Dry-etching of carrier substrate for microLED microassembly
A method of placing light emitting diodes (LEDs) includes embedding an array of LEDs in a polymer layer on a substrate. The method includes detaching at least one LED in the array of LEDs from the substrate by dry-etching the polymer layer in which at least one LED is embedded. A pick-up-tool (PUT) is brought into contact with at least one surface of at least one LED facing away from the substrate, responsive to dry-etching the polymer layer. The PUT is lifted with the at least one LED attached to the PUT.
1. A method of transferring light emitting diodes (LEDs) comprising:
embedding an array of LEDs in a polymer layer on a top flat surface of a flat substrate with electrodes of the LEDs protruding from surfaces of bodies of the LEDs facing towards the flat substrate and protruding through the polymer layer, the electrodes of the LEDs between the bodies of the LEDs and the flat substrate, and the polymer layer directly contacting the array of LEDs and the flat substrate; and
detaching at least one LED in the array of LEDs from the flat substrate by:
dry-etching the polymer layer in which the at least one LED is embedded,
bringing a pick-up-tool (PUT) into contact with at least one surface of the at least one LED facing away from the flat substrate responsive to dry-etching the polymer layer, and
lifting the PUT with the at least one LED attached to the PUT to detach the electrodes of the LEDs from the flat substrate.
2. The method of claim 1 , wherein dry-etching the polymer layer in which the at least one LED is embedded comprises oxygen etching.
3. The method of claim 1 , wherein the array of LEDs is an array of μLEDs.
4. The method of claim 1 , wherein the polymer layer on the flat substrate is at a temperature below a glass transition temperature of the polymer layer during the dry-etching.
5. The method of claim 4 , wherein the polymer layer on the flat substrate is at room temperature during the dry-etching.
6. The method of claim 1 , further comprising, prior to bringing the PUT into contact with at least one surface of the at least one LED facing away from the flat substrate, plasma cleaning the array of LEDs in the polymer layer on the flat substrate.
7. The method of claim 6 , wherein plasma cleaning the array of LEDs in the polymer layer on the flat substrate is a radio frequency (RF) oxygen plasma cleaning.
8. The method of claim 1 , wherein the lifting of the PUT with the at least one LED attached to the PUT comprises:
forming a Van der Waals interaction between the PUT and the at least one surface of the at least one LED facing away from the flat substrate.
9. The method of claim 1 , wherein the flat substrate is glass.
10. A non-transitory computer-readable storage medium storing processor executable instructions, the instructions comprising instructions for:
embedding an array of LEDs in a polymer layer on a top flat surface of a flat substrate with electrodes of the LEDs protruding from surfaces of bodies of the LEDs facing towards the flat substrate and protruding through the polymer layer, the electrodes of the LEDs between the bodies of the LEDs and the flat substrate, and the polymer layer directly contacting the array of LEDs and the flat substrate; and
detaching at least one LED in the array of LEDs from the flat substrate by:
dry-etching the polymer layer in which the at least one LED is embedded,
bringing a pick-up-tool (PUT) into contact with at least one surface of the at least one LED facing away from the flat substrate responsive to dry-etching the polymer layer, and
lifting the PUT with the at least one LED attached to the PUT to detach the electrodes of the LEDs from the flat substrate.
11. The computer readable medium of claim 10 , wherein dry-etching the polymer layer in which the at least one LED is embedded comprises oxygen etching.
12. The computer readable medium of claim 10 , wherein a sub-layer of the polymer layer remains on the flat substrate following dry-etching the polymer layer in which the at least one LED is embedded.
13. The computer readable medium of claim 10 , wherein the polymer layer on the flat substrate is at a temperature below a glass transition temperature of the polymer layer.
14. The computer readable medium of claim 13 , wherein the polymer layer on the flat substrate is at room temperature.
15. The computer readable medium of claim 10 , further comprising, prior to bringing the PUT into contact with at least one surface of the at least one LED facing away from the flat substrate, plasma cleaning the array of LEDs in the polymer layer on the flat substrate.
16. The computer readable medium of claim 15 , wherein plasma cleaning the array of LEDs in the polymer layer on the flat substrate is a radio frequency (RF) oxygen plasma cleaning.
17. The computer readable medium of claim 10 , wherein the lifting the PUT with the at least one LED attached to the PUT comprises:
forming a Van der Waals interaction between the PUT and the at least one surface of the at least one LED facing away from the flat substrate.