranged side by side in the second direction in a plan view.

7. The semiconductor device according to claim 1 , further comprising:

another first interconnect;

a third interconnect formed over the semiconductor substrate, the third interconnect being disposed, in a plan view, between two first interconnects being the first interconnect and said another first interconnect, the two first interconnects being arranged, in a plan view, in the second direction, the third interconnect being configured to be supplied with a potential different from a potential of the first interconnects; and

a fourth interconnect formed over the semiconductor substrate, the fourth interconnect being electrically connected to a gate electrode of the first switching transistor, the fourth interconnect being formed in a same interconnect layer as the third interconnect, and

wherein in an area where the power switching circuit is situated, the third interconnect includes, in a plan view, two first portions extending in the second direction and a second portion extending in the first direction and being connected to the two first portions, such that the second portion is displaced in the second direction with respect to a position of the third interconnect where the power switching circuit is not situated, and

wherein at least a portion of the fourth interconnect is positioned, in a plan view, between the two first portions.

8. The semiconductor device according to claim 1 , further comprising:

another first interconnect;

a third interconnect formed over the semiconductor substrate, the third interconnect being disposed, in a plan view, between two first interconnects being the first interconnect and said another first interconnect, the two first interconnects being arranged, in a plan view, in the second direction, the third interconnect being configured to be supplied with a potential different from a potential of the first interconnects; and

a fourth interconnect over the semiconductor substrate, the fourth interconnect being formed in an interconnect layer under the third interconnect, the fourth interconnect including a portion connected to a gate electrode of the first switching transistor at a position where the fourth interconnect overlaps the third interconnect in a plan view.

9. The semiconductor device according to claim 7 , further comprising a ninth active region and a tenth active region arranged side by side in the second direction in a plan view, and

wherein in the second direction, a size of the ninth active region matches a size of the tenth active region.

10. The semiconductor device according to claim 9 , wherein in a plan view, a portion of the fourth interconnect overlapping the gate electrode of the first switching transistor is positioned between the ninth active region and the tenth active region in the second direction.