Semiconductor device, solid-state imaging device and electronic apparatus
A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further including a photodiode, a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together, a third semiconductor section including a third wiring layer at one side thereof, the second and the third semiconductor sections being secured together such the first semiconductor section, second semiconductor section, and the third semiconductor section are stacked together, and a first conductive material electrically connecting at least two of (i) the first wiring layer, (ii) the second wiring layer, and (iii) the third wiring layer such that the electrically connected wiring layers are in electrical communication.
1. A light detecting device, comprising:
a first section including a first wiring layer; and
a second section including a second wiring layer and a third wiring layer;
a third section including a fourth wiring layer,
wherein the first section, the second section and the third section are stacked such that the first wiring layer and the second wiring layer face each other, and the third wiring layer and the fourth wiring layer face each other,
wherein the first section and the second section are electrically connected to each other through a first connection portion,
wherein the second section and the third section are electrically connected to each other through a second connection portion, and
wherein a wiring for external connection is disposed in the second wiring layer.
2. The light detecting device of claim 1 , wherein the first section includes a plurality of photodiodes, and at least one of a transfer transistor, a reset transistor, or an amplification transistor.
3. The light detecting device of claim 1 , wherein the second section includes a plurality of transistors.
4. The light detecting device of claim 1 , wherein the second wiring layer and the third wiring layer are disposed on opposite surface sides.
5. The light detecting device of claim 1 , wherein the third section includes a plurality of transistors.
6. The light detecting device of claim 1 , wherein a hole is formed that penetrates through the first section from a light incident surface side and reaches the wiring.
7. The light detecting device of claim 1 , wherein the first connection portion is electrically connected to the first section and the second section.
8. The light detecting device of claim 1 , wherein the first connection portion is electrically connected to the second connection portion.
9. The light detecting device of claim 1 , wherein the first connection portion is disposed at a region other than a pixel region including a plurality of photodiodes.
10. The light detecting device of claim 1 , wherein the second connection portion is electrically connected to the second section and the third section.
11. The light detecting device of claim 1 , wherein the second section includes a logic circuit.
12. The light detecting device of claim 11 , wherein the third section includes a memory circuit.
13. The light detecting device of claim 12 , wherein the logic circuit and the memory circuit are respectively operated based on input and output of signals with an external device.
14. The light detecting device of claim 13 , wherein input and output of signals with the external device are performed via the wiring.
15. An electronic apparatus, comprising:
an optical unit including a lens group; and
a light detecting device receiving incident light, the light detecting device including:
a first section including a first wiring layer,
a second section including a second wiring layer and a third wiring layer, and
a third section including a fourth wiring layer,
wherein the first section, the second section and the third section are stacked such that the first wiring layer and the second wiring layer face each other, and the third wiring layer and the fourth wiring layer face each other,
wherein the first section and the second section are electrically connected to each other through a first connection portion,
wherein the second section and the third section are electrically connected to each other through a second connection portion, and
wherein a wiring for external connection disposed in the second wiring layer.
16. An imaging device, comprising:
a first section including a first wiring layer at a first side of the first section and a first semiconductor substrate at a second side opposite to the first side of the first section, the first semiconductor substrate including a plurality of photodiodes;
a second section including a second wiring layer at a first side thereof, a second semiconductor substrate including a plurality of transistors, and a third wiring layer at a second side opposite to the first side of the second section; and
a third section including a fourth wiring layer at a first side thereof and a third semiconductor substrate at a second side opposite to the first side of the third section, the third semiconductor substrate including a plurality of transistors, wherein the first and second sections are secured together such that the first wiring layer and the second wiring layer are facing each other,
wherein a wiring in the second wiring layer is formed such that the wiring is in electrical communication with an external wiring through a hole penetrating through the first section from the first side and reaching the wiring in the second wiring layer, and
wherein a connection portion electrically connects at least two of (i) the first wiring layer, (ii) the second wiring layer, and (iii) the third wiring layer such that the electrically connected wiring layers are in electrical communication.
17. The imaging device according to claim 16 , wherein the connection portion includes a first connection portion that electrically connects the first wiring layer and the second wiring layer.
18. The imaging device according to claim 17 , wherein the connection portion includes a second connection portion that electrically connects the second wiring layer to the third wiring layer.
19. The imaging device according to claim 16 , wherein the second section includes a logic circuit.
20. The imaging device according to claim 19 , wherein the third section includes a memory circuit.
21. The imaging device according to claim 16 , wherein the third section includes a memory circuit.