Substrate apparatus and method of manufacturing the same
The present disclosure relates to a substrate apparatus and a method of manufacturing a substrate apparatus capable of improving a manufacturing quality and reliability of the substrate apparatus as an electronic device. By laminating a plurality of sheet-like substrates on which a wiring pattern is formed, an individual substrate in which internal wiring is formed is formed, and the individual substrate physically and electrically connects two substrates. The present disclosure is capable of being applied to the substrate apparatus.
1. A substrate apparatus, comprising:
a first substrate on which a first component is mountable; and
an individual substrate configured to electrically connect to the first substrate through a first surface of the individual substrate, wherein
a second component is mountable on a second surface of the individual substrate,
the first surface of the individual substrate is different from the second surface of the individual substrate,
the first component is different from the second component,
the individual substrate includes a first electrode at a corner of the individual substrate,
the first electrode is in contact with three surfaces of the individual substrate, and
the three surfaces of the individual substrate are connected at the corner.
2. The substrate apparatus according to claim 1 , wherein
the individual substrate is further configured to electrically connect the first substrate to a second substrate,
the second substrate is in contact with a third surface of the individual substrate, and
the first substrate is different from the second substrate.
3. The substrate apparatus according to claim 2 , wherein the second surface of the individual substrate is perpendicular to the first surface and the third surface.
4. The substrate apparatus according to claim 1 , wherein
the individual substrate has a rectangular shape,
each corner of the individual substrate includes a respective electrode of a plurality of electrodes,
the plurality of electrodes includes the first electrode, and
the first electrode is connected to a second electrode of the first substrate with solder.
5. The substrate apparatus according to claim 2 , wherein
the individual substrate comprises a plurality of sheet-like substrates, and
the plurality of sheet-like substrates is laminated in the individual substrate in a direction different from a direction of each of the first surface and the third surface.
6. The substrate apparatus according to claim 5 , wherein the plurality of sheet-like substrates is laminated perpendicularly to each of the first surface and the third surface.
7. The substrate apparatus according to claim 5 , wherein
each sheet-like substrate of the plurality of sheet-like substrates includes a respective wiring pattern of a first plurality of wiring patterns,
the plurality of sheet-like substrates is laminated perpendicularly to each of the first surface and the third surface,
the individual substrate includes an internal wiring,
the internal wiring includes the first plurality of wiring patterns,
the internal wiring in the individual substrate is perpendicular to a second plurality of wiring patterns, and
each of the first substrate and the second substrate includes the second plurality of wiring patterns.
8. A substrate apparatus, comprising:
a substrate on which a component is mountable; and
an individual substrate including:
a plurality of sheet-like substrates;
an external electrode on a front surface of a first sheet-like substrate of the plurality of sheet-like substrates;
a substrate connection electrode at a corner of the front surface of the first sheet-like substrate, wherein
the first sheet-like substrate is on a first surface of the individual substrate,
the individual substrate is configured to electrically connect to the substrate through a second surface of the individual substrate,
the first surface of the individual substrate is perpendicular to the second surface of the individual substrate,
the substrate connection electrode is configured to connect the first sheet-like substrate to the substrate; and
a wiring pattern on a front surface of a second sheet-like substrate of the plurality of sheet-like substrates, wherein
the external electrode is connected to the substrate connection electrode via the wiring pattern.