Module for removing misassembled semiconductor light-emitting element, and method using same to remove misassembled semiconductor light-emitting element
A removal module for removing a mis-assembled semiconductor light emitting diode includes a housing having an inner space formed by an upper plate having a nozzle hole and a lower plate spaced apart from the upper plate; a fluid supply part configured to supply a fluid outside the housing to the inner space; and a fluid control part configured to control spray of the fluid supplied to the inner space through the nozzle hole by adjusting a pressure of the inner space.
1. A removal module for removing a mis-assembled semiconductor light emitting diode (LED), comprising:
a housing having an inner space defined between an upper plate with a nozzle hole and a lower plate spaced apart from the upper plate;
a channel configured to supply a fluid from outside the housing to the inner space; and
a fluid control part comprising a metal thin-film resistor as a heating element or a piezoelectric element, the fluid control part configured to control a spray of the supplied fluid through the nozzle hole and against gravity towards the mis-assembled semiconductor LED by adjusting a pressure of the inner space,
wherein the removal module is provided in a chamber having the fluid in which semiconductor LEDs are made via self-assembly with respect to an assembly board, and
wherein the channel is further configured to supply the fluid accommodated in the chamber to the inner space.
2. The removal module of claim 1 , wherein the fluid control part comprises the metal thin-film resistor to heat the inner space.
3. The removal module of claim 2 , wherein the heating element is disposed at at least a first region of the lower plate, and wherein the first region comprises a region overlapping the nozzle hole.
4. The removal module according to claim 1 , wherein the fluid control part comprises the piezoelectric element configured to apply vibration to the inner space according to an application of a pulse.
5. The removal module according to claim 4 , wherein the piezoelectric element is disposed at at least a first region of the lower plate, and wherein the first region comprises a region overlapping the nozzle hole.
6. The removal module according to claim 4 , wherein at least one of an intensity of the pulse applied to the piezoelectric element or an application time of the pulse for controlling an amount of the fluid injected through the nozzle hole is controlled.
7. The removal module of claim 1 , wherein the channel further comprises a filtration filter configured to filter out foreign substances in the fluid supplied to the inner space from the chamber.
8. The removal module of claim 1 , further comprising:
a motor configured to move the housing to correspond to a position of a semiconductor LED mis-assembled on the assembly board.