IP Library › Granted Patent US 10,821,543
Granted Patent B2
US 10,821,543 · App. 16/075,260 · Granted Nov 3, 2020

Joint manufacturing method

Inventors: Nao Kamakura (Ibaraki, JP); Yuki Sugo (Ibaraki, JP); Satoshi Honda (Ibaraki, JP)
Assignee: NITTO DENKO CORPORATION
B23K20/16B22F3/14B22F7/08B23K20/026B23K35/0222B23K35/0238B23K35/0244B23K35/36B23K35/3612B23K35/3613B23K35/3618B32B15/00H01L24/29H01L24/83B22F2201/01B22F2201/02B22F2201/20B22F2999/00B23K35/38B23K2101/36B23K2101/40B23K2103/56B32B5/16B32B37/04B32B37/06B32B37/1009B32B37/24B32B2305/342B32B2305/80B32B2309/022B32B2309/125B32B2309/68B32B2311/04B32B2311/08B32B2311/12B32B2311/22H01L24/27H01L2224/27436H01L2224/29294H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/32225H01L2224/32227H01L2224/8309H01L2224/83065H01L2224/83075H01L2224/8384H01L2224/83191H01L2224/83204H01L2224/94H01L2224/97
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Quick Facts
Patent No.
US 10,821,543
App. No.
16/075,260
Granted
Nov 3, 2020
Kind
B2
Abstract

Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.

Claims (11)

1. A joint manufacturing method comprising:

a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined;

a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and

a step C of holding the temperature of the laminate in a predetermined range after the step B,

wherein

the laminate is pressurized during at least a part of the step B and during at least a part of the step C:

the first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement; and

when the step B and the step C are performed in air, the thermogravimetric measurement is performed in the air, and when the step B and the step C are performed in a nitrogen atmosphere, a reducing gas atmosphere or a vacuum atmosphere, the thermogravimetric measurement is performed in the nitrogen atmosphere.

2. The joint manufacturing method according to claim 1 , wherein the laminate is pressurized at 5 to 40 MPa.

3. The joint manufacturing method according to claim 1 , wherein the temperature held in the step C is in a range of 200° C. to 400° C.

4. The joint manufacturing method according to claim 1 , wherein the laminate is pressurized by a flip chip bonder or a parallel plate press.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2018
From: KAMAKURA, NAO; SUGO, YUKI; HONDA, SATOSHI
To: NITTO DENKO CORPORATION
Reel/Frame 046548/0574 →
Priority Claims (1)
JP 2016-052619 · Mar 16, 2016 · national
Continuity (1)
Related Publication 20190047081A1 · Feb 14, 2019