Electronics package with integrated interconnect structure and method of manufacturing thereof
An electronics package includes an insulating substrate, an electrical component having an active surface coupled to a first surface of the insulating substrate, and an insulating structure disposed adjacent the electrical component on the first surface of the insulating substrate. A first wiring layer is formed on a top surface of the insulating structure and extends down at least one sloped side surface of the insulating structure. A second wiring layer is formed on a second surface of the insulating substrate. The second wiring layer extends through a plurality of vias in the insulating substrate to electrically couple at least one contact pad on the active surface of the electrical component to the first wiring layer.
1. An electronics package comprising:
an insulating substrate;
an electrical component having an active surface coupled to a first surface of the insulating substrate;
an insulating structure disposed adjacent the electrical component on the first surface of the insulating substrate;
a first wiring layer formed on a top surface of the insulating structure and extending down at least one sloped side surface of the insulating structure; and
a second wiring layer formed on a second surface of the insulating substrate, the second wiring layer extending through a plurality of vias in the insulating substrate to electrically couple at least one contact pad on the active surface of the electrical component to the first wiring layer.
2. The electronics package of claim 1 wherein the first wiring layer comprises:
a first electrical trace electrically coupled to a first contact pad on the active surface of the electrical component; and
a second electrical trace electrically coupled to a second contact pad on the active surface of the electrical component.
3. The electronics package of claim 2 wherein the first electrical trace extends down a first sloped side surface of the insulating structure; and
wherein the second electrical trace is positioned adjacent the first electrical trace on the first sloped side surface of the insulating structure.
4. The electronics package of claim 1 further comprising an insulating material surrounding the electrical component and the at least one sloped side surface of the insulating structure; and
wherein a top surface of the first wiring layer is exposed through the insulating material.
5. The electronics package of claim 1 further comprising:
an insulating material surrounding the insulating structure and the electrical component; and
a third wiring layer formed on a top surface of the insulating material and extending through a via therein to electrically couple with the first wiring layer.
6. The electronics package of claim 1 wherein the insulating structure is substantially trapezoidal.
7. The electronics package of claim 1 wherein the electrical component comprises a semiconductor device, and wherein the active surface of the semiconductor device faces the first surface of the insulating substrate and is coupled thereto.
8. A method of manufacturing an electronics package comprising:
coupling an electrical component to a first surface of an insulating substrate;
disposing an insulating structure on the first surface of the insulating substrate;
forming a first wiring layer on a top surface and at least one sloped side surface of the insulating structure; and
forming a second wiring layer on a second surface of the insulating substrate, the second wiring layer electrically coupling at least one contact pad of the electrical component to the first wiring layer through a plurality of vias in the insulating substrate.
9. The method of claim 8 further comprising patterning the first wiring layer to define a plurality of electrical traces.
10. The method of claim 8 further comprising positioning the insulating structure adjacent to and spaced apart from the electrical component on first surface of the insulating substrate.
11. The method of claim 8 further comprising disposing the insulating structure to surround or substantially surround a perimeter of the electrical component.
12. The method of claim 8 further comprising:
applying a photo-patternable material to the first surface of the insulating substrate;
disposing a mask atop the photo-patternable material; and
directing light onto the mask to selectively cure at least one region of the photo-patternable material and form the insulating structure.
13. The method of claim 8 wherein disposing the insulating structure on the first surface of the insulating substrate comprises direct deposition of insulating material in sequential steps.
14. The method of claim 8 wherein disposing the insulating structure on the first surface of the insulating substrate comprises adhesively coupling a pre-fabricated insulating structure to the insulating substrate.
15. An electrical package comprising:
an electrical component coupled to a first surface of an insulating substrate;
an insulating structure encapsulating at least a portion of a back surface and at least one side wall defining a perimeter of the electrical component, the insulating structure having at least one sloped side surface abutting the perimeter of the electrical component;
a first wiring layer formed on the at least one sloped side surface of the insulating structure and extending over a top surface of the electrical component; and
a second wiring layer formed on a second surface of the insulating substrate and extending through vias formed therein to electrically couple at least one contact pad on an active surface of the electrical component to the first wiring layer.
16. The electrical package of claim 15 wherein the first wiring layer comprises a plurality of electrical traces, each having a first terminal pad positioned above the back surface of the electrical component and a second terminal pad positioned on the first surface of the insulating substrate.
17. The electrical package of claim 15 further comprising an insulating material surrounding the insulating structure and the first wiring layer.
18. The electrical package of claim 17 further comprising a support structure embedded within the insulating material, the support structure having an opening formed therein surrounding the insulating structure.
19. The electrical package of claim 17 further comprising a third wiring layer formed on a top surface of the insulating material and electrically coupled to the first wiring layer through at least one via formed in the insulating material.
20. The electrical package of claim 15 wherein the first wiring layer comprises a first electrical trace that electrically couples with the back surface of the electrical component through a metalized via in the insulating structure.
21. The electrical package of claim 15 further comprising a passive component coupled to the first surface of the insulating structure; and
wherein the second wiring layer extends through vias in the insulating substrate to electrically couple at least one contact pad of the passive component.
22. The electrical package of claim 21 wherein the electrical component and the passive component are fully encapsulated within the insulating structure.
23. The electrical package of claim 15 wherein the electrical component is fully encapsulated within the insulating structure.
24. The electronics package of claim 1 wherein the insulating structure is disposed only on the first surface of the insulating substrate.