Film package, chip-on-film package, and package module
Disclosed are film packages, chip-on-film packages, and package modules. The film package including a film substrate having a first surface and a second surface facing each other, a plurality of output patterns on the film substrate and each including a first chip pad and an output pads electrically connected to the first chip pad and spaced apart in a first direction from the first chip pad, and a plurality of input patterns on the film substrate and each including a second chip pad adjacent to the first chip pad corresponding thereto and an input pad electrically connected to the second chip pad and spaced apart in the first direction from the second chip pad may be provided. At least portions of the output patterns overlap the input patterns across the film substrate.
1. A film substrate structure for a display device comprising:
a film substrate including a first surface and a second surface opposite to the first surface;
an output pattern on at least one of the first surface or the second surface of the film substrate, the output pattern including a first chip pad portion and an output pad portion, the output pad portion electrically connected to the first chip pad portion and spaced apart from the first chip pad portion in a first direction, the output pad portion configured to be connected to and overlap the display device; and
an input pattern on at least one of the first surface or the second surface of the film substrate, the input pattern including a second chip pad portion and an input pad portion, the input pad portion electrically connected to the second chip pad portion and spaced apart from the second chip pad portion in the first direction, the output pattern vertically overlapping the input pattern with respect to the film substrate, the first chip pad portion and the second chip pad portion configured to be connected to a driver IC chip,
wherein the output pad portion, the input pad portion and the first and second chip pad portions are sequentially disposed along the film substrate.
2. The film substrate structure of claim 1 , wherein
the film substrate includes a first edge and a second edge opposite to the first edge in the first direction, and
the first chip pad portion and the second chip pad portion are adjacent to the first edge.
3. The film substrate structure of claim 2 , wherein
the output pad portion is adjacent to the second edge of the film substrate, and
the input pad portion is horizontally between the output pad portion and the second chip pad portion.
4. The film substrate structure of claim 3 , wherein
the output pad portion is on the first surface of the film substrate, and
the input pad portion is on the second surface of the film substrate.
5. The film substrate structure of claim 4 , wherein the first chip pad portion and the second chip pad portion are on the first surface of the film substrate.
6. The film substrate structure of claim 5 , wherein the input pattern further includes a conductive via portion penetrating the film substrate and a input line portion on the second surface of the film substrate, the conductive via portion and the input line portion electrically connecting the input pad portion on the second surface of the film substrate to the second chip pad portion on the first surface of the film substrate.
7. The film substrate structure of claim 4 , wherein the first chip pad portion and the second chip pad portion are on the second surface of the film substrate.
8. The film substrate structure of claim 7 , wherein the output pattern further includes a conductive via portion penetrating the film substrate and an output line portion on the first surface of the film substrate, the conductive via portion and the output line portion electrically connecting the output pad portion on the first surface of the film substrate to the first chip pad portion on the second surface of the film substrate.
9. The film substrate structure of claim 3 , wherein
the output pad portion and the first chip pad portion of the output pattern and the input pad portion and the second chip pad portion of the input pattern are on the first surface of the film substrate, and
the output pattern further includes a first via conductive portion penetrating the film substrate, an output line portion on the second surface of the film substrate, a second via conductive portion penetrating the film substrate, the first via conductive portion connecting a first edge region of the output line portion to the output pad portion, the second via conductive portion connecting a second edge region of the output line portion to the first chip pad portion, the second edge region of the output line portion being opposite to the first edge region of the output line portion.
10. The film substrate structure of claim 1 , wherein
the output pattern further includes an output line portion on one of the first surface or the second surface of the film substrate, the output line portion electrically connecting the output pad portion to the first chip pad portion,
the input pattern further includes an input line portion on the other one of the first surface or the second surface of the film substrate, the input line portion electrically connecting the input pad portion to the second chip pad portion, and
the output line portion vertically overlaps the input line portion with respect to the film substrate.
11. The film substrate structure of claim 1 , wherein the film substrate further includes an insulating layer and a conductive shielding layer embedded therein and configured to prevent signal interference between the output pattern and the input pattern.
12. The film substrate structure of claim 1 , further comprising:
a bypass pattern on the film substrate, the bypass pattern including a first bypass pad portion at a side of the output pad portion, a second bypass pad portion at a side of the input pad portion, and a bypass line portion electrically connecting the first bypass pad portion to the second bypass pad portion.
13. A chip on film package for a display device comprising:
a carrier film substrate including,
a film substrate including a first surface and a second surface opposite to the first surface,
an output pattern on at least one of the first surface or the second surface of the film substrate and extending in a first direction, the output pattern including a first chip pad portion, an output pad portion spaced apart from the first chip pad portion in the first direction, and an output line portion directly connecting the output pad portion to the first chip pad portion, the output pad portion configured to be connected to the display device, and
an input pattern on at least one of the first surface or the second surface of the film substrate, the input pattern including a second chip pad portion and an input pad portion, the input pad portion electrically connected to the second chip pad portion and spaced apart from the second chip pad portion in the first direction, the output pattern vertically overlapping the input pattern with respect to the film substrate; and
a driver IC chip electrically connected to the first chip pad portion and the second chip pad portion.
14. The chip on film package of claim 13 , wherein
the film substrate includes a first edge and a second edge opposite to the first edge in the first direction,
the driver IC chip is adjacent to the first edge of the film substrate, and
the output pad portion and the input pad portion are horizontally between the driver IC chip and the second edge of the film substrate.
15. The chip on film package of claim 13 , wherein a distance between the driver IC chip and the output pad portion is greater than a distance between the driver IC chip and the input pad portion.
16. The chip on film package of claim 13 , wherein
the output pad portion is on the first surface of the film substrate, and
the input pad portion is on the second surface of the film substrate.
17. The chip on film package of claim 13 , wherein the output pad portion and the input pad portion are on the first surface of the film substrate.
18. The chip on package of claim 13 , wherein
the input pattern further includes an input line portion on the other one of the first surface or the second surface of the film substrate, the input line portion electrically connecting the input pad portion to the second chip pad portion, and
the output line portion vertically overlaps the input line portion with respect to the film substrate.
19. The chip on film package of claim 13 , wherein the film substrate further includes an insulating layer and a conductive shielding layer embedded therein and configured to prevent signal interference between the output pattern and the input pattern.
20. The film substrate structure of claim 1 , wherein
the input pad portion overlaps a circuit board, and
the first and second chip pad portions overlap the driver IC chip.