IP Library Granted Patent US 10,827,276
Granted Patent B2
US 10,827,276 · App. 16/528,690 · Granted Nov 3, 2020

Micro-speaker

Inventor: Bo Xiao (Shenzhen, CN)
Assignee: AAC Technologies Pte. Ltd.
H04R9/06H01F7/081H04R1/06H04R3/00H04R7/18H04R9/025H05K1/0277H05K1/111H05K1/181H04R7/127H04R2499/11H05K2201/10083
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Quick Facts
Patent No.
US 10,827,276
App. No.
16/528,690
Granted
Nov 3, 2020
Kind
B2
Abstract

A micro-speaker is provided, including: a vibration unit and a fixed unit. The vibration unit includes a diaphragm, a voice coil located below the diaphragm and driving the diaphragm to vibrate and emit sound, and a flexible circuit board connected to the voice coil. The diaphragm and the flexible circuit board are fixed to the fixed unit. The voice coil includes a body and a lead wire extending from the body. A pad is formed on the flexible circuit board, and includes a base and a plating layer formed on the base. The plating layer includes a first plating layer and a second plating layer extending from the first plating layer. The first plating layer has a greater thickness than the second plating layer. An end of the lead wire away from the body is welded to the pad and covered by the second plating layer.

Claims (20)

1. A micro-speaker, comprising:

a vibration unit; and

a fixed unit,

wherein the vibration unit comprises:

a diaphragm;

a voice coil located below the diaphragm and configured to drive the diaphragm to vibrate and emit sound; and

a flexible circuit board connected to the voice coil,

wherein the diaphragm and the flexible circuit board are fixed to the fixed unit, and the voice coil comprises a body and a lead wire extending from the body,

wherein a pad is formed on the flexible circuit board, the pad comprises a base and a plating layer formed on the base, the plating layer comprises a first plating layer and a second plating layer extending from the first plating layer, the first plating layer has a greater thickness than the second plating layer, an end of the lead wire away from the body is welded to the pad and covered by the second plating layer,

wherein the flexible circuit board is sandwiched between the voice coil and the diaphragm,

wherein the flexible circuit board comprises:

a first fixed portion fixed to the fixed unit;

a second fixed portion connected to the body; and

an elastic connection portion connecting the first fixed portion with the second fixed portion,

wherein the pad is formed on the second fixed portion, and

wherein each of the first fixed portion and the second fixed portion are in a ring structure, and the pad is located on a short axis side of the second fixed portion.

2. The micro-speaker as described in claim 1 , wherein the first plating layer is closer to the body than the second plating layer.

3. The micro-speaker as described in claim 1 , wherein orthographic projections of the first plating layer and the second plating layer on the base have equal areas.

4. The micro-speaker as described in claim 1 , wherein the first plating layer and the second plating layer are provided at a side of the base facing the voice coil.

5. The micro-speaker as described in claim 1 , wherein the fixed unit comprises a magnetic circuit unit and a holder having a receiving space and, the magnetic circuit unit and the vibration unit are received in the holder, the magnetic circuit unit comprises a yoke and a first magnet portion fixed to the yoke, the voice coil is wound around an outer circumference of the first magnet portion, the pad extends from the second fixed portion in a direction facing away from the first fixed portion, and the first magnet portion is recessed to form an avoiding portion corresponding to the pad.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 12, 2019
From: XIAO, BO
To: AAC TECHNOLOGIES PTE. LTD.
Reel/Frame 050020/0434 →
Priority Claims (1)
CN 2018 2 1277880 U · Aug 8, 2018 · national
Continuity (1)
Related Publication 20200053476A1 · Feb 13, 2020