Display device and manufacturing method thereof
A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.
1. A display device, comprising:
a display panel;
a flexible circuit board, electrically connected with the display panel, and the flexible circuit board comprising a plurality of conductive wires, and a plurality of spacers, wherein the spacers and the conductive wires are disposed alternately, and a thickness of at least one of the spacers is greater than a thickness of at least one of the conductive wires adjacent to the at least one of the spacers;
an integrated circuit, disposed on the flexible circuit board, and the integrated circuit having a plurality of bumps; and
a conductive layer, disposed between the integrated circuit and the flexible circuit board, and the conductive layer comprising an adhesive and a plurality of conductive particles distributed in the adhesive, wherein the bumps are electrically connected with the conductive wires through the conductive particles,
wherein the flexible circuit board comprises a display panel bonding area, an integrated circuit bonding area, and a wiring area, and the wiring area is located at a side of the display panel bonding area and surrounds the integrated circuit bonding area, and
a thickness difference ΔH2 between the at least one of the spacers in the integrated circuit bonding area and at least one of the conductive wires adjacent to the at least one of the spacers satisfies a relation as follows: ¼h≤ΔH2≤½h, wherein h is a thickness of one of the bumps.
2. The display device as claimed in claim 1 , wherein a thickness of at least one of the conductive wires is less than or equal to 3 μm.
3. The display device as claimed in claim 1 , wherein the conductive wires extend from the integrated circuit bonding area to the display panel bonding area through the wiring area.
4. The display device as claimed in claim 1 , wherein at least one of the conductive wires comprises an integrated circuit pad and an extending portion connected with the integrated circuit pad, the integrated circuit pad is located in the integrated circuit bonding area, and a width of the integrated circuit pad is greater than a width of the extending portion, wherein the width of the integrated circuit pad is in a range from 3 μm to 20 μm, and the width of the extending portion is in a range from 1 μm to 7 μm.
5. The display device as claimed in claim 4 , wherein a plurality of conductive paths are separately located between at least one of the bumps and the integrated circuit pad is discontinuous.
6. The display device as claimed in claim 1 , wherein a thickness difference ΔH1 between the at least one of the spacers in the display panel bonding area and at least one of the conductive wires adjacent to the at least one of the spacers satisfies a formula as follows: ΔH1=R(1−X %), wherein R is a diameter of one of the conductive particles, X % is a particle size compression rate of one of the conductive particles, and X % is in a range from 30% to 70%.
7. The display device as claimed in claim 1 , wherein the flexible circuit board further comprises an insulating layer disposed in the wiring area, and the insulating layer covers the conductive wires.