Integrated circuit package including inward bent leads

1. A packaged semiconductor device, comprising:

a semiconductor die having top side bond pads mounted on a leadframe;

a housing for the semiconductor die with a bottom surface and a top surface defining a horizontal plane and a horizontal direction, including a first sidewall and at least a second sidewall opposite the first sidewall between the bottom surface and the top surface;

wherein the leadframe comprises:

a plurality of leads each having an inner lead portion inside the housing and an outer lead portion that includes a first portion that extends out in the horizontal direction from one of the first and the second sidewalls, a transition portion that includes a vertical direction component, and a distal end portion, wherein the distal end portion of the plurality of leads are all on the horizontal plane; and

wherein the outer lead portions alternate between a gull wing lead shape having the distal end portions extending in the horizontal direction outward from the housing and inward extending leads that have the distal end portions extending in the horizontal direction inward toward the housing and completely below the bottom surface.

2. The packaged semiconductor device of claim 1 , wherein at least one of the distal end portions of the inward extending leads are connected together on each side of the housing.

3. The packaged semiconductor device of claim 1 , wherein the distal end portions extend over at least a portion of the bottom surface.

4. The packaged semiconductor device of claim 1 , wherein the semiconductor die is mounted on the plurality of leads in a flipchip on lead (FCOL) configuration.

5. The packaged semiconductor device of claim 1 , wherein the housing comprises a molded housing.

6. The packaged semiconductor device of claim 1 , wherein the bond pads of the semiconductor die are flipchip attached to the inner lead portions.

7. The packaged semiconductor device of claim 1 , wherein the leadframe further comprises a die pad, and wherein the semiconductor die is mounted with its top side up on the die pad, further comprising bond wires between the bond pads and the inner lead portions.

8. The packaged semiconductor device of claim 1 , wherein the inward extending leads are C-shaped or J-shaped.

9. The packaged semiconductor device of claim 1 , wherein a bottom surface of the distal end portion are all within a fixed distance ±0.1 mm measured from the bottom surface of the housing.

10. A leadframe configured for a packaged semiconductor device including a semiconductor die that includes a housing having a first sidewall and at least a second sidewall opposite the first sidewall with at least one semiconductor die having top side bond pads therein, comprising:

a plurality of leads each having an inner lead portion inside the housing and an outer lead portion that includes a first portion that extends out in a horizontal direction from one of the first and the second sidewalls, a transition portion that includes a vertical direction component, and a distal end portion, wherein the distal end portion of the plurality of leads are all on a horizontal plane; and

wherein the outer lead portions alternate between a gull wing lead shape having the distal end portions extending in the horizontal direction outward from the housing and inward extending leads that have the distal end portions extending in the horizontal direction inward toward the housing and completely below the bottom surface.

11. The leadframe of claim 10 , wherein at least one of the distal end portions of the inward extending leads are connected together on each side of the housing.

12. The leadframe of claim 10 , wherein the distal end portions extend under the housing.

13. The leadframe of claim 10 , wherein the bond pads of the semiconductor die are flipchip attached to the inner lead portions.

14. The leadframe of claim 10 , wherein the leadframe further comprises a die pad, and wherein the semiconductor die is mounted with its top side up on the die pad, further comprising bond wires between the bond pads and the inner lead portions.

15. The leadframe of claim 10 , wherein the inward extending leads are C-shaped or J-shaped.

16. The leadframe of claim 10 , wherein a bottom surface of the distal end portion are all within a fixed distance ±0.1 mm measured from the bottom surface of the housing.

17. A packaged semiconductor device, comprising:

a semiconductor die having top side bond pads mounted on a leadframe having a plurality of leads each having an inner lead portion inside a housing for the semiconductor die with a bottom surface and a top surface defining a horizontal plane and a horizontal direction, including a first sidewall and at least a second sidewall opposite the first sidewall between the bottom surface and the top surface;

distal lead portions of the plurality of leads to alternately form a gull wing lead shape and an inward extending lead that has a distal end bent inward toward the housing and completely below the bottom surface; and

wherein a distal end portion of the plurality of leads are all on the horizontal plane.

18. The packaged semiconductor device of claim 17 , wherein the inward extending leads are C-shaped.

19. The packaged semiconductor device of claim 17 , wherein the inward extending leads are J-shaped.

20. The packaged semiconductor device of claim 17 , further comprising the plurality of leads connected to land pads of a printed circuit board (PCB) that are in a staggered configuration.