Coil manufacturing device and coil manufacturing method
A coil manufacturing device for manufacturing a coil by rotating a winding core and winding a wire around the rotating winding core, the coil manufacturing device includes a recess formed in the winding core, the recess being configured to suspend the wire wound around the winding core in the recess; and a wire bundling device configured to bundle the wire suspended in the recess.
1. A coil manufacturing device for manufacturing a coil by rotating a winding core and winding a wire around the rotating winding core, the coil manufacturing device comprising:
a recess formed in the winding core, the recess being configured to suspend the wire wound around the winding core in the recess; and
a wire bundling device configured to bundle the wire suspended in the recess,
wherein
the winding core includes:
a winding barrel having the wire wound therearound;
a fixed-side flange placed at one end of the winding barrel; and
a movable-side flange placed at another end of the winding barrel, and
the recess includes a cutout formed in a part of an outer periphery of the winding barrel, a cutout formed in a part of an outer periphery of the fixed-side flange, and a cutout formed in a part of an outer periphery of the movable-side flange, the cutouts being continuous in an axial direction.
2. The coil manufacturing device according to claim 1 , wherein
the winding barrel is configured to retract into one of the movable-side flange and the fixed-side flange.
3. The coil manufacturing device according to claim 1 , wherein
the wire bundling device is a taping device for attaching an adhesive tape to the wire, and
the taping device includes:
a pair of suction pieces configured to suck ends of a back surface of the adhesive tape having a predetermined length;
a suction piece moving mechanism configured to move the pair of suction pieces to allow the wire suspended in the recess of the winding core to pass between the pair of suction pieces; and
an approach mechanism configured to cause the pair of suction pieces to approach each other.
4. The coil manufacturing device according to claim 2 , wherein
the wire bundling device is a taping device for attaching an adhesive tape to the wire, and
the taping device includes:
a pair of suction pieces configured to suck ends of a back surface of the adhesive tape having a predetermined length;
a suction piece moving mechanism configured to move the pair of suction pieces to allow the wire suspended in the recess of the winding core to pass between the pair of suction pieces; and
an approach mechanism configured to cause the pair of suction pieces to approach each other.
5. A coil manufacturing device for manufacturing a coil by rotating a winding core and winding a wire around the rotating winding core, the coil manufacturing device comprising:
a recess formed in the winding core, the recess being configured to suspend the wire wound around the winding core in the recess; and
a wire bundling device configured to bundle the wire suspended in the recess,
wherein
the wire bundling device is a taping device for attaching an adhesive tape to the wire, and
the taping device includes:
a pair of suction pieces configured to suck ends of a back surface of the adhesive tape having a predetermined length;
a suction piece moving mechanism configured to move the pair of suction pieces to allow the wire suspended in the recess of the winding core to pass between the pair of suction pieces; and
an approach mechanism configured to cause the pair of suction pieces to approach each other.
6. The coil manufacturing device according to claim 5 , wherein
the taping device further includes a tape feeding mechanism configured to feed the adhesive tape of the predetermined length.
7. A coil manufacturing method for manufacturing a coil using a coil manufacturing device for manufacturing the coil by rotating a winding core and winding a wire around the rotating winding core, the coil manufacturing device comprising:
a recess formed in the winding core, the recess being configured to suspend the wire wound around the winding core in the recess; and
a wire bundling device configured to bundle the wire suspended in the recess,
the coil manufacturing method comprising:
forming the recess in the winding core, the recess configured to suspend the wire wound around the winding core in the recess; and
bundling the wire suspended in the recess after winding the wire around the winding core,
wherein
the bundling the wire is taping whereby an adhesive tape is attached to the wire, and
in the taping, the adhesive tape having a predetermined length is attached to the wire suspended in the recess by:
moving a pair of suction pieces sucking ends of a back surface of the adhesive tape of the predetermined length;
allowing the wire suspended in the recess of the winding core to pass between the pair of suction pieces; and
then causing the pair of suction pieces to approach each other.