Oxide sintered body and transparent conductive oxide film
An oxide sintered body containing indium, hafnium, tantalum, and oxygen as constituent elements, in which when indium, hafnium, and tantalum are designated as In, Hf, and Ta, respectively, the atomic ratio of Hf/(In+Hf+Ta) is equal to 0.002 to 0.030, and the atomic ratio of Ta/(In+Hf+Ta) is equal to 0.0002 to 0.013.
1. An oxide sintered body, comprising:
an oxide including indium, hafnium, tantalum, and oxygen as constituent elements,
wherein the oxide satisfies that an atomic ratio of Hf/(In+Hf+Ta) is equal to 0.002 to 0.030, and that an atomic ratio of Ta/(In+Hf+Ta) is equal to 0.0002 to 0.013, where In, Hf, and Ta are indium, hafnium, and tantalum, respectively.
2. The oxide sintered body according to claim 1 , wherein the oxide sintered body has a relative density of 97% or higher and an average crystal grain size of 8 μm or less.
3. The oxide sintered body according to claim 1 , wherein the oxide sintered body includes unavoidable impurities at a proportion of less than 1 at %.
4. A sputtering target, consisting of the oxide sintered body according to claim 1 .
5. A method for producing a transparent conductive oxide film, comprising:
conducting sputtering with the sputtering target according to claim 4 .
6. The oxide sintered body according to claim 1 , wherein the atomic ratio of Hf/(In+Hf+Ta) is equal to 0.005 to 0.025.
7. The oxide sintered body according to claim 1 , wherein the atomic ratio of Hf/(In+Hf+Ta) is equal to 0.007 to 0.021.
8. The oxide sintered body according to claim 1 , wherein the atomic ratio of Ta/(In+Hf+Ta) is equal to 0.001 to 0.010.
9. The oxide sintered body according to claim 1 , wherein the atomic ratio of Ta/(In+Hf+Ta) is equal to 0.003 to 0.010.
10. The oxide sintered body according to claim 1 , wherein the atomic ratio of Hf/(In+Hf+Ta) is equal to 0.005 to 0.025, and the atomic ratio of Ta/(In+Hf+Ta) is equal to 0.001 to 0.010.
11. The oxide sintered body according to claim 2 , wherein the average crystal grain size is 0.5 μm-6 μm.
12. The oxide sintered body according to claim 2 , wherein the average crystal grain size is 2 μm-6 μm.
13. A sputtering target, comprising:
the oxide sintered body according to claim 1 .
14. A method for producing a transparent conductive oxide film, comprising:
conducting sputtering with the sputtering target according to claim 13 .