IP Library Granted Patent US 10,820,437
Granted Patent B2
US 10,820,437 · App. 16/335,050 · Granted Oct 27, 2020

Flexible packaging for a wearable electronic device

Inventors: Aleksandar Aleksov (Chandler, AZ); Son V. Nguyen (Gilbert, AZ); Rajat Goyal (Chandler, AZ); David B. Lampner (Chandler, AZ); Dilan Seneviratne (Chandler, AZ); Albert S. Lopez (Tempe, AZ); Joshua D. Heppner (Chandler, AZ); Srinivas V. Pietambaram (Gilbert, AZ); Shawna M. Liff (Scottsdale, AZ); Nadine L. Dabby (Palo Alto, CA)
Assignee: Intel Corporation
H05K5/065G06F1/16G06F1/163G06F1/18H05K5/0086H05K5/0247G04G17/04
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Quick Facts
Patent No.
US 10,820,437
App. No.
16/335,050
Granted
Oct 27, 2020
Kind
B2
Abstract

The document discloses a stretchable packaging system for a wearable electronic device. The system includes a first electronic component and a flexible trace connected to the first electronic component. An elastomer layer having a variable thickness at least partially encapsulates the first electronic component and the flexible trace. A first region of the layer has a first thickness that is greater than a second thickness of a second region of the layer that at least partially encapsulates the trace.

Claims (9)

1. A stretchable packaging system for a wearable electronic device, comprising: a first electronic component, a second electronic component, a flexible interconnection comprising metal traces coated with a dielectric material and having a generally serpentine shape, connecting the first and second electronic components through an epoxy layer, and an elastomer layer having a variable thickness and at least partially encapsulating the first and second electronic components and the flexible interconnection, the elastomer chosen from, thermal plastic polyurethanes, butyl rubber, poly-dimethyl siloxanes, and latex, wherein a first region of the elastomer layer at least partially encapsulates the first electronic component and has a first thickness in a first direction from a top of the first electronic component that is greater than a second thickness of a second region of the elastomer layer that at least partially encapsulates the flexible interconnection in the first direction, and a third region of the elastomer layer that at least partially encapsulates the second electronic component has a third thickness in the first direction that is greater than the second thickness.

2. The system of claim 1 , and further comprising a third electronic component and a second flexible interconnection between the third electronic component and the second electronic component.

3. The system of claim 2 , wherein a fourth region of the elastomer at least partially encapsulates the second flexible inter connection and a fifth region of the elastomer at least partially encapsulates the third electronic component.

4. The system of claim 1 , wherein the first thickness ranges from about 1.5 to about 10 times greater than the thickness of the second thickness.

5. The system of claim 1 , wherein the thickness of each of the first, second, or third regions is variable within the respective region.

6. The system of claim 1 , wherein the second region is more stretchable than the first region or the third region.

7. The system of claim 1 , wherein the elastomer material is waterproof.

8. The system of claim 1 , wherein the elastomer material is substantially water resistant.

9. The system of claim 1 , wherein the flexible interconnection has a generally serpentine shape.

Continuity (1)
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Cited By (1)
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