Satellite communication transmitter with improved thermal management
A high efficiency satellite transmitter comprises an RF amplifier chip in thermal contact with a radiant cooling element via a heat conducting element. The RF amplifier chip comprises an active layer disposed on a high thermal conductivity substrate having a thermal conductivity greater than about 1000 W/mK, maximizing heat conduction out of the RF amplifier chip and ultimately into outer space when the chip is operating within a satellite under normal transmission conditions. In one embodiment, the active layer comprises materials selected from the group consisting of GaN, InGaN, AlGaN, and InGaAlN alloys. In one embodiment, the high thermal conductivity substrate comprises synthetic diamond.
1. A device, comprising a radiofrequency (RF) amplifier chip in thermal communication with a radiant cooling element, wherein the RF amplifier chip comprises an active layer disposed adjacent to a thermally conductive substrate separate from the radiant cooling element, wherein the thermally conductive substrate has a thermal conductivity greater than about 1000 W/mK, wherein:
(i) the RF amplifier chip is configured to conduct heat to the thermally conductive substrate,
(ii) the thermally conductive substrate is configured to conduct heat to the radiant cooling element, and
(iii) the radiant cooling element is configured to radiate heat out of the radiant cooling element.
2. The device of claim 1 , wherein the active layer comprises a two-dimensional electron gas layer positioned no further than 150 nanometers from the thermally conductive substrate.
3. The device of claim 1 , wherein the active layer comprises a Group III-V material.
4. The device of claim 3 , wherein the active layer comprises at least one material selected from the group consisting of GaN, InGaN, AlGaN, and InGaAlN.
5. The device of claim 1 , wherein the RF amplifier chip is configured to operate at a wavelength in a range from 1 gigahertz (GHz) to 300 GHz.
6. The device of claim 1 , wherein the thermally conductive substrate comprises diamond.
7. The device of claim 1 , wherein the thermally conductive substrate comprises carbon.
8. The device of claim 1 , wherein the RF amplifier chip is in thermal communication with the radiant cooling element via a heat conducting element.
9. A device, comprising a radiofrequency (RF) amplifier chip configured for thermal communication with a radiant element, wherein the RF amplifier chip comprises a first substrate comprising a first material disposed adjacent to a second substrate comprising a second material that is different than the first material, which second substrate is separate from the radiant element, wherein the second substrate has a thermal conductivity greater than about 1000 W/mK, and wherein (i) the first substrate is configured to conduct heat to the second substrate, and (ii) the second substrate is configured to conduct heat to the radiant element.
10. The device of claim 9 , wherein the active layer comprises a two-dimensional electron gas layer positioned no further than 150 nanometers from the thermally conductive substrate.
11. The device of claim 9 , wherein the active layer comprises a Group III-V material.
12. The device of claim 11 , wherein the active layer comprises at least one material selected from the group consisting of GaN, InGaN, AlGaN, and InGaAlN.
13. The device of claim 9 , wherein the RF amplifier chip is configured to operate at a wavelength in a range from 1 gigahertz (GHz) to 300 GHz.
14. The device of claim 9 , wherein the thermally conductive substrate comprises diamond.
15. The device of claim 9 , wherein the thermally conductive substrate comprises carbon.