Wafer level package with at least one integrated antenna element

1. A wafer level package with at least one integrated antenna, comprising:

a chip layer with at least one chip;

a dielectric layer with at least one through-connection by means of a via; and

an antenna layer with the at least one integrated antenna arranged between the chip layer and the dielectric layer;

wherein the wafer level package comprises a contacting layer that is arranged on the dielectric layer opposite to the antenna layer;

wherein a shield is arranged on the dielectric layer opposite to the antenna layer or is integrated in the contacting layer;

wherein the chip layer comprises a fan-out area;

wherein the chip layer and/or the dielectric layer comprises a shielding via that is arranged laterally between the at least one integrated antenna and the chip and is configured to shield between the chip and the at least one integrated antenna;

wherein the shielding via is arranged beside the chip;

wherein the wafer level package comprises no redistribution layer; wherein no layer is arranged between the chip layer and the antenna layer so as to enable that the at least one antenna is closely or directly connected to a front end of the chip.

2. The wafer level package according to claim 1 , wherein the at least one integrated antenna is laterally arranged in the antenna layer such that a vertical projection area of the at least one antenna is offset or partly overlapping with respect to a vertical projection area of the at least one chip.

3. The wafer level package according to claim 1 , wherein the integrated antenna is implemented as antenna array or comprises an antenna array.

4. The wafer level package according to claim 1 , wherein the shield in the vertical projection overlaps at least partly with the at least one integrated antenna.

5. The wafer level package according to claim 1 , wherein the dielectric layer is perforated in a part of an area of the at least one integrated antenna.

6. The wafer level package according to claim 1 , wherein the at least one chip comprises a coolant on a side facing away from the dielectric layer.

7. The wafer level package according to claim 1 , wherein the at least one chip is connected to the at least one integrated antenna via an external device.

8. The wafer level package according to claim 1 , wherein the wafer level package comprises a lens that is configured to cooperate with at least one integrated antenna.

9. A system comprising the wafer level package according to claim 1 , wherein a further wafer level package is connected to the wafer level package via the contacting layer.

10. A method for manufacturing a wafer level package with at least one integrated antenna, wherein the wafer level package comprises no redistribution layer, comprising:

providing a dielectric layer with at least one through-connection by means of a via;

arranging an antenna layer with the at least one integrated antenna on the dielectric layer, wherein no layer is arranged between the chip layer and the antenna layer so as to enable that the at least one antenna is closely or directly connected to a front end of the chip;

arranging a chip layer with at least one chip on the antenna layer and a fan-out area;

providing a contacting layer that is arranged on the dielectric layer opposite to the antenna layer;

arranging a shield on the dielectric layer opposite to the antenna layer or integrating a shield in the contacting layer; and

providing a shielding via in the chip layer and/or in the dielectric layer, wherein the shielding via is arranged laterally between the at least one integrated antenna and the chip and is configured to shield between the chip and the at least one integrated antenna, wherein the shielding via is arranged beside the chip.