IP Library Granted Patent US 10,804,249
Granted Patent B2
US 10,804,249 · App. 16/114,472 · Granted Oct 13, 2020

Light-emitting device with light-reflective and light-absorbing pieces layered on a surface

Inventor: Takeo Kurimoto (Anan, JP)
Assignee: NICHIA CORPORATION
H01L25/0753H01L33/10H01L33/36H01L33/44H01L33/46H01L33/62H01L33/486H01L33/56H01L33/60
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Quick Facts
Patent No.
US 10,804,249
App. No.
16/114,472
Granted
Oct 13, 2020
Kind
B2
Abstract

A light-emitting device includes: a light-emitting element that includes a light-transmissive substrate having a first surface and a second surface opposite to the first surface, a semiconductor layer on the first surface, and positive and negative electrodes on the semiconductor layer; a mounting board that includes wiring and a base supporting the wiring; one or more light-reflective pieces; and one or more light-absorbing pieces. The light-emitting element is flip-chip mounted on or above the wiring. The light-reflective layer and the light-absorbing layer cover part of the second surface and are layered in this order from the second surface.

Claims (108)

1. A light-emitting device comprising:

a light-emitting element comprising

a light-transmissive substrate having

a first surface, and

a second surface opposite to the first surface,

a semiconductor layer on the first surface, and

positive and negative electrodes on the semiconductor layer;

a mounting board comprising

wiring, and

a base supporting the wiring,

one or more light-reflective pieces, and

one or more light-absorbing pieces;

wherein the light-emitting element is flip-chip mounted on or above the wiring, and

wherein the one or more light-reflective pieces and the one or more light-absorbing pieces partially cover the second surface and are layered in this order from the second surface, wherein the one or more light-reflective pieces are disposed between the one or more light-absorbing pieces and the second surface.

2. The light-emitting device according to claim 1 , wherein a total area of the one or more light-reflective pieces and the one or more light-absorbing pieces is in a range of 10% to 60% of a total area of the second surface of the light-transmissive substrate.

3. The light-emitting device according to claim 1 , wherein the light-reflective layer comprises a resin layer comprising a light-reflective substance.

4. The light-emitting device according to claim 1 , wherein the light-reflective layer comprises a metal layer containing Al or Ag.

5. The light-emitting device according to claim 1 , wherein the one or more light-absorbing pieces comprise a resin layer comprising a black pigment or carbon black.

6. The light-emitting device according to claim 1 , wherein the one or more light-reflective pieces and the one or more light-absorbing pieces respectively have the same shapes.

7. The light-emitting device according to claim 1 , wherein the one or more light-reflective pieces and the one or more light-absorbing pieces respectively have circular planar shapes.

8. The light-emitting device according to claim 1 , wherein the one or more light-reflective pieces and the one or more light-absorbing pieces respectively have striped planar shapes.

9. The light-emitting device according to claim 1 , the light-emitting device further comprising an encapsulating member that covers the light-emitting element.

10. The light-emitting device according to claim 9 , wherein the encapsulating member comprises a silicone resin or an epoxy resin.

11. The light-emitting device according to claim 9 , wherein a surface of the encapsulating member has an irregularity.

12. A light-emitting device comprising:

a plurality of light-emitting elements, each of the light-emitting elements comprising

a light-transmissive substrate having

a first surface, and

a second surface opposite to the first surface,

a semiconductor layer on the first surface, and

positive and negative electrodes on the semiconductor layer;

a mounting board, comprising

wiring, and

a base supporting the wiring;

one or more light-reflective pieces; and

one or more light-absorbing pieces,

wherein the light-emitting elements are flip-chip mounted on or above the wiring,

wherein the light-emitting elements comprise

a first light-emitting element emitting light with a first wavelength,

a second light-emitting element emitting light with a second wavelength different from the first wavelength, and

a third light-emitting element emitting light with a third wavelength different from the first wavelength and the second wavelength, and

wherein the one or more light-reflective pieces and the one or more light-absorbing pieces cover part of at least one of the second surfaces and are layered in this order from the second surface.

13. The light-emitting device according to claim 12 , wherein:

the first light-emitting element comprises an element emitting red light,

the second light-emitting element comprises an element emitting green light, and

the third light-emitting element comprises an element emitting blue light.

14. The light-emitting device according to claim 12 , wherein the light-transmissive substrate of the first light-emitting element is free from the one or more light-reflective pieces and the one or more light-absorbing pieces on or above the light-transmissive substrate of the first light-emitting element.

15. The light-emitting device according to claim 12 , wherein planar shapes of the one or more light-reflective pieces and the one or more light-absorbing pieces differ between the first light-emitting element, the second light-emitting element, and the third light-emitting element.

16. A light-emitting device comprising:

a light-emitting element comprising

a light-transmissive substrate having

a first surface, and

a second surface opposite to the first surface,

a semiconductor layer on the first surface, and

positive and negative electrodes on the semiconductor layer;

a mounting board comprising

wiring, and

a base supporting the wiring,

one or more light-reflective pieces, and

one or more light-absorbing pieces;

wherein the light-emitting element is flip-chip mounted on or above the wiring,

wherein the one or more light-reflective pieces and the one or more light-absorbing pieces cover part of the second surface and are layered in this order from the second surface, and

wherein a total area of the one or more light-reflective pieces and the one or more light-absorbing pieces is in a range of 10% to 60% of a total area of the second surface of the light-transmissive substrate.

17. A light-emitting device comprising:

a light-emitting element comprising

a light-transmissive substrate having

a first surface, and

a second surface opposite to the first surface,

a semiconductor layer on the first surface, and

positive and negative electrodes on the semiconductor layer;

a mounting board comprising

wiring, and

a base supporting the wiring,

one or more light-reflective pieces, and

one or more light-absorbing pieces;

wherein the light-emitting element is flip-chip mounted on or above the wiring,

wherein the one or more light-reflective pieces and the one or more light-absorbing pieces cover part of the second surface and are layered in this order from the second surface, and

wherein the one or more light-absorbing pieces comprise a resin layer comprising a black pigment or carbon black.

18. A light-emitting device comprising:

a light-emitting element comprising

a light-transmissive substrate having

a first surface, and

a second surface opposite to the first surface,

a semiconductor layer on the first surface, and

positive and negative electrodes on the semiconductor layer;

a mounting board comprising

wiring, and

a base supporting the wiring,

one or more light-reflective pieces, and

one or more light-absorbing pieces;

wherein the light-emitting element is flip-chip mounted on or above the wiring,

wherein the one or more light-reflective pieces and the one or more light-absorbing pieces cover part of the second surface and are layered in this order from the second surface, and

wherein the one or more light-reflective pieces and the one or more light-absorbing pieces respectively have the same shapes.

19. A light-emitting device comprising:

a light-emitting element comprising

a light-transmissive substrate having

a first surface, and

a second surface opposite to the first surface,

a semiconductor layer on the first surface, and

positive and negative electrodes on the semiconductor layer;

a mounting board comprising

wiring, and

a base supporting the wiring,

one or more light-reflective pieces, and

one or more light-absorbing pieces;

wherein the light-emitting element is flip-chip mounted on or above the wiring,

wherein the one or more light-reflective pieces and the one or more light-absorbing pieces cover part of the second surface and are layered in this order from the second surface, and

wherein the one or more light-reflective pieces and the one or more light-absorbing pieces respectively have circular planar shapes.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2018
From: KURIMOTO, TAKEO
To: NICHIA CORPORATION
Reel/Frame 046723/0243 →
Priority Claims (1)
JP 2017-164222 · Aug 29, 2017 · national
Continuity (1)
Related Publication 20190067256A1 · Feb 28, 2019