IP Library Granted Patent US 10,827,618
Granted Patent B2
US 10,827,618 · App. 16/496,853 · Granted Nov 3, 2020

Electronic device comprising an audio channel assembly

Inventor: Jouni Tapio Mäki (Helsinki, FI)
Assignee: HUAWEI TECHNOLOGIES CO., LTD.
H05K1/184H05K3/3478H05K2201/10083
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Quick Facts
Patent No.
US 10,827,618
App. No.
16/496,853
Granted
Nov 3, 2020
Kind
B2
Abstract

An electronic device comprises a housing comprising an audio opening, a Printed Circuit Board (PCB) arranged inside the housing, a microphone mounted on the PCB, and an audio channel assembly. The audio channel assembly comprises a first opening coupled to the audio opening, and a second opening coupled to an input of the microphone, wherein an audio channel is formed between the first opening and the second opening. The audio channel assembly is mounted on the PCB using a soldering part.

Claims (28)

1. An electronic device, comprising:

a one-piece housing comprising an audio opening;

a printed circuit board (PCB) inside the housing;

a microphone mounted on the PCB, wherein the PCB comprises a through hole in communication with a microphone input; and

an audio channel assembly comprising:

a first opening coupled to the audio opening;

a top surface comprising a second opening, wherein the second opening is in communication with the through hole, wherein an audio channel is defined between the first opening and the second opening, and wherein the top surface comprises solderable material; and

a lip coupled to the audio opening and enclosing the first opening; and

a soldering part comprising the top surface, wherein solder affixes the soldering part to the PCB.

2. The electronic device of claim 1 , wherein audio channel assembly comprises a single solderable material.

3. The electronic device of claim 1 , wherein the soldering part surrounds the second opening.

4. The electronic device of claim 1 , wherein the microphone is mounted on a first side of the PCB, and wherein the audio channel assembly is mounted on an opposing second side of the PCB.

5. The electronic device of claim 4 , wherein a portion of the audio channel assembly is non-solderable material.

6. The electronic device of claim 1 , wherein the audio opening extends in a first plane, and wherein the PCB extends in a second plane perpendicular to the first plane.

7. The electronic device of claim 6 , wherein a first section of the audio channel extends parallel to the second plane, and wherein a second section of the audio channel extends parallel to the first plane.

8. The electronic device of claim 7 , wherein the first section and the second section are joined perpendicular to each other.

9. The electronic device of claim 7 , wherein the first section comprises the first opening, and wherein the second section comprises the second opening.

10. The electronic device of claim 1 , further comprising a dust protection between the audio opening and the first opening.

11. The electronic device of claim 10 , wherein the dust protection is attached to the lip.

12. The electronic device of claim 1 , further comprising a moisture net between the audio opening and the first opening.

13. The electronic device of claim 12 , wherein the moisture net is attached to the lip.

14. The electronic device of claim 1 , further comprising an audio sealing between the audio opening and the first opening.

15. The electronic device of claim 14 , wherein the audio sealing is attached to the lip.

16. The electronic device of claim 1 , wherein the audio channel assembly comprises a duct coupling the first opening and the second opening.

17. The electronic device of claim 1 , wherein a first surface of the audio channel assembly comprises metal.

18. The electronic device of claim 1 , wherein a second surface of the audio channel assembly comprises metal.

19. The electronic device of claim 1 , wherein a second surface of the audio channel assembly comprises ceramic.

20. The electronic device of claim 1 , wherein a second surface of the audio channel assembly comprises plastic.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2019
From: MAKI, JOUNI TAPIO
To: HUAWEI TECHNOLOGIES CO., LTD.
Reel/Frame 050863/0598 →
Continuity (1)
Related Publication 20200107446A1 · Apr 2, 2020
Cited By (1)
US 12,407,969