IP Library › Granted Patent US 10,813,256
Granted Patent B2
US 10,813,256 · App. 16/537,670 · Granted Oct 20, 2020

External structure heat sink

Inventors: Kurt Held (Houston, TX); Nick Paul Krippner (Houston, TX); Kasey Herman (Houston, TX)
Assignee: Schlumberger Technology Corporation
H05K7/209H05K7/20909H05K7/20927
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Quick Facts
Patent No.
US 10,813,256
App. No.
16/537,670
Granted
Oct 20, 2020
Kind
B2
Abstract

Systems and methods for dissipating heat from an electrical component using an external structure of a trailer or shed as a heat sink are disclosed. A heat-producing electrical component such as a variable frequency drive (VFD) using an insulated-gate bipolar transistor (IGBT) is housed in a trailer and is thermally coupled to an exterior wall of the trailer to use the wall as a heat sink to dissipate heat from the VFD and IGBT. An adapter can be used to couple VFDs and IGBTs of different sizes and configurations to a support site on the exterior wall.

Claims (14)

1. A method, comprising:

providing a structure having an electrical component support site;

determining a configuration of heat-producing components of an electrical component;

providing at the electrical component support site on the structure an adapter with a plurality of panels, the adapter being configured to thermally couple an electrical component with the structure such that the structure serves as a heat sink for the electrical components;

arranging the panels to include heat exchangers in panels corresponding to the heat-producing components and blanks in panels not corresponding to the heat-producing components; and

coupling the electrical component to the structure via the adapter.

2. The method of claim 1 , further comprising operating the heat exchangers by running at least one of forced air or forced liquid through the heat exchangers.

3. The method of claim 1 , further comprising providing an external heat exchanger on an exterior surface of the structure.

4. The method of claim 1 , wherein the heat-producing components comprise an insulated-gate bipolar transistor.

5. The method of claim 1 , wherein the adapter has a first side configured to conform to a portion of a panel and a second side configured to conform to the heat sink.

6. The method of claim 1 , wherein the heat sink is a liquid-cooled heat exchanger.

7. The method of claim 1 , wherein the heat sink is an air-cooled heat exchanger.

8. The method of claim 1 , wherein at least one of the panels has an area that is at least twice as large as the rear face of the variable frequency drive.

9. The method of claim 1 , wherein the heat sink comprises a plurality of fins configured to passively transfer thermal energy.

Continuity (4)
Division 15664041 · Jul 31, 2017
Provisional Application 62370229 · Aug 2, 2016
Provisional Application 62368705 · Jul 29, 2016
Related Publication 20200100385A1 · Mar 26, 2020
Cited By (3)
US 12,237,674 US 12,392,225 US 12,494,669