Micro-electro-mechanical systems (MEMS) device and method for fabricating the MEMS
A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
1. A Micro-Electro-Mechanical Systems (MEMS) device, comprising: a substrate, having a substrate opening corresponding to a diaphragm region;
a dielectric supporting layer, disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region;
a diaphragm, within the dielectric opening, held by the dielectric supporting layer at a periphery; and
a first backplate, disposed on the dielectric supporting layer, having a plurality of first venting holes, connecting to the dielectric opening, wherein the first backplate comprises a first conductive layer and a first passivation layer covered by the first conductive layer at a side opposite to the diaphragm, wherein the first passivation layer has a first central portion and a first peripheral portion, the first central portion is corresponding to the diaphragm region to provide a first anti-sticky structure and the first peripheral portion is on the dielectric supporting layer and covered by a first peripheral portion of the first conductive layer.
2. The MEMS device of claim 1 , further comprising a second backplate, between the substrate and the diaphragm, held by the dielectric supporting layer at a periphery as embedded, having a plurality of second venting holes, connecting between the substrate opening and the dielectric opening.
3. The MEMS device of claim 2 , wherein the second backplate comprises a second conductive layer and a second passivation layer covered by the second conductive layer at a side opposite to the diaphragm, wherein the second passivation layer has a second central portion and a second peripheral portion, the second central portion is corresponding to the diaphragm region to provide a second anti-sticky structure and the second peripheral portion with the second conductive layer is embedded in the dielectric supporting layer.